Results 201 to 210 of about 15,116 (231)

Flip-chip BGA applied high-density organic substrate

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299), 2003
In the area of high-end logic devices, high pin counts, high speed and high thermal dissipation are strongly required for packages. A Flip-Chip BGA (FC-BGA) has been developed for such requirements. The FC-BGA has successfully realized up to 1681 pin counts and lower crosstalk noise, by using a high-density organic substrate with the 30 /spl mu/m/30 ...
S. Baba, null Qiang Wu, E. Hayashi, M. Watanabe, H. Matsushima, Y. Tomita, Y. Takemoto   +6 more
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Flip chip soldering and adhesive bonding on organic substrates

Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium, 1995
Flip chip interconnections to organic substrates were realized using different techniques: soldering using mechanical solder ball bumps and adhesive bonding with isotropic conductive adhesive. Both approaches use an electrolessly deposited nickel-gold under bump metallization.
E. Jung, R. Aschenbrenner, A. Ostmann, E. Zakel, H. Reichl   +4 more
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Reliability of flip chip BGA package on organic substrate

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2002
In this paper various reliability issues of the flip chip package on organic substrate, such as the 1st level bump joint reliability, die cracking, underfill cracking, and 2nd level solder ball joint reliabilty, are primarily described. This paper discusses the reasons and resolutions of failures.
null Eun-Chul Ahn, null Tae-Je Cho, null Jong-Bo Shin, null Ho-Joong Moon, null Ju-Hyun Lyu, null Ki-Won Choi, null Sa-Yoon Kang, null Se-Yong Oh   +7 more
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Challenges of flip chip on organic substrate assembly technology

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299), 2003
Flip chip assembly on organic substrate technology has been developed and implemented as a key packaging technology for Intel's microprocessors for cost and performance advantages. In this paper, the process flow, key technology challenges and accomplishments achieved will be addressed.
V.K. Nagesh, R. Peddada, S. Ramalingam, B. Sur, A. Tai   +4 more
openaire   +1 more source

Materials and mechanics issues in flip-chip organic packaging

1996 Proceedings 46th Electronic Components and Technology Conference, 2002
The strength of flip chip organic packaging technology rests upon the knowledge and manufacturing base of C4 solder bump chip interconnection, and printed circuit technology infrastructure. The key innovation was the underfill encapsulation between the chip and the laminate which overcame the road-block of low cycle fatigue of C4 solder bump due to ...
T.Y. Wu, Y. Tsukada, W.T. Chen
openaire   +1 more source

Low cost flip chip technology for organic substrates

1997 Proceedings 47th Electronic Components and Technology Conference, 2002
This paper describes outline of the flip chip technology which is used on various kind of substrates (glass-epoxy, flexible Printed Circuit Board, and MCM-L/D). In this technology, Au bumps are formed on the chip I/O pads by wire bonding method, and the bumps are pressed against the substrate pads. The chip is bonded and encapsuled with a thermosetting
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Resonance‐Activated Spin‐Flipping for Efficient Organic Ultralong Room‐Temperature Phosphorescence

Advanced Materials, 2018
AbstractTriplet‐excited‐state‐involved photonic and electronic properties have attracted tremendous attention for next‐generation technologies. To populate triplet states, facile intersystem crossing (ISC) for efficient exciton spin‐flipping is crucial, but it remains challenging in organic molecules free of heavy atoms.
Ye Tao, Runfeng Chen, Huanhuan Li, Jie Yuan, Yifang Wan, He Jiang, Cailin Chen, Yubing Si, Chao Zheng, Baocheng Yang, Guichuan Xing, Wei Huang   +11 more
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Low Expansivity Organic Substrate for Flip-Chip Bonding

IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1979
Organic substrate materials with thermal expansion coefficients (TEC) approaching that of silicon have been fabricated with laminate composites using DuPont's Kevlar® fiber. When combined with controlled-collapse solder chip joining technology, chip-to-substrate interconnections are essentially free of fatigue failure caused by thermal cycling.
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Organic Chip Scale Package (CSP) Development for Flip Chip Applications

International Symposium on Microelectronics, 2013
This paper describes a Chip Scale Package (CSP) development project and evaluation of the corresponding organic laminate material. Chip scale packaging can combine the strengths of various packaging technologies, such as the large size and performance advantages of a bare die assembly and the reliability of encapsulated devices. Optimizing the laminate
Tomoyuki Yamada, Masahiro Fukui, Kenji Terada, Masaaki Harazono, Teruya Fujisaki, Charles Reynolds, Jean Audet, Yi Pan, Scott Moore, Sushumna Iruvanti, Hsichang Liu, Hongqing Zhang, Brian Sundlof   +12 more
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Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate

2007 Proceedings 57th Electronic Components and Technology Conference, 2007
We have designed test vehicle (TV) using the Z-interconnect building blocks, to make new RF structures. Specifically, large rectangular clearances were cut in multiple ground planes to make a very wide 50-ohm stripline. Also, typical 50-ohm stripline was designed with a ground-signal-ground structure. Each stack-up had 16 metal layers, including 3 0S2P
Michael J. Rowlands, Rabindra Das
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