Results 191 to 200 of about 43,947 (298)

Silicon‐Embedded Multifunctional Heterogeneous Integration for Miniaturized Photoplethysmography Detection Devices

Advanced Science, EarlyView.
ABSTRACT The multifunctional integration of chips with high flexibility and scalable manufacturing is crucial for enhancing chip performance, reducing chip size, and simplifying chip design. However, balancing volume, cost, flexibility, and functionality using traditional heterogeneous integration methods is challenging.
Lang Chen, Shizun Hu, Zhou Yang, Shitao Shen, Pan Zhang, Han Xu, Chi Zhang, Wei Wang   +7 more
wiley   +1 more source

Online Detection of Hydrogen Fluoride under Corona Discharge in Gas-Insulated Switchgear Based on Photoacoustic Spectroscopy. [PDF]

Sensors (Basel)
Wan L, Zhao X, Li K.
europepmc   +1 more source

Triple‐Mode Ferroelectric Thin‐Film Transistor for Hybrid Electrical–Optical Reservoir Computing

Advanced Science, EarlyView.
A triple‐mode ferroelectric thin‐film transistor is developed by integrating Si3N4/HZO/IGZO layers to realize three independent memory modes: electric long‐term, electric short‐term, and optical short‐term. This single‐device architecture functions as both a reservoir and readout layer, achieving 92.43% MNIST accuracy. It offers a fully hardware‐based,
Hyeonho Lee, Seungjun Lee, Tae‐Hyeon Kim, Yonghee Jeong, Gwangmin An, Minsu Ko, Junsu Yu, Heung Soo Kim, Yang Chai, Sungjun Kim   +9 more
wiley   +1 more source

DFT Exploration of a Pd-Doped InSe Monolayer as a Novel Gas Sensing Candidate upon SF₆ Decomposition: SO₂, SOF_2, and SO₂F₂. [PDF]

Sensors (Basel)
Yang X, Cui H, Liu Z, Liu Y.
europepmc   +1 more source

Progress in Strain Engineering of 2D‐Integrated Heterostructures for Ultrasensitive Sensors

Advanced Science, EarlyView.
 . ABSTRACT Two‐dimensional (2D) integrated heterostructures have emerged as a cornerstone in the advancement of next‐generation sensor technologies. These heterostructures, which combine materials with different dimensionalities, have led to significant breakthroughs in sensing performance and device integration.
That Buu Ton, Tuan Sang Tran, Duc Khanh Tran, Van Thanh Dau, Dzung Viet Dao   +4 more
wiley   +1 more source

Efficiency hierarchy and optimization of waste incineration in China to balance disposal and energy supply. [PDF]

Nat Commun
Cui J, Cui Y, Li J, Gao X, Wei W, Chen Y, Ma W, Zhu N, Geng Y, Zhao Y, Lou Z.   +10 more
europepmc   +1 more source

Observation of Excitonic Instability in a Monolayer Ta2NiSe5 With Strain Disorder

Advanced Science, EarlyView.
Monolayer Ta2${\rm Ta}_2$NiSe5${\rm NiSe}_5$ sustains an excitonic insulating phase up to 190 K, with Raman signatures of gap opening and critical excitonic fluctuations. Thickness‐independent large gap ratios highlight strong exciton‐phonon coupling, while substrate‐induced strain disorder depresses Tc, establishing monolayer Ta2${\rm Ta}_2$NiSe5${\rm
So Young Kim, Kwangrae Kim, Dowook Kim, Ji Eun Lee, Jieun Seok, Chang Il Kwon, Jo Hyun Yun, Chang‐Jong Kang, Jae Hoon Kim, H. W. Yeom, Tae‐Hwan Kim, Jonghwan Kim, B. J. Kim, Jun Sung Kim   +13 more
wiley   +1 more source

Light storage in light cages: a scalable platform for multiplexed quantum memories. [PDF]

Light Sci Appl
Gómez-López E, Ritter D, Kim J, Kübler H, Schmidt MA, Benson O.   +5 more
europepmc   +1 more source

Ultrafast Dynamics of Spin Current and Electron Temperature in Spintronic Terahertz Emitters

Advanced Science, EarlyView.
This work quantifies optical‐pump‐induced THz transmission variations to reveal electron and lattice temperature dynamics and presents time‐resolved THz spectral maps for sub‐picosecond analysis. A 63 ± 8 fs time lag between THz emission and laser excitation is identified, serving as an intrinsic parameter limiting the upper frequency of spintronic THz
Yifan Wang, Zuanming Jin, Miao Cai, Zhiqiang Lan, Zhenjie Ge, Zheng Feng, Wei Tan, Alexei V. Balakin, Alexander P. Shkurinov, Yan Peng, Yiming Zhu   +10 more
wiley   +1 more source

Measurement data from full-scale fire experiments of battery electric vehicles and internal combustion engine vehicles. [PDF]

Data Brief
Sauer NG, DiDomizio MJ, Kesler RM, Ghanekar S, Dehghani P, Horn GP, Barowy A.   +6 more
europepmc   +1 more source