Results 211 to 220 of about 15,210 (256)

Low cost flip chip technology for organic substrates

1997 Proceedings 47th Electronic Components and Technology Conference, 2002
This paper describes outline of the flip chip technology which is used on various kind of substrates (glass-epoxy, flexible Printed Circuit Board, and MCM-L/D). In this technology, Au bumps are formed on the chip I/O pads by wire bonding method, and the bumps are pressed against the substrate pads. The chip is bonded and encapsuled with a thermosetting
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Resonance‐Activated Spin‐Flipping for Efficient Organic Ultralong Room‐Temperature Phosphorescence

Advanced Materials, 2018
AbstractTriplet‐excited‐state‐involved photonic and electronic properties have attracted tremendous attention for next‐generation technologies. To populate triplet states, facile intersystem crossing (ISC) for efficient exciton spin‐flipping is crucial, but it remains challenging in organic molecules free of heavy atoms.
Ye Tao, Runfeng Chen, Huanhuan Li, Jie Yuan, Yifang Wan, He Jiang, Cailin Chen, Yubing Si, Chao Zheng, Baocheng Yang, Guichuan Xing, Wei Huang   +11 more
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Low Expansivity Organic Substrate for Flip-Chip Bonding

IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1979
Organic substrate materials with thermal expansion coefficients (TEC) approaching that of silicon have been fabricated with laminate composites using DuPont's Kevlar® fiber. When combined with controlled-collapse solder chip joining technology, chip-to-substrate interconnections are essentially free of fatigue failure caused by thermal cycling.
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Organic Chip Scale Package (CSP) Development for Flip Chip Applications

International Symposium on Microelectronics, 2013
This paper describes a Chip Scale Package (CSP) development project and evaluation of the corresponding organic laminate material. Chip scale packaging can combine the strengths of various packaging technologies, such as the large size and performance advantages of a bare die assembly and the reliability of encapsulated devices. Optimizing the laminate
Tomoyuki Yamada, Masahiro Fukui, Kenji Terada, Masaaki Harazono, Teruya Fujisaki, Charles Reynolds, Jean Audet, Yi Pan, Scott Moore, Sushumna Iruvanti, Hsichang Liu, Hongqing Zhang, Brian Sundlof   +12 more
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Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate

2007 Proceedings 57th Electronic Components and Technology Conference, 2007
We have designed test vehicle (TV) using the Z-interconnect building blocks, to make new RF structures. Specifically, large rectangular clearances were cut in multiple ground planes to make a very wide 50-ohm stripline. Also, typical 50-ohm stripline was designed with a ground-signal-ground structure. Each stack-up had 16 metal layers, including 3 0S2P
Michael J. Rowlands, Rabindra Das
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Charge Transfer Exciton and Spin Flipping at Organic–Transition-Metal Dichalcogenide Interfaces

ACS Nano, 2017
Two-dimensional transition-metal dichalcogenides (TMD) can be combined with other materials such as organic small molecules to form hybrid van der Waals heterostructures. Because of different properties possessed by these two materials, the hybrid interface can exhibit properties that cannot be found in either of the materials.
Tika R. Kafle, Bhupal Kattel, Samuel D. Lane, Ti Wang, Hui Zhao, Wai-Lun Chan   +5 more
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High Density Ultra-Thin Organic Substrates for Advanced Flip Chip Packages

2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019
Advanced semiconductor packaging requirements for higher and faster performance in a thinner and smaller form factor continue to grow for mobile, network and consumer devices. While the increase in device input/output (I/O) density is driven by the famous "Moore's Law", the packaging industry is experiencing opposing trends for more complex packaging ...
Nokibul Islam, K.H. Tan, Seung Wook Yoon, Tony Chen   +3 more
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Flip chip pad structure for high density organic build up substrate

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2002
There has been a growing demand for high-density organic flip chip packages for high performance IC due to lower cost and lower electrical noise. The paper presents studies conducted in order to achieve high adhesion between the flip chip pads and the insulation layer on the organic substrate.
K. Nakamura, M. Harazono, H. Yamashita, D.H. Ding, J. Baker, A. Dubey   +5 more
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Reliability of large organic flip-chip packages for industrial temperature environments

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004
This paper focuses on the thermal fatigue reliability of fine pitch flip-chip BGA packages employing multi-layer organic built-up substrates with an integral heat spreader. For high density FPGA devices, the die size and package footprint are larger than the prevailing industry standard, this poses a significant challenge for meeting component level ...
A. Bansal, null Yuan Li, D. Fritz
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Anisotropic conductive adhesive films for flip-chip interconnection onto organic substrates

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225), 2002
We have developed new anisotropic conductive adhesive films (ACFs) for flip-chip interconnection to organic substrates such as printed wiring boards (PWBs). In order to reduce thermal and mechanical stress and strain induced by CTE (coefficient of thermal expansion) mismatches between chip and organic substrate, the elastic modulus of the ACF adhesive ...
A. Nagai, K. Takemura, K. Isaka, O. Watanabe, K. Kojima, K. Matsuda, I. Watanabe   +6 more
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