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Non-Invasive Junction Temperature Measurement Using Forward Voltage Drop of High-Power pcLED Under Tropical Conditions

2025 8th International Conference on Electronics, Materials Engineering & Nano-Technology (IEMENTech)
Arindam Chakraborty   +2 more
openaire   +1 more source

A Novel Condition Monitoring Method for Full Modes of Package Degradation in High Power Modules Based on Hysteresis Curves of Forward Voltage Drop

IEEE Transactions on Power Electronics
Yuchen Wang   +9 more
openaire   +1 more source

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