Results 171 to 180 of about 111,474 (320)
Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging
Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek+4 more
wiley +1 more source
VIII Ukrainian-Polish and III East-European Meeting on Ferroelectrics Physics (September 4--7, 2006, Lviv, Ukraine) [PDF]
This issue contains Proceedings of the VIII Ukrainian-Polish and III East-European Meeting on Ferroelectrics Physics (Ukr-Pol 8) held in Lviv on September 4-7, 2006.
doaj
Silicon‐Integrated Next‐Generation Plasmonic Devices for Energy‐Efficient Semiconductor Applications
Silicon (Si)‐integrated plasmonics offer a pathway to next‐generation, energy‐efficient semiconductor applications. This review highlights advances using complementary metal–oxide–semiconductor (CMOS)‐compatible materials like transparent conductive oxides and novel architectures, particularly coupled hybrid plasmonic waveguides (CHPWs).
Nasir Alfaraj, Amr S. Helmy
wiley +1 more source
This study investigates the impact of the oxidation state of the WOX interfacial layer (IL) on its conductance and the associated voltage drop, aiming to mitigate fatigue and imprint in HZO‐based devices. As a result, through scaling the ferroelectric layer and engineering ILs, reduced wake‐up, functional operation exceeding 1011 cycles, and data ...
Mostafa Habibi+9 more
wiley +1 more source
Two-Sublattice Model of Ferroelectric Phase Transitions [PDF]
Vladimír Dvoák, Yoshihiro Ishibashi
openalex +1 more source
The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz+5 more
wiley +1 more source
Bernoulli Principle in Ferroelectrics. [PDF]
Razumnaya A+4 more
europepmc +1 more source
Mechanism of the Ferroelectric Phase Transition in K4[Fe(CN)6]·3H2O and K4[Fe(CN)6]·3D2O [PDF]
Masaharu Oguni+3 more
openalex +1 more source
Toward Advancement of Fabrication Techniques of Neuromorphic Computing Devices Based on 2D Materials
This review highlights emerging fabrication techniques of 2D material‐based neuromorphic devices, emphasizing proximity vapor transfer for bioinspired optoelectronic applications. Abstract The growing necessity for power‐efficient and cognitive computation mechanisms has driven progress in neuromorphic computing which seeks to imitate the synaptic ...
Shubham Umeshkumar Gupta+7 more
wiley +1 more source