Results 171 to 180 of about 157,871 (287)

Bypass Transition in Three-dimensional Time-dependent Boundary Layers [PDF]

, 2014
Hack, MJP, Zaki, TA
core   +1 more source

Numerical simulation study of gas-solid two-phase flow characteristics in borehole sampling of coal cuttings. [PDF]

PLoS One
Xue S, Zhang L, Zheng X, Gao C, Liu S.
europepmc   +1 more source

Laser‐Based Solidification of Cermets/Cemented Carbides: Processing‐Microstructure‐Property Relationships

Advanced Materials Technologies, EarlyView.
Recent research on laser‐processed cermets and cemented carbides highlights significant advancements, yet a notable paucity of studies and persistent challenges remain. Efforts are increasingly focused on developing low‐cost, environmentally friendly cermets as alternatives to conventional materials.
Himanshu Singh Maurya, Farid Akhtar, Konda Gokuldoss Prashanth   +2 more
wiley   +1 more source

Frictional Dissipation and Scaling Laws at van der Waals Interfaces: The Role of Edge and Corner Elastic Moiré Pinning. [PDF]

ACS Nano
Gao X, Yan W, Ouyang W, Liu Z, Urbakh M, Hod O.   +5 more
europepmc   +1 more source

Advanced Techniques for Scalable Woven E‐Textiles Manufacturing

Advanced Materials Technologies, EarlyView.
This review highlights recent advances in scalable weaving techniques for e‐textiles, emphasizing innovations in multilayer structures, conductive yarn integration, and loom modifications. It summarizes emerging materials, fabrication strategies, and performance considerations that enable reliable, durable, and industrially scalable woven electronic ...
Faisal Abedin, Seonyoung Youn, Amanda C. Mills   +2 more
wiley   +1 more source

Quantifying Tactile Perception of Fabrics Using Both Frictional and Acoustic Methods. [PDF]

Tribol Lett
Kyriazis L, Caykara T, Hefft DI, Martinez A, Zhang ZJ.   +4 more
europepmc   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

Advanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal, Davey Boss, René H. Poelma, Elias Vlieg, John J. Schermer   +4 more
wiley   +1 more source

Research on the mechanical behavior of compression molding for simulated polymer-bonded explosives. [PDF]

Sci Rep
Wu X, Tao J, Wang B, Ren H, Wang Y.
europepmc   +1 more source

Estimation of Solid Friction in a Servomotor Mechanism Using an Adaptive Observer and Its Application to Positioning Control

Transactions of the Society of Instrument and Control Engineers, 1988
openaire   +2 more sources

Development of Laterally Graded X‐Ray Multilayer Optics

Advanced Materials Technologies, EarlyView.
This work presents the development of laterally graded X‐ray multilayer optics with both constant and variable lateral gradients. By precisely controlling substrate speed profiles and mask design, these multilayers achieve highly accurate lateral gradients and excellent sagittal thickness uniformity, making them ideal for spectroscopy application at ...
Arindam Majhi, Wadwan Singhapong, Wai Jue Tan, Andrey Sokolov, Stefano Agrestini, Mirian Garcia‐Fernandez, Kejin Zhou, Andrew C. Walters, Chris Bowen, Alexander J.G. Lunt, Hongchang Wang, Kawal J. Sawhney   +11 more
wiley   +1 more source