Results 141 to 150 of about 5,925,885 (247)

Author Correction: Enhanced radiation use efficiency and grain filling rate as the main drivers of grain yield genetic gains in the CIMMYT elite spring wheat yield trial. [PDF]

open access: yesSci Rep
Gerard G   +10 more
europepmc   +1 more source

Low Resistance Interphase Formation at the PEO‐LiTFSI|LGPS Interface in Lithium Solid‐State Batteries

open access: yesAdvanced Materials Interfaces, EarlyView.
Interfacial charge transfer and low‐resistance interphase formation between PEO‐based polymer and Li10GeP2S12 solid electrolytes are investigated using multi‐electrode impedance spectroscopy and advanced analytical techniques such as XPS and ToF‐SIMS.
Ujjawal Sigar   +6 more
wiley   +1 more source

Enhanced radiation use efficiency and grain filling rate as the main drivers of grain yield genetic gains in the CIMMYT elite spring wheat yield trial. [PDF]

open access: yesSci Rep
Gerard G   +10 more
europepmc   +1 more source

Hierarchical Multi‐Material Architectures With Gradient Design for Dynamic‐Range Flexible Tactile Sensing

open access: yesAdvanced Materials Technologies, EarlyView.
Hierarchical multi‐material TPMS lattices are engineered as flexible tactile sensors by combining soft and stiff elastomeric layers with a conformal conductive coating. The bilayer architecture delivers sensitivity at low pressures while maintaining a broad detectable range under large loads, enabling reliable pressure and vibration monitoring for ...
Reza Noroozi   +3 more
wiley   +1 more source

Advanced Manufacturing of Composite‐Based Systems for Energy Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Advanced manufacturing enables the integration of polymers, ceramics, metal oxides, and composites into architected microstructures with tailored transport pathways. By coupling material selection, manufacturing strategy, and structural design, multifunctional energy systems can simultaneously improve electrochemical performance, thermal management ...
Sri Vaishnavi Thummalapalli   +13 more
wiley   +1 more source

High Throughput Aerosol Jet Printing to Operationalize High Aspect Ratio Patterning

open access: yesAdvanced Materials Technologies, EarlyView.
High‐throughput aerosol jet printing poses distinct limiting mechanisms to the printing process. These include rapidly changing ink chemistries, atomization instabilities, and liquid‐phase spreading. The combination of in‐line heating, process monitoring, and traditional optimization procedures enables rapid printing of high‐aspect‐ratio structures ...
Bella I. Guyll   +4 more
wiley   +1 more source

Programmable Crack Networks for Wide‐Range and Reversible Strain Sensing in Vertically Oriented van der Waals Molybdenum Disulfide Thin Films

open access: yesAdvanced Materials Technologies, EarlyView.
Vertically oriented van der Waals MoS2 thin films enable a mechanically programmable crack network for strain sensing. The initial mechanical programming protocol establishes a programmed crack configuration along weak interlayer and interdomain interfaces.
Yinli Wang, Hiroyuki Hirakata
wiley   +1 more source

In‐House Manufacturing of 3D ECM Culture Chips via Vacuum Thermoforming for Enhanced Imaging Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Desktop vacuum thermoforming enables rapid, low‐cost fabrication of 96‐channel polystyrene culture chips with very thin imaging interfaces. The resulting platform supports cell lines, primary cells, and patient‐derived organoids, and enables high‐resolution confocal microscopy and single‐cell visualization, providing an accessible approach for advanced
Aleksandra Fomina   +5 more
wiley   +1 more source

Wafer‐Scale Top‐Down Patterning of Metal Halide Perovskites

open access: yesAdvanced Materials Technologies, EarlyView.
Wafer‐scale patterning of metal halide perovskite films is demonstrated on 150 mm substrates using a chemically amplified resist, polymethyl methacrylate (CAR‐PMMA) and a single reactive ion etching step. The streamlined process preserves film luminescence while defining submicrometer features across the full wafer, enabling dense, scalable integration
Federico Fabrizi   +7 more
wiley   +1 more source

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