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Miniature vapor compression refrigeration system for electronics cooling
Case Studies in Thermal Engineering, 2019 A miniature vapor compression refrigeration system using R134a is investigated for electronics cooling. The system consists of four main components: an evaporator, a compressor, a capillary tube, and a condenser.
Akasit Poachaiyapoom +3 more
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Co-packaged electronics with microfluidics for direct-to-package cooling [PDF]
Communications EngineeringPower semiconductors operating under high heat fluxes and elevated temperatures rely on liquid-cooled heat sinks with substantial coolant volumes. Recent advancements in direct-to-chip (D2C) cooling techniques have shown enhanced thermal performance ...
Henry A. Martin +7 more
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Energies, 2023 This paper presents a detailed literature review on the thermal management issue faced by electronic devices, particularly concerning uneven heating and overheating problems.
Yijun Li +4 more
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Techno-economic feasibility analysis of an extreme heat flux micro-cooler
iScience, 2023 Summary: An estimated 70% of the electricity in the United States currently passes through power conversion electronics, and this percentage is projected to increase eventually to up to 100%.
Ercan M. Dede +12 more
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Engineering, 2023 The electronics packaging community strongly believes that Moore’s law will continue for another few years due to recent technological efforts to build heterogeneously integrated packages. Heterogeneous integration (HI) can be at the chip level (a single
Srikanth Rangarajan +2 more
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A Comprehensive Review on the Core Thermal Management Improvement Concepts in Power Electronics
IEEE Access, 2020 A heat sink is a specific type of heat exchanger integrated with heat generating devices - mostly electronics - for the sake of thermal management. In the design procedure of heat sinks, several considerations such as manufacturing cost, reliability ...
Sina Lohrasbi +5 more
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Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review
Energies, 2022 In recent years, global automotive industries are going through a significant revolution from traditional internal combustion engine vehicles (ICEVs) to electric vehicles (EVs) for CO2 emission reduction.
Yi-Gao Lv +3 more
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Optimization of heat sinks with plate fins in air-jet cooling
Nihon Kikai Gakkai ronbunshu, 2014 Heat density of high-load electronics such as high-performance servers and the inverters used in vehicles has been increasing as the result of higher processing speeds and computational scale, and higher output, etc.
Takayuki ATARASHI +2 more
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Review of Electronic Cooling and Thermal Management in Space and Aerospace Applications
Engineering ProceedingsThe continuous miniaturization of electronics, high processing capacity, compact microelectronic devices, and high circuit density contribute to an increasing demand for the efficient cooling of electronics.
Kivilcim Ersoy
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Experimental Investigation of Flash Spray Cooling for Power Electronics
EnergiesPower electronics convert and control electrical power in applications ranging from electric motors to telecommunications and computing. Ongoing efforts to miniaturize these systems and boost power density demand advanced thermal management solutions to ...
Dimitrios Kotsopoulos +8 more
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