Results 171 to 180 of about 217,206 (337)
Supply of Oxygen During Hatching of the Nematode Meloidogyne Javanica Under Non-Competitive Conditions [PDF]
N Collis-George, HR Wallace
openalex +2 more sources
Characterization and Inverse Design of Stochastic Mechanical Metamaterials Using Neural Operators
This study presents a DeepONet‐based machine learning framework for designing stochastic mechanical metamaterials with tailored nonlinear mechanical properties. By leveraging sparse but high‐quality experimental data from in situ micro‐mechanical tests, high predictive accuracy and enable efficient inverse design are achieved.
Hanxun Jin+7 more
wiley +1 more source
Surprisingly, a cell can bind to itself to make a self‐adhesion, which engineered here to improve how cells attach to biomaterials. Nanoprinting are used to make 3D structures smaller than cells–called Self‐Adhesion‐Tunnels (SATs)–around which cells can wrap and bind to themselves.
Anamika Singh+4 more
wiley +1 more source
Adaptive Epitaxy of C‐Si‐Ge‐Sn: Customizable Bulk and Quantum Structures
This work pushes the boundaries of epitaxy by achieving all‐group‐IV semiconductor heterostructures and extensive characterization. The alloys open new research topics in material properties investigation for next‐generation electronic and optoelectronic device technologies.
Omar Concepción+15 more
wiley +1 more source
Deep Eutectic Inks for Multiphoton 3D Laser Microprinting
Using deep eutectic inks in multiphoton 3D laser printing enables excellent printability of soft and elastic complex 3D microstructures. This is achieved by employing supramolecular interactions between a variety of monomers and a metal halide, which is easily removed during development. The new ink design is extendable to other monomer compositions to
Philipp Mainik+4 more
wiley +1 more source
This article introduces a hybrid manufacturing approach to create conductive pathways in additively manufactured fully‐aromatic polyimides. This is enabled through a combination of high‐resolution laser scribing process for fabricating graphene and metallizing it with electrodeposition of copper to further increase conductivity.
Heather D. Wotton+6 more
wiley +1 more source
Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging
Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek+4 more
wiley +1 more source