Results 1 to 10 of about 22,733 (264)

Co-packaged electronics with microfluidics for direct-to-package cooling [PDF]

Communications Engineering
Power semiconductors operating under high heat fluxes and elevated temperatures rely on liquid-cooled heat sinks with substantial coolant volumes. Recent advancements in direct-to-chip (D2C) cooling techniques have shown enhanced thermal performance ...
Henry A. Martin, Zihan Zhang, Mahad Saeed, Sander Dorrestein, Edsger C. P. Smits, René H. Poelma, Willem D. van Driel, GuoQi Zhang   +7 more
doaj   +2 more sources

Miniature vapor compression refrigeration system for electronics cooling

Case Studies in Thermal Engineering, 2019
A miniature vapor compression refrigeration system using R134a is investigated for electronics cooling. The system consists of four main components: an evaporator, a compressor, a capillary tube, and a condenser.
Akasit Poachaiyapoom, Rattapon Leardkun, Jirawat Mounkong, Somchai Wongwises   +3 more
doaj   +3 more sources

Electronic Cooling in Graphene [PDF]

Physical Review Letters, 2009
corrected typos and added ...
Bistritzer, R., MacDonald, A. H.
openaire   +3 more sources

Coherent Electron Cooling [PDF]

Physical Review Letters, 2009
Cooling intense high-energy hadron beams poses a major challenge for modern accelerator physics. The synchrotron radiation emitted from such beams is feeble; even in the Large Hadron Collider (LHC) operating with 7 TeV protons, the longitudinal damping time is about 13 hours.
Vladimir N, Litvinenko, Yaroslav S, Derbenev   +1 more
openaire   +2 more sources

Design and Optimization of Heat Sinks for the Liquid Cooling of Electronics with Multiple Heat Sources: A Literature Review

Energies, 2023
This paper presents a detailed literature review on the thermal management issue faced by electronic devices, particularly concerning uneven heating and overheating problems.
Yijun Li, Stéphane Roux, Cathy Castelain, Yilin Fan, Lingai Luo   +4 more
doaj   +1 more source

Techno-economic feasibility analysis of an extreme heat flux micro-cooler

iScience, 2023
Summary: An estimated 70% of the electricity in the United States currently passes through power conversion electronics, and this percentage is projected to increase eventually to up to 100%.
Ercan M. Dede, Chi Zhang, Qianying Wu, Neda Seyedhassantehrani, Muhammad Shattique, Souvik Roy, James W. Palko, Sreekant Narumanchi, Bidzina Kekelia, Sougata Hazra, Kenneth E. Goodson, Roman Giglio, Mehdi Asheghi   +12 more
doaj   +1 more source

A Review of Recent Developments in “On-Chip” Embedded Cooling Technologies for Heterogeneous Integrated Applications

Engineering, 2023
The electronics packaging community strongly believes that Moore’s law will continue for another few years due to recent technological efforts to build heterogeneously integrated packages. Heterogeneous integration (HI) can be at the chip level (a single
Srikanth Rangarajan, Scott N. Schiffres, Bahgat Sammakia   +2 more
doaj   +1 more source

A Comprehensive Review on the Core Thermal Management Improvement Concepts in Power Electronics

IEEE Access, 2020
A heat sink is a specific type of heat exchanger integrated with heat generating devices - mostly electronics - for the sake of thermal management. In the design procedure of heat sinks, several considerations such as manufacturing cost, reliability ...
Sina Lohrasbi, Rene Hammer, Werner Essl, Georg Reiss, Stefan Defregger, Wolfgang Sanz   +5 more
doaj   +1 more source

Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review

Energies, 2022
In recent years, global automotive industries are going through a significant revolution from traditional internal combustion engine vehicles (ICEVs) to electric vehicles (EVs) for CO2 emission reduction.
Yi-Gao Lv, Gao-Peng Zhang, Qiu-Wang Wang, Wen-Xiao Chu   +3 more
doaj   +1 more source

A Novel Manifold Dual-Microchannel Flow Field Structure with High-Performance Heat Dissipation

Micromachines, 2022
With the development of miniaturization and integration of electronic devices, the conventional manifold microchannels (MMCs) structure has been unable to meet the heat dissipation requirements caused by the rapid growth of internal heat flux.
Xing Yang, Kabin Lin, Daxing Zhang, Shaoyi Liu, Baoqing Han, Zhihai Wang, Kunpeng Yu, Wenzhi Wu, Dongming Ge, Congsi Wang   +9 more
doaj   +1 more source