Results 121 to 130 of about 2,576,432 (406)
Binder‐free EGaIn–CB composite deliver printable, recyclable liquid‐metal conductors without sintering or polymer binders. Only 1.5 wt% CB yields shear‐thinning, high‐viscosity rheology, ∼60% bulk EGaIn conductivity, robust stretchability, high thermal conductivity, and strong EMI shielding (35 → 70 dB at 100% strain).
Elahe Parvini +4 more
wiley +1 more source
Design Of An Active Cpu Cooler Design Incoprating Heat Spreader [PDF]
This poster designed an active heat sink to cool a silicon CPU that dissipates 130 W of heat. The active CPU cooler is composed of a fan sitting above the heat sink, an aluminum radial heat sink, a copper heat spreader at the base of the heat sink and a ...
Mukherjee, Krishnendu +1 more
core
Influence of Outcoupling Layers on Top‐Emitting Perovskite Light‐Emitting Diodes
Top‐emitting perovskite LEDs offer benefits over typical bottom‐emitting architectures, toward lasing, improved thermal management, and on‐chip fabrication compatibility. Outcoupling layers offer a strategy uniquely applicable to top‐emitting LEDs to optimize EQE by improving optical outcoupling.
James C. Loy +5 more
wiley +1 more source
Soft Robotic Snake with Tunable Undulatory Gait for Efficient Underwater Locomotion
This study designs an underwater soft snake robot using 3D‐printed soft actuators, controlled by specific signals to generate sinusoidal undulation. Results show a positive correlation between speed and swing amplitude, with optimal performance at 2/3π phase offset, PLA tail, 1.2 voltage growth rate, and 6s undulation period achieving a maximum speed ...
Huichen Ma, Junjie Zhou, Raye Yeow
wiley +1 more source
Thermal management at a high heat flux is crucial for electronic devices, and jet impingement cooling is a promising solution. The heat transfer properties of a rectangular-finned heat sink are investigated under angled and multi-impingement jet ...
Altug Karabey, Dogan Yorulmaz
doaj +1 more source
Heat pipe thermal switch [PDF]
A thermal switch for controlling the dissipation of heat between a body is described. The thermal switch is comprised of a flexible bellows defining an expansible vapor chamber for a working fluid located between an evaporation and condensation chamber ...
Wolf, D. A.
core +1 more source
Thermal Performance Investigation of Slotted Fin Minichannel Heat Sink for Microprocessor Cooling [PDF]
Taha Baig +7 more
openalex +1 more source
3D Printing of Soft Robotic Systems: Advances in Fabrication Strategies and Future Trends
Collectively, this review systematically examines 3D‐printed soft robotics, encompassing material selections, function integration, and manufacturing methodologies. Meanwhile, fabrication strategies are analyzed in order of increasing complexity, highlighting persistent challenges with proposed solutions.
Changjiang Liu +5 more
wiley +1 more source
Study on Heat Transfer Enhancement of Lotus-type Porous Copper Heat Sink
Lotus-type porous copper is a new kind of micro-channel structure with long cylindrical pores aligned in one direction. It can be used as a heat sink for cooling of high-power electronic components. Through experiments and numerical simulations with Flow
Wu Jian +3 more
doaj +2 more sources

