Results 211 to 220 of about 15,116 (231)
Some of the next articles are maybe not open access.
Charge Transfer Exciton and Spin Flipping at Organic–Transition-Metal Dichalcogenide Interfaces
ACS Nano, 2017Two-dimensional transition-metal dichalcogenides (TMD) can be combined with other materials such as organic small molecules to form hybrid van der Waals heterostructures. Because of different properties possessed by these two materials, the hybrid interface can exhibit properties that cannot be found in either of the materials.
Tika R. Kafle +5 more
openaire +2 more sources
High Density Ultra-Thin Organic Substrates for Advanced Flip Chip Packages
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019Advanced semiconductor packaging requirements for higher and faster performance in a thinner and smaller form factor continue to grow for mobile, network and consumer devices. While the increase in device input/output (I/O) density is driven by the famous "Moore's Law", the packaging industry is experiencing opposing trends for more complex packaging ...
Nokibul Islam +3 more
openaire +1 more source
Flip chip pad structure for high density organic build up substrate
Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2002There has been a growing demand for high-density organic flip chip packages for high performance IC due to lower cost and lower electrical noise. The paper presents studies conducted in order to achieve high adhesion between the flip chip pads and the insulation layer on the organic substrate.
K. Nakamura +5 more
openaire +1 more source
Reliability of large organic flip-chip packages for industrial temperature environments
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004This paper focuses on the thermal fatigue reliability of fine pitch flip-chip BGA packages employing multi-layer organic built-up substrates with an integral heat spreader. For high density FPGA devices, the die size and package footprint are larger than the prevailing industry standard, this poses a significant challenge for meeting component level ...
A. Bansal, null Yuan Li, D. Fritz
openaire +1 more source
Anisotropic conductive adhesive films for flip-chip interconnection onto organic substrates
2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225), 2002We have developed new anisotropic conductive adhesive films (ACFs) for flip-chip interconnection to organic substrates such as printed wiring boards (PWBs). In order to reduce thermal and mechanical stress and strain induced by CTE (coefficient of thermal expansion) mismatches between chip and organic substrate, the elastic modulus of the ACF adhesive ...
A. Nagai +6 more
openaire +1 more source
Organic Complementary D Flip-Flops Enabled by Perylene Diimides and Pentacene
IEEE Electron Device Letters, 2006The development of organic complementary circuits has been largely limited by the development of suitable organic n-channel transistors. However, recent advances have led to materials such as the high-mobility air-stable n-channel organic semiconductor, N,N'-bis(n-octyl)-dicyanoperylene-3, 4 : 9, 10-bis(dicarboximide), PDI-8CN2.
B. Yoo +8 more
openaire +1 more source
Electromigration of C4 Bumps in Ceramic and Organic Flip-Chip Packages
56th Electronic Components and Technology Conference 2006, 2006As technology continues to scale, there is increasing demands on I/O counts and power requirements, leading to decreasing solder pitch and increasing current density for solder bumps in high-density flip-chip packages. At the same time, increasing performance requirements has led to the use of organic packages instead of the conventional ceramic ...
R.N. Master +3 more
openaire +1 more source
The Journal of Physical Chemistry A, 2019
The mixed-reference spin-flip time-dependent density functional theory (MRSF-TD-DFT) method eliminates the erroneous spin contamination of the SF-TD-DFT methodology, while retaining the conceptual and practical simplicity of the latter. The availability of the analytic gradient of the energy of the MRSF-TD-DFT response states enables automatic geometry
Seunghoon Lee +3 more
openaire +2 more sources
The mixed-reference spin-flip time-dependent density functional theory (MRSF-TD-DFT) method eliminates the erroneous spin contamination of the SF-TD-DFT methodology, while retaining the conceptual and practical simplicity of the latter. The availability of the analytic gradient of the energy of the MRSF-TD-DFT response states enables automatic geometry
Seunghoon Lee +3 more
openaire +2 more sources
3D segmentation of soft organs by flipping free mesh deformation
2010Purpose Methods and Materials Results Conclusion References Personal ...
openaire +1 more source
Flipping Districts: The Role of Major Party Organizations in Descriptive Representation
2020Though American voters can point to specific election years (e.g. 1992, 2018) that have been coined "the year of the woman," the reality is that the US Congress remains far from gender parity. The purpose of this study is to fill gaps in the existing literature surrounding the role of party organizations funded by the DCCC and NRCC in female candidate ...
openaire +1 more source