Results 161 to 170 of about 30,566 (271)

Nonreciprocal Electro‐Optic Intermodal Scattering With Momentum Engineered RF Waves

Nanophotonics, Volume 15, Issue 12, 25 June 2026.
We demonstrate highly selective nonreciprocal intermodal scattering in thin‐film lithium niobate using slow‐wave RF transmission lines. This electro‐optic momentum engineering approach enables magnet‐free nonreciprocal devices with a single RF input. ABSTRACT Spatiotemporal modulation approaches have been often employed as alternatives for producing ...
Jieun Yim, Gwan In Kim, Violet Workman, Seho Kim, Omar A. Barrera, Ruochen Lu, Gaurav Bahl   +6 more
wiley   +1 more source

Advanced Materials, Machinability and Intelligent Manufacturing Systems. [PDF]

Materials (Basel)
Burduk A, Batako A, Michael AX, Butdee S, Machado J, Krot K.   +5 more
europepmc   +1 more source

Dielectric Barrier Discharge Plasma Deoxidation of Natively Oxide Layer of Copper Powders in a Fluidized Bed

Advanced Engineering Materials, Volume 28, Issue 12, 17 June 2026.
This paper presents a novel approach to reducing oxide layers on metal powders using low‐temperature hydrogen dielectric barrier discharge plasmas at atmospheric pressure. Unlike conventional hydrogen‐plasma reductions, the powders do not contact the plasma directly.
Shukang Zhang, Annett Wollmann, Thomas Gimpel, Alfred P. Weber   +3 more
wiley   +1 more source

Ultracompact and large-bandwidth silicon modulator in a CMOS-compatible foundry. [PDF]

Nat Commun
Zhong H, Li J, He Y, Wang H, Chen Y, Zhang Y, Li X, Du Y, Su Y.   +8 more
europepmc   +1 more source

Wafer‐Scale 2D High‐Entropy Transition Metal Dichalcogenide Thin‐Film Catalysts for Efficient and Durable Photoelectrochemical Hydrogen Production

Advanced Materials, Volume 38, Issue 32, 8 June 2026.
A wafer‐scale 2D high‐entropy (MoWTaNbRu)S2 thin‐film catalyst with a distorted 1T phase integrated onto p‐Si photocathode is designed for highly efficient and durable photoelectrochemical hydrogen evolution reaction. The high‐entropy effect in layered transition metal dichalcogenides optimizes hydrogen adsorption energetics, accelerates photogenerated
Sang Eon Jun, Jin Ho Seo, Jaehyun Kim, Hyungsoo Lee, Seongbeen Kim, Woo Seok Cheon, Sabina Kim, In Hye Kwak, Byeong‐Gwan Cho, Ki Chang Kwon, Chul‐Ho Lee, Jungwon Park, Jooho Moon, Jennifer A. Dionne, Ho Won Jang   +14 more
wiley   +1 more source

Correction to "Hf/Zr Superlattice-Based High-κ Gate Dielectrics with Dipole Layer Engineering for Advanced CMOS". [PDF]

ACS Nano
Song T, Kang S, Kuo YH, Chen J, Fernandes L, Afroze N, Tian M, Baac HW, Shin C, Khan AI.   +9 more
europepmc   +1 more source

New Directions in Focused Ion Beam Induced Deposition for the Nanoprinting of Functional 3D Heterostructures

Advanced Materials Technologies, Volume 11, Issue 11, 5 June 2026.
Here, it is shown that focused ion beam induced deposition (FIBID) using helium and neon ions enables advanced high‐resolution 3D nanoprinting achieving precise multimaterial architectures and engineered internal voids. Thus, FIBID with finely focused noble gas ion species is presented as a unique platform for designing functional nanomaterials for ...
Frances Isabel Allen
wiley   +1 more source

Experimental and GEP-based evaluation of compressive strength in eco-friendly mortars with waste foundry sand and varying cement grades. [PDF]

Sci Rep
Mahdinia S, Tavakkolizadeh M, Masoodi AR.   +2 more
europepmc   +1 more source

Fabrication of High‐Density Multimodal Neural Probes Based on Heterogeneously Integrated CMOS

Advanced Science, Volume 13, Issue 34, 19 June 2026.
A chiplet‐based methodology democratizes active neural probe development on standard bulk CMOS services. This yields the first probe combining high‐density electrophysiology (416 electrodes) with calcium imaging (832 photodiodes) and complete on‐chip signal processing across 13 shanks.
Ju Hee Mun, Miji Kim, Wooyeon Shin, Yongjun Park, Kanghwan Kim, Il‐Joo Cho, Jae Won Shim, Min Soo Kim, Sunwoo Lee, Jeongjin Kim, Changhyuk Lee   +10 more
wiley   +1 more source

Volatile and non-volatile nano-electromechanical switches fabricated in a CMOS-compatible silicon-on-insulator foundry process. [PDF]

Microsyst Nanoeng
Li Y, Bleiker SJ, Worsey E, Dagon M, Edinger P, Takabayashi AY, Quack N, Verheyen P, Bogaerts W, Gylfason KB, Pamunuwa D, Niklaus F.   +11 more
europepmc   +1 more source