On-Machine Precision Truing and Error Compensation of Cup-Shaped Diamond Grinding Wheels with Arc-Shaped Cutting Edge. [PDF]
Micromachines (Basel)Guo Y, Yin Z.
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Experimental Study on the Role of Bond Elasticity and Wafer Toughness in Back Grinding of Single-Crystal Wafers. [PDF]
Materials (Basel)Yun JC, Lim DS.
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Editorial for the Special Issue on Advanced Abrasive Processing Technology and Applications. [PDF]
Materials (Basel)Gao Y.
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Experimental Analysis of the Correlation Between Cutting Parameters and Recurrence Measures During End Mill Flute Grinding. [PDF]
Materials (Basel)Kęcik K, Sałata M.
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Characteristics of Pulsed-Laser-Induced Layers with Cracks Prepared for SiC Grinding Processes. [PDF]
Materials (Basel)Li H, Jiang Y, Yang Y, Yang J, Zhu L.
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Study on Water-Jet-Guided Laser-Ultrasonic Grinding Hybrid Processing Technology for SiC<sub>f</sub>/SiC Composite Materials. [PDF]
Materials (Basel)Yu G, Zhang D, Pei X, Yang F.
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Study on the Low-Damage Material Removal Mechanism of Silicon Carbide Ceramics Under Longitudinal-Torsional Ultrasonic Grinding Conditions. [PDF]
Micromachines (Basel)Liu J, Ma Z, Yan Y, Yuan D, Wang Y.
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Curvature-Adoptive CNC Machining of Freeform Optics via Dynamic Tangential Toolpath Optimization. [PDF]
Materials (Basel)Singh RP, Chen Y.
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Influence of Grinding Parameters on Surface Roughness and Subsurface Crack Damage Depth of Sapphire Crystal. [PDF]
Materials (Basel)Hou Y, Gao Y, Yang C.
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