Results 211 to 220 of about 2,024,675 (292)

Micropillar‐Engineered Hybrid Adhesive Patch for Surface‐Conformable and Directional Adhesion

open access: yesAdvanced Materials Technologies, EarlyView.
This work presents a surface‐conformable hybrid adhesive integrating height‐optimized hexagonal micropillars with open‐rectangular cuts. The micropillars enhance rough‐surface contact and microscale crack arrest, while the cuts guide and reverse interfacial cracks for strong and directional adhesion. The multiscale architecture achieves robust pull‐off
Seongjin Park   +4 more
wiley   +1 more source

Recent Advances of Slip Sensors for Smart Robotics

open access: yesAdvanced Materials Technologies, EarlyView.
This review summarizes recent progress in robotic slip sensors across mechanical, electrical, thermal, optical, magnetic, and acoustic mechanisms, offering a comprehensive reference for the selection of slip sensors in robotic applications. In addition, current challenges and emerging trends are identified to advance the development of robust, adaptive,
Xingyu Zhang   +8 more
wiley   +1 more source

Fabric‐Based Wearable Robotic Exoskeleton Gloves: Advancements and Challenges

open access: yesAdvanced Materials Technologies, EarlyView.
This review highlights interdisciplinary technological advances in fabric‐based robotic gloves, focusing on progress in design, fabrication, actuation, sensing, control, and power and energy requirements. It also addresses performance testing and validation, including biomechanical, strength, functional, user experience, and durability assessments, to ...
Ayse Feyza Yilmaz   +2 more
wiley   +1 more source

In Situ Copper Electroplating Turns Material Extrusion 3D Printers Into Metal–Polymer Hybrid Fabricators

open access: yesAdvanced Materials Technologies, EarlyView.
An in situ electroplating approach for MEX 3D printing is proposed, enabling copper deposition during the fabrication of conductive polymers. The method combines a printer‐integrated plating head, ML‐based g‐code control, and stop‐and‐go printing, achieving near‐bulk copper conductivity and enabling fully embedded, assembly‐free electronic components ...
Gianluca Percoco   +5 more
wiley   +1 more source

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