Results 151 to 160 of about 29,369 (256)

Foliar iron application delays flavonoid degradation during the later grain-filling stage and regulates sugar metabolism in colored rice. [PDF]

Front Plant Sci
Zhao X, Wang W, Jiang Y, Wang L, Liu X, Xie H.   +5 more
europepmc   +1 more source

Interfacial Failure and Self‐Healing in Solid‐State Batteries

Advanced Materials, EarlyView.
Dynamic interfacial self‐healing offers an adaptive route to mitigate coupled mechanical, chemical, and electrochemical degradation in solid‐state batteries. This review connects evolving interfacial failure mechanisms with physical‐flow, chemical‐restoration, stimuli‐responsive, and electric‐field‐assisted repair strategies, highlighting targeted self‐
Xinxin Zhu, Tengfei Dai, Wendi Dou, Zhiheng Li, Kaihua Wen, Yanqun Lv, Ming Zhao, Jun Lu, Zaiping Guo   +8 more
wiley   +1 more source

Multi-year field evidence for minimum nighttime temperature thresholds in rice fatty acid composition during grain filling. [PDF]

Food Chem X
Yu W, Wang Q, Sun Q, Zhu Q, Liu T, Yi S, Zhang G, Zhu J, Cao J, Li J, Li Y, Fan X, Guo X, Song Y, Luo L.   +14 more
europepmc   +1 more source

Diketopyrrolopyrrole‐Based Cation as a Semiconducting Spacer in Layered Perovskite

Advanced Materials, EarlyView.
Diketopyrrolopyrrole cation incorporated layered perovskites exhibiting extended absorption profiles and enhanced charge carrier mobility with type‐II energy alignment. The improved photoconversion efficiency demonstrates the critical role of incorporating organic semiconductors in optimizing layered perovskite performance.
Waygen Thor, Colin Jeanguenat, Louise De Cian, Demetra Tsokkou, Parnian Ferdowsi, Nicolas J. Diercks, Natalie Banerji, Jun‐Ho Yum, Kevin Sivula   +8 more
wiley   +1 more source

Editorial: From genes to grains: advancements in understanding seed development and grain filling. [PDF]

Front Plant Sci
Cao SK, Ye N, Teng Z, Shaw BP, Liu R, Zhang J.   +5 more
europepmc   +1 more source

Low Resistance Interphase Formation at the PEO‐LiTFSI|LGPS Interface in Lithium Solid‐State Batteries

Advanced Materials Interfaces, EarlyView.
Interfacial charge transfer and low‐resistance interphase formation between PEO‐based polymer and Li10GeP2S12 solid electrolytes are investigated using multi‐electrode impedance spectroscopy and advanced analytical techniques such as XPS and ToF‐SIMS.
Ujjawal Sigar, Timo Weintraut, Sebastian L. Benz, Semih Engün, Sascha Kremer, Anja Henss, Felix H. Richter   +6 more
wiley   +1 more source

The Effects of Photoperiodic Transcription Factor OsPRR37 on Grain Filling and Starch Synthesis During Rice Caryopsis Development. [PDF]

Plants (Basel)
Zhang H, Tang S, Wei F, Zong W, Hou J, Ran X, Zhao J, Guo J, Wang Z.   +8 more
europepmc   +1 more source

Maskless Fabrication of PLA‐Based Neural Arrays for CNS Recording and Stimulation

Advanced Materials Interfaces, EarlyView.
Biodegradable neural interfaces enable bidirectional communication with the CNS. Through electrochemical characterization, ageing tests with impedance monitoring, and in vivo validation, we assess the performance of PLA‐based epicortical and spinal implants.
Anna De Salvo, Federica Velluto, Ilenia Sergi, Michele Di Lauro, Verónica Barranco‐Maresca, Elena Alonso‐Calviño, Yasmina Hernández‐Martín, Juan Aguilar, Juliana M. Rosa, María C. Serrano, Carolina Giulia Ferroni, Federico Rondelli, Elisa López‐Dolado, Luciano Fadiga, Fabio Biscarini   +14 more
wiley   +1 more source

Low‐Temperature Gold Deposition Improves CdTe Back Contacts

Advanced Materials Interfaces, EarlyView.
Cd(Se,Te) samples are cooled during the evaporation of Au back contacts to thermally quench CdTe degradation. Reduced temperature during Au evaporation boosts PV efficiency, open‐circuit voltage, and fill factor. XPS associates these improvements with less chemical perturbation of the CdTe surface during metallization.
Christopher P. Muzzillo, Ryan Muzzio, Craig L. Perkins, B. Edward Sartor, Matthew O. Reese, Chungho Lee   +5 more
wiley   +1 more source

Rice sucrose transporter 1, <i>OsSUT1</i>, confers to alleviation of the high temperature stress in rice grain filling. [PDF]

Plant Biotechnol (Tokyo)
Kusano H, She KC, Matsubara K, Wang LL, Tsujiuchi K, Matsumoto R, Shiraishi M, Okubo Y, Yasui H, Sasaki T, Shimada H.   +10 more
europepmc   +1 more source