Results 241 to 250 of about 2,062,209 (334)

Ultrahigh Piezoelectricity in Truss‐Based Ferroelectric Ceramics Metamaterials

open access: yesAdvanced Functional Materials, Volume 35, Issue 12, March 18, 2025.
By leveraging the unique combination of polarization direction and loading state, ultrahigh piezoelectricity is achieved through careful tuning of the relative density and scaling ratio in truss‐based ferroelectric metamaterials. This approach enables the simultaneous realization of extremely high piezoelectric constants and ultralow dielectric ...
Jiahao Shi   +6 more
wiley   +1 more source

Structurally Colored Physically Unclonable Functions with Ultra‐Rich and Stable Encoding Capacity

open access: yesAdvanced Functional Materials, Volume 35, Issue 12, March 18, 2025.
This study reports a design strategy for generating bright‐field resolvable physically unclonable functions with extremely rich encoding capacity coupled with outstanding thermal and chemical stability. The optical response emerges from thickness‐dependent structural color formation in ZnO features, which are fabricated by physical vapor deposition ...
Abidin Esidir   +8 more
wiley   +1 more source

Engineering the Hierarchical Porosity of Granular Hydrogel Scaffolds Using Porous Microgels to Improve Cell Recruitment and Tissue Integration

open access: yesAdvanced Functional Materials, Volume 35, Issue 12, March 18, 2025.
By fabricating and covalently assembling gelatin methacryloyl (GelMA) porous microgels, a new class of granular hydrogel scaffolds with hierarchical porosity is developed. These scaffolds have a significantly higher void fraction than their counterparts made up of nonporous microgels, enhancing cell recruitment and tissue integration. This research may
Alexander Kedzierski   +9 more
wiley   +1 more source

Versatile Selective Soldering via Molten Metal Printing for Heat‐Sensitive 3D Electronics and Smart Wearables

open access: yesAdvanced Functional Materials, EarlyView.
Selective soldering via molten metal printing enables component integration, even in heat‐sensitive applications across fields like additive manufacturing, sustainable electronics, and smart textiles. This method overcomes the temperature limitations of existing technologies.
Dániel Straubinger   +4 more
wiley   +1 more source

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