Results 11 to 20 of about 875,334 (307)

Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing [PDF]

open access: yesNanomaterials, 2023
Highly (111)-oriented nanotwinned Cu (nt-Cu) films were fabricated on silicon wafers for thermal-stress characterization. We tailored the microstructural features (grain scale and orientation) of the films by tuning the electroplating parameters.
Jyun-Yu Lai   +6 more
doaj   +2 more sources

Why grain growth is not curvature flow. [PDF]

open access: yesProc Natl Acad Sci U S A
Grain growth in polycrystals is traditionally considered a capillarity-driven process, where grain boundaries (GBs) migrate toward their centers of curvature (i.e., mean curvature flow) with a velocity proportional to the local curvature (including extensions to account for anisotropic GB energy and mobility). Experimental and simulation evidence shows
Qiu C   +4 more
europepmc   +5 more sources

Numerical simulation of grain-size effects on creep crack growth by means of grain elements [PDF]

open access: yes, 1998
The effect of grain size on creep crack growth is investigated by means of a numerical technique in which the actual crack growth process is simulated in a discrete manner by grain elements and grain boundary elements.
Giessen, E. van der,, Onck, P.R.,
core   +20 more sources

A general mechanism of grain growth-Ⅱ: Experimental

open access: yesJournal of Materiomics, 2021
The formed microstructure inside polycrystalline materials strongly influences their practical performances, which process is mostly dominated by grain growth behaviors.
Jianfeng Hu   +5 more
doaj   +1 more source

A general mechanism of grain growth ─Ⅰ. Theory

open access: yesJournal of Materiomics, 2021
The behaviors of grain growth dominate the formation of the microstructure inside polycrystalline materials and thus strongly influence their practical performances.
Jianfeng Hu   +5 more
doaj   +1 more source

Tailoring sintering-resistant thermal barrier coatings by considering critical healing width of two-dimensional interlamellar pores

open access: yesJournal of Advanced Ceramics, 2023
Large degradation in thermal insulation and strain tolerance is a main headache and a primary cause of the failure for plasma-sprayed thermal barrier coatings (TBCs) during service.
Guang-Rong Li   +4 more
doaj   +1 more source

Low temperature sintered giant dielectric permittivity CaCu3Ti4O12 sol-gel synthesized nanoparticle capacitors [PDF]

open access: yesJournal of Advanced Dielectrics, 2017
This paper reports on synthesis of polycrystalline complex perovskite CaCu3Ti4O12 (as CCTO) ceramic powders prepared by a sol–gel auto combustion method at different sintering temperatures and sintering times, respectively.
Venkata Sreenivas Puli   +4 more
doaj   +1 more source

Simulation of CP-Ti Recrystallization and Grain Growth by a Cellular Automata Algorithm: Simulated Versus Experimental Results [PDF]

open access: yesMaterials Research, 2017
The application of cellular automata in materials science requires the conversion of the automata's rules and abstract general properties to rules and properties associated with the material and phenomena under study.
Rodrigo José Contieri   +2 more
doaj   +1 more source

Preparation of Sm0.2Ce0.8O1.9 electrolytes via the chitosan templating method and investigation of the sintering behavior

open access: yesJournal of Asian Ceramic Societies, 2021
Sm0.2Ce0.8O1.9 electrolytes were prepared using a novel chitosan templating method. To examine the sintering kinetics of the materials, 5 minutes, 1 hour, and 6 hours of sintering processes were carried out at 1200, 1300, and 1400 ⁰C. The phase structure
Dilara Güçtaş   +2 more
doaj   +1 more source

A design for preparation of textured piezoelectric ceramics based on the phase-field simulation

open access: yesJournal of Advanced Dielectrics, 2022
To solve the problem of directional arrangement of small template particles, we designed a lamination technique for the preparation of dense ceramics with high texture degree based on the phase-field simulation.
Yongmei Zhang, Liangliang Liu
doaj   +1 more source

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