Results 161 to 170 of about 3,346 (213)
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Applied Mechanics and Materials, 2015
The relevance of investigating the problem of loading a diamond abrasive tool with a metallic binder to improve the efficiency of finishing treatment of a wide range of high-strength materials is addressed in the paper. The results of theoretical and experimental studies of the formation of a greasy layer on the surface of diamond wheels in the ...
Alexander Yanyushkin +3 more
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The relevance of investigating the problem of loading a diamond abrasive tool with a metallic binder to improve the efficiency of finishing treatment of a wide range of high-strength materials is addressed in the paper. The results of theoretical and experimental studies of the formation of a greasy layer on the surface of diamond wheels in the ...
Alexander Yanyushkin +3 more
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Kinematics of the grinding process
Materials Today: Proceedings, 2021Abstract The possibility of chip removal is governed by the section thickness, properties of metal under deformation speed, geometric parameters of cutting edges of the wheel. Randomized geometry and arbitrary location of cutting edges on the work surface of grinding wheel allow the application of probabilistic-statistical approach for description of
Tatiyna Nikolaevna Ivanova +3 more
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Visualization of Grinding Processes
1999In grinding technology, the application of superabrasives and increasing demands for higher productivity and higher quality require an appropriate selection of optimum set-up parameters. An efficient way to determine and test these parameters is modeling and simulating the grinding process.
Markus Fiege +3 more
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Journal of Engineering for Industry, 1969
The paper describes a theoretical investigation on chatter vibrations of cylindrical plunge grinding. The system grinding machine-grinding wheel-workpiece is represented as a closed loop system with two feedback paths, one due to the machine tool structure, the other to the regenerative effect of the grinding wheel.
B. Bartalucci, G. G. Lisini
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The paper describes a theoretical investigation on chatter vibrations of cylindrical plunge grinding. The system grinding machine-grinding wheel-workpiece is represented as a closed loop system with two feedback paths, one due to the machine tool structure, the other to the regenerative effect of the grinding wheel.
B. Bartalucci, G. G. Lisini
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Grinding Equipment and Processes
1989AbstractMetal is removed from the workpiece by the mechanical action of irregularly shaped abrasive grains in all grinding operations. This article discusses three primary components of grinding wheels, namely, abrasive (the cutting tool), bond (the tool holder), and porosity or air for chip clearance and/or the introduction of coolant.
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Estimation of the Grinding Time by Means of the Grinding Process Model
Advanced Materials Research, 2012In grinding operation, elastic deformations of the grinding machine and the grinding wheel induce a residual stock removal of workpiece. On the other hand, thermal expansions of the workpiece and the grinding wheel increase the depth of cut. Therefore, calculation of a ground depth of cut and/or the grinding time has to be considered by the elastic ...
Takazo Yamada +2 more
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1986
The problem of manufacturing high-quality parts at low cost confronts many companies. The cost of processing information required in the manufacturing process is substantial. With the introduction of computer-aided manufacturing, computer-aided process planning, and flexible manufacturing systems, the need for accurate, reliable process and equipment ...
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The problem of manufacturing high-quality parts at low cost confronts many companies. The cost of processing information required in the manufacturing process is substantial. With the introduction of computer-aided manufacturing, computer-aided process planning, and flexible manufacturing systems, the need for accurate, reliable process and equipment ...
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Processing (Grinding and Polishing)
1998Firstly, the nature and the goal of the three traditional manufacturing steps of optics, and the techniques applied there, should be pointed out.
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In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process
Mechanical Systems and Signal Processing, 2021Fei Qin, Yanwei Dai, Yanpeng Gong
exaly