Results 71 to 80 of about 33,654 (262)
Precipitation Simulations of the O‐Phase in Ti2AlNb Alloys Processed by Laser Powder Bed Fusion
Simulated and experimental evolution of the O‐phase volume fraction during postprocessing of a Ti‐21Al‐25Nb (at.%) alloy processed by laser powder bed fusion. With results of sensitivity to input parameters from a thorough and quantified analysis, the interfacial energy matrix/precipitate is the most relevant input parameter for the simulation of the O‐
Silvana Tumminello +7 more
wiley +1 more source
Grain boundary triple junctions are an essential ingredient of the microstructure of polycrystalline materials. In this study, a triple junction is observed using atomic‐resolution scanning transmission electron microscopy and characterized. Computer simulations reveal that the junction has a dislocation character that is determined by the joining ...
Tobias Brink +4 more
wiley +1 more source
Active Corrosion Protection of Sintered AA7075 Aluminum Alloy via Mn Powder Addition
AA7075 containing Mn‐rich particles is fabricated via spark plasma sintering using AA7075 and Mn powders. Corrosion resistance is evaluated through dip‐and‐dry tests using 0.1 M NaCl (pH 6.0), and mass loss decreases with increasing Mn addition. Mn‐rich particles function as a source of Mn ions, and formation of Mn‐accumulation films on Cu‐containing ...
Ko Ebina, Masashi Nishimoto, Izumi Muto
wiley +1 more source
Structure and Mechanical Properties of a Titanium–8 wt.% Gallium Alloy
This paper describes a study of the microstructure and mechanical properties of a titanium–gallium (Ti-8 wt.% Ga) alloy using X-ray diffraction, optical metallography, micro-hardness measurements, compression and tensile testing, nanoindentation and ...
David W. Wheeler
doaj +1 more source
Shellac, a centuries‐old natural resin, is reimagined as a green material for flexible electronics. When combined with silver nanowires, shellac films deliver transparency, conductivity, and stability against humidity. These results position shellac as a sustainable alternative to synthetic polymers for transparent conductors in next‐generation ...
Rahaf Nafez Hussein +4 more
wiley +1 more source
In MOCVD MoS2 memristors, a current compliance‐regulated Ag filament mechanism is revealed. The filament ruptures spontaneously during volatile switching, while subsequent growth proceeds vertically through the MoS2 layers and then laterally along the van der Waals gaps during nonvolatile switching.
Yuan Fa +19 more
wiley +1 more source
Integration of Low‐Voltage Nanoscale MoS2 Memristors on CMOS Microchips
This article presents the first monolithic integration of nanoscale MoS2‐based memristors into the back‐end‐of‐line of foundry‐fabricated CMOS microchips in a one‐transistor‐one‐resistor (1T1R) architecture. The MoS2‐based 1T1R cells exhibit forming‐free, nonvolatile resistive switching with ultra‐low operating voltages, low cycle‐to‐cycle variability ...
Jimin Lee +16 more
wiley +1 more source
There are two problems in the quantitative analysis of trace gallium in geological samples by using Inductively Coupled Plasma-Mass Spectrometry (ICP-MS).
GAO He-feng, WANG Chao, ZHANG Li-gang
doaj
Here, we provide the reader with the current state of the art in the fabrication of high‐T2‐coherence diamond, optimized through the use of double electron–electron resonance (DEER) spectroscopy. We reveal the main as well as yet unidentified spin defects, the reduction of which is essential for reducing the spin bath and fabricating materials for ...
Olga Rubinas +6 more
wiley +1 more source
Spatially Modulated Morphotropic Phase Boundaries in a Compressively Strained Multiferroic Thin Film
ABSTRACT The coexisting rhombohedral‐like (R′, MA) and tetragonal‐like (T′, MC) monoclinic phases in compressively strained bismuth ferrite thin films exhibit exceptional piezoelectric and magnetic properties. While previous studies have largely focused on probing the morphotropic phase boundaries (MPBs) comprising ordered R′/T′ twins, their self ...
Ting‐Ran Liu +7 more
wiley +1 more source

