Results 161 to 170 of about 1,869,916 (232)

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya, Adamos Christou, Sihang Ma, Ravinder Dahiya   +3 more
wiley   +1 more source

CJE volume 16 issue 4 Cover and Front matter [PDF]

, 1950
S Clark, Queen' J Hodgetts, V Fowke, B. S. Keirstead, George A. Elliott, J Allely, H. F. Angus, G Britnell, George Burton, J Crumb, W. T. Easterbrook, C Curtis, Hamish L. Fraser, Harvey Gordon, Nathan Kemp, Maurice Keyfitz, François Lamontagne, Violette La, Carolyn McIvor, R Macpherson, Hugh MacPherson, H Mayo, H Pentland   +22 more
openalex   +1 more source

Targeted Local Delivery via Fiber‐Embedded Flexible Microchannels Integrated with Film‐Based Implantable Probes

Advanced Materials Technologies, EarlyView.
In this study, a fiber‐embedded drug delivery channel for implantable microprobes, demonstrating the first functional drug delivery system using flexible LCP‐based probes, is developed. The design incorporates fibers for site‐selective drug delivery and electrical functions. The utilization of monolithic thermal bonding simplifies fabrication.
Jaehwan Byun, Jungseub Lee, Hyun Ryul Ryu, Geun Jae Lee, Sung Eun Lee, Sung June Kim, Noo Li Jeon   +6 more
wiley   +1 more source

AJI volume 34 issue S2 Cover and Front matter [PDF]

, 1940

openalex   +1 more source

Progress in Flexible Perovskite Solar Cells: Paving the Way for Scalable Manufacturing

Advanced Materials Technologies, EarlyView.
Perovskite solar cells (PSCs) are well positioned for a successful market uptake. This is due to an unprecedented improvement of their efficiency and stability since the first report in 2009. In this review paper, the building blocks for the scalable manufacturing and future commercialization of flexible PSCs and their pathway to impact will be ...
Dimitar I. Kutsarov, Ehsan Rezaee, Jed Lambert, Walter Tevis Stroud, Apostolos Panagiotopoulos, S. Ravi P. Silva   +5 more
wiley   +1 more source

Front Outside Cover [PDF]

, 2018

core   +4 more sources

GAR volume 19 issue 56 Cover and Front matter [PDF]

, 1950

openalex   +1 more source

Cover and Front Pages

IJAEDU- International E-Journal of Advances in Education, 2015
openaire   +3 more sources

Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging

Advanced Materials Technologies, EarlyView.
Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek, Minhyeok Kim, Hak‐Sung Kim, Jinho Ahn, Hongyun So   +4 more
wiley   +1 more source

CMB volume 0 issue 2 Cover and Front matter [PDF]

, 1948

openalex   +1 more source