Results 101 to 110 of about 2,097,795 (330)

A Simulative Approach for the Prediction of Mesoscale Residual Stress Fields in Solution‐Strengthened Ferritic Ductile Iron

open access: yesAdvanced Engineering Materials, EarlyView.
This study presents a 3D representative volume element‐based simulation approach to predict mesoscopic residual stress and strain fields in silicon solid solution‐strengthened ductile cast iron. By modeling phase transformation kinetics with an enhanced Johnson–Mehl–Avrami–Kolmogorov model, the effects of varying cooling rates on residual stresses are ...
Lutz Horbach   +6 more
wiley   +1 more source

Formation of water and methanol in star forming molecular clouds

open access: yes, 2008
We study the formation of water and methanol in the dense cloud conditions to find the dependence of its production rate on the binding energies, reaction mechanisms, temperatures, and grain site number.
Acharyya, Kinsuk   +3 more
core   +1 more source

Research Progress on the Influence of Coagulants and Processing Conditions on the Formation and Quality of Tofu Gel

open access: yesShipin gongye ke-ji
Tofu is a widely consumed protein gel, which is the denaturation of soybean protein (specifically the 7S and 11S globulin), under heat treatment, and the aggregation by salt ions, hydrogen ions or enzymes, forming a dense and uniform protein gel with a ...
Bingyu SUN   +8 more
doaj   +1 more source

Mechanical Behavior and Microstructural Changes Associated with Tensile Deformation above the Martensite Start Temperature during Quenching and Subsequent Partitioning of a Low‐Alloy 37SiB6 Steel

open access: yesAdvanced Engineering Materials, EarlyView.
A new experimental setup, incorporating digital image correlation and infrared thermography in combination with inductive‐conductive heating for precise temperature control, is used to analyze the mechanical behavior and microstructural changes of sheet metal under complex thermomechanical test conditions that represent quench and partitioning ...
Christian Illgen   +4 more
wiley   +1 more source

Cosmology without time: What to do with a possible signature change from quantum gravitational origin?

open access: yes, 2016
Within some approaches to loop quantum cosmology, the existence of an Euclidean phase at high density has been suggested. In this article, we try to explain clearly what are the observable consequences of this possible disappearance of time. Depending on
Barrau, Aurélien, Grain, Julien
core   +1 more source

Agronomical techniques to improve technological and sanitary quality [PDF]

open access: yes, 2012
In spite of variable grain protein contents, baking quality of organic wheat was found to be acceptable to good. Mycotoxin (DON) infestation was generally low on tested grain samples.
Abecassis, J.   +9 more
core  

Development of Aluminum Scandium Alloys for Hydrogen Storage Valves

open access: yesAdvanced Engineering Materials, EarlyView.
Different aluminum alloy series and various aluminum‐scandium alloys with differing Sc and Zr levels are evaluated for use in hydrogen storage valve production. The alloys undergo hardness testing, optical microscopy, and tensile strength analysis, with hardening behavior studied under varying conditions.
Francisco García‐Moreno   +4 more
wiley   +1 more source

A Route for the Transfer of Materials Through the Pollen Grain Wall [PDF]

open access: bronze, 1959
John R. Rowley   +2 more
openalex   +1 more source

Safe storage guidelines for soybeans at different temperatures and moisture contents

open access: yesJulius-Kühn-Archiv, 2018
Poor storage capacity of soybean makes it prone to fungal spoilage and heating during storage, resulting in lower quality. Early prediction of the fungal spoilage in stored soybeans is very difficult because fungi are often too small to be seen with the ...
Tang, Fang   +3 more
doaj   +1 more source

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

open access: yesAdvanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan   +5 more
wiley   +1 more source

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