Femtosecond laser hybrid processing strategy of transparent hard and brittle materials [PDF]
With high hardness, high thermal stability, chemical inertness and excellent optoelectronic properties, transparent hard and brittle materials have drawn significant attentions in frontier domains such as aerospace, photoelectric detection, and high ...
Jia-Wei Tan +16 more
doaj +6 more sources
Insight on the regulation mechanism of the nanochannels in hard and brittle materials induced by sparially shaped femtosecond laser [PDF]
The efficient fabrication of nanochannels on hard and brittle materials is a difficult task in the field of micro and nano processing. We have realized nanochannel arrays on silica with characteristic scales varying from 50–230 nm using a single ...
Lin Kai +8 more
doaj +4 more sources
Critical Depth of Hard Brittle Materials on Nano Plastic Forming
This paper reports on ductile to brittle transition of hard brittle materials in nano plastic forming process. Formability of some hard brittle materials, i.e., glasses, silicon and quartz wafers, were examined through a specially designed and developed ...
Masahiko YOSHINO +3 more
doaj +6 more sources
Mathematical Modeling and Experimental Study of Cutting Force for Cutting Hard and Brittle Materials in Fixed Abrasive Trepanning Drill [PDF]
Hard and brittle materials have excellent physical and mechanical performance, which are widely applied in the fields of microelectronics and optoelectronics.
Ruijiang Yu +3 more
doaj +2 more sources
Micromechanics of Machining and Wear in Hard and Brittle Materials. [PDF]
Abstract Hard and brittle solids with covalent/ionic bonding are used in a wide range of modern‐day manufacturing technologies. Optimization of a shaping process can shorten manufacturing time and cost of component production, and at the same time extend component longevity.
Lawn BR +3 more
europepmc +7 more sources
Hard brittle materials such as ceramics and crystals are commonly utilized in various industries, including information technology, mechanical engineering, and semiconductors.
Huina Qian +6 more
doaj +3 more sources
An Improved Cutting Force Model for Ultrasonically Assisted Grinding of Hard and Brittle Materials
Cutting force is one of the most important factors in the ultrasonically assisted grinding (UAG) of hard and brittle materials. Many theoretical and experimental studies show that UAG can effectively reduce cutting forces.
Renke Kang +5 more
doaj +3 more sources
A Review of an Investigation of the Ultrafast Laser Processing of Brittle and Hard Materials
Ultrafast laser technology has moved from ultrafast to ultra-strong due to the development of chirped pulse amplification technology. Ultrafast laser technology, such as femtosecond lasers and picosecond lasers, has quickly become a flexible tool for processing brittle and hard materials and complex micro-components, which are widely used in and ...
Xuewen Fu, , Jiecai Feng
exaly +3 more sources
Enhancing the Machinability of Sapphire via Ion Implantation and Laser-Assisted Diamond Machining [PDF]
Sapphire crystals, owing to their outstanding mechanical and optical properties, which are widely used in advanced optics, microelectronic devices, and medical instruments. The manufacturing precision of sapphire optical components critically affects the
Jinyang Ke +5 more
doaj +2 more sources
Transforming Grain‐Boundary Brittle Precipitates to Ductility Pathways in Complex Concentrated Alloy [PDF]
Conventional wisdom holds that hard grain‐boundary (GB) precipitates embrittle structural alloys by acting as crack initiation sites. In this work, we overturn this paradigm through atomic‐scale interfacial engineering, transforming brittle GB phases ...
Zhixin Li +14 more
doaj +2 more sources

