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Microstructure and bonding mechanism of Al/Ti bonded joint using Al–10Si–1Mg filler metal
The microstructures and liquid state diffusion bonding mechanism of cp-Ti to 1050 At using an Al-10.0wt.%Si-1.0wt.%Mg filler metal with 100 mum in thickness have been investigated at 620 degreesC under 1 X 10(-4) Torr.
Soon H. Hong
exaly +2 more sources
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