Results 1 to 10 of about 34,254 (306)
Co-packaged electronics with microfluidics for direct-to-package cooling [PDF]
Communications EngineeringPower semiconductors operating under high heat fluxes and elevated temperatures rely on liquid-cooled heat sinks with substantial coolant volumes. Recent advancements in direct-to-chip (D2C) cooling techniques have shown enhanced thermal performance ...
Henry A. Martin +7 more
doaj +2 more sources
Miniature vapor compression refrigeration system for electronics cooling
Case Studies in Thermal Engineering, 2019 A miniature vapor compression refrigeration system using R134a is investigated for electronics cooling. The system consists of four main components: an evaporator, a compressor, a capillary tube, and a condenser.
Akasit Poachaiyapoom +3 more
doaj +3 more sources
Experimental Investigation of Flash Spray Cooling for Power Electronics
EnergiesPower electronics convert and control electrical power in applications ranging from electric motors to telecommunications and computing. Ongoing efforts to miniaturize these systems and boost power density demand advanced thermal management solutions to ...
Dimitrios Kotsopoulos +8 more
doaj +2 more sources
Co-designing electronics with microfluidics for more sustainable cooling
Nature, 2020 Remco Van Erp +2 more
exaly +3 more sources
Energies, 2023 This paper presents a detailed literature review on the thermal management issue faced by electronic devices, particularly concerning uneven heating and overheating problems.
Yijun Li +4 more
doaj +1 more source
, 2016 Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling.
core +2 more sources
Techno-economic feasibility analysis of an extreme heat flux micro-cooler
iScience, 2023 Summary: An estimated 70% of the electricity in the United States currently passes through power conversion electronics, and this percentage is projected to increase eventually to up to 100%.
Ercan M. Dede +12 more
doaj +1 more source
Engineering, 2023 The electronics packaging community strongly believes that Moore’s law will continue for another few years due to recent technological efforts to build heterogeneously integrated packages. Heterogeneous integration (HI) can be at the chip level (a single
Srikanth Rangarajan +2 more
doaj +1 more source
A Comprehensive Review on the Core Thermal Management Improvement Concepts in Power Electronics
IEEE Access, 2020 A heat sink is a specific type of heat exchanger integrated with heat generating devices - mostly electronics - for the sake of thermal management. In the design procedure of heat sinks, several considerations such as manufacturing cost, reliability ...
Sina Lohrasbi +5 more
doaj +1 more source
Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review
Energies, 2022 In recent years, global automotive industries are going through a significant revolution from traditional internal combustion engine vehicles (ICEVs) to electric vehicles (EVs) for CO2 emission reduction.
Yi-Gao Lv +3 more
doaj +1 more source