Results 41 to 50 of about 33,872 (262)
A simplified thermoplastic pultrusion model is developed to predict thermal fields in glass fiber/polyethylene terephthalate (GF/PET) composites with reduced computational cost. By combining effective material homogenization, validation against literature data, and Gaussian‐process‐based optimization, the study reveals how heating limits, pulling speed,
Elder Soares +3 more
wiley +1 more source
Do not let thermal drift and instrument artifacts deceive high‐temperature nanoindentation results. We compare classical Oliver–Pharr and automatic image recognition analyses across steels and a Ni alloy to quantify these effects. Accounting for artifacts reveals systematic softening with temperature, while Cr and Ni additions boost resistance ...
Velislava Yonkova +2 more
wiley +1 more source
A phase change materials (PCM)-based heat sink is an effective way to cool intermittent high-power electronic devices in aerospace applications such as airborne electronics and aircraft external carry. Optimizing the heat sink is significant in designing
Jianjun Zhang +4 more
doaj +1 more source
Comparison of Triply Periodic Minimal Surface Energy Absorbers Under Uniaxial Compressive Loading
This study investigates LCD 3D printed Triply Periodic Minimal Surface (TPMS) structures as mechanical energy absorbers. By comparing various base designs and layered combinations under uniaxial compression, it identifies that a Diamond‐Gyroid sandwich structure offers superior performance.
Sergej Grednev +2 more
wiley +1 more source
Multilayer Self‐Limiting Electrospray Deposition via Stepped Voltage Bias
Self‐limiting electrospray deposition (SLED) uses a high voltage to generate and deposit a charged payload on a target surface. The coating retains its charge, repelling newly arriving material. SLED thickness can be decreased by applying a secondary bias to the target.
Madhuri Deb +3 more
wiley +1 more source
Thermal Performance of Hollow Fluid-Filled Heat Sinks
The increasing power density of electronic devices drives the need for lighter, more compact heat dissipation devices. This research determines whether a hollow heat sink filled with fluid outperforms solid heat sinks for heat dissipation.
John Nuszkowski +3 more
doaj +1 more source
Controlling the Field Assisted Sintering Technology (FAST) parameters, dwell temperature and cooling rate, significantly influences the microstructural evolution in titanium aluminide GE4822. Significant γ‐lamellar colonies develop only upon cooling through the α‐transus.
Jack Krohn, James Pepper, Martin Jackson
wiley +1 more source
Herein, we numerically investigated methods to improve heat dissipation from the base of a phase-change material (PCM) heat sink exposed to high heat flux (15 W/cm2).
Salah Addin Burhan Al-Omari +3 more
doaj +1 more source
Multiple Phase Change Material (PCM) Configuration for PCM-Based Heat Sinks—An Experimental Study
A small-scale phase change material (PCM)-based heat sink can regulate the temperature of electronics due to high latent-heat capacity. Three different heat sinks are examined to study the effects of PCM combination, arrangement of PCMs in multiple-PCM ...
Idris Al Siyabi +3 more
doaj +1 more source
Optimal heat dissipation in power modules can significantly increase their power density. Removing the generated heat is critical for capturing the benefits of advanced semiconductor materials and improving the reliability of the device operation.
Emre Gurpinar, Raj Sahu, Burak Ozpineci
doaj +1 more source

