Results 201 to 210 of about 15,210 (256)

Flip chip organic substrate with metal column

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2003
Discusses the issue of stress induced from CTE mismatch between silicon and organic substrate in a flip-chip package. Although the use of underfill has greatly reduced the stress on the solder bump under die by holding the stretched substrate to silicon, the solder joints are still seeing high stress prior to the process.
J.J.D. Lan, J. Chang, P. Lu, K. Chen, null Yu-Po Wang, A.-J.M. Yang   +5 more
openaire   +1 more source

High density organic flip chip package substrate technology

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206), 2002
High performance logic ICs are rapidly migrating from peripheral bonded package configurations to area array, flip chip configurations. Total die I/O is exploding from
W.G. Petefish, D.B. Noddin, D.A. Hanson, R.E. Gorrell, M.F. Syvester   +4 more
openaire   +1 more source

Adhesion issues in flip-chip on organic modules

IEEE Transactions on Components and Packaging Technologies, 1999
Flip chip attach on organic carriers is a novel electronic packaging assembly method which provides advantages of high input/output (I/O) counts, electrical performance and thermal dissipation. In this structure, the flip chip device is attached to organic laminate with predeposited eutectic solder.
S.K. Tran, D.L. Questad, B.G. Sammakia
openaire   +1 more source

The Flip Side of Flexibility in Organizations

2014
This study points out the flip side of adopting a highly flexible approach in organization aiming at the human resource team where high degree of flexibility does not only impact the organization’s performance but also impinge on an employee’s personal life.
Shalini Verma, Sneh Anand
openaire   +1 more source

Thermally enhanced flip-chip BGA with organic substrate

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206), 2002
A thermally enhanced Flip-chip BGA package (FC-BGA) with organic substrate has been developed. The package is proud of the high thermal and electrical performance due to the flip-chip interconnections, and the optimized heat spreader attached directly on to the die.
H. Matsushima, S. Baba, Y. Tomita, M. Watanabe, E. Hayashi, Y. Takemoto   +5 more
openaire   +1 more source

Flip-chip BGA applied high-density organic substrate

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299), 2003
In the area of high-end logic devices, high pin counts, high speed and high thermal dissipation are strongly required for packages. A Flip-Chip BGA (FC-BGA) has been developed for such requirements. The FC-BGA has successfully realized up to 1681 pin counts and lower crosstalk noise, by using a high-density organic substrate with the 30 /spl mu/m/30 ...
S. Baba, null Qiang Wu, E. Hayashi, M. Watanabe, H. Matsushima, Y. Tomita, Y. Takemoto   +6 more
openaire   +1 more source

Flip chip soldering and adhesive bonding on organic substrates

Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium, 1995
Flip chip interconnections to organic substrates were realized using different techniques: soldering using mechanical solder ball bumps and adhesive bonding with isotropic conductive adhesive. Both approaches use an electrolessly deposited nickel-gold under bump metallization.
E. Jung, R. Aschenbrenner, A. Ostmann, E. Zakel, H. Reichl   +4 more
openaire   +1 more source

Reliability of flip chip BGA package on organic substrate

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2002
In this paper various reliability issues of the flip chip package on organic substrate, such as the 1st level bump joint reliability, die cracking, underfill cracking, and 2nd level solder ball joint reliabilty, are primarily described. This paper discusses the reasons and resolutions of failures.
null Eun-Chul Ahn, null Tae-Je Cho, null Jong-Bo Shin, null Ho-Joong Moon, null Ju-Hyun Lyu, null Ki-Won Choi, null Sa-Yoon Kang, null Se-Yong Oh   +7 more
openaire   +1 more source

Challenges of flip chip on organic substrate assembly technology

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299), 2003
Flip chip assembly on organic substrate technology has been developed and implemented as a key packaging technology for Intel's microprocessors for cost and performance advantages. In this paper, the process flow, key technology challenges and accomplishments achieved will be addressed.
V.K. Nagesh, R. Peddada, S. Ramalingam, B. Sur, A. Tai   +4 more
openaire   +1 more source

Materials and mechanics issues in flip-chip organic packaging

1996 Proceedings 46th Electronic Components and Technology Conference, 2002
The strength of flip chip organic packaging technology rests upon the knowledge and manufacturing base of C4 solder bump chip interconnection, and printed circuit technology infrastructure. The key innovation was the underfill encapsulation between the chip and the laminate which overcame the road-block of low cycle fatigue of C4 solder bump due to ...
T.Y. Wu, Y. Tsukada, W.T. Chen
openaire   +1 more source