Results 31 to 40 of about 34,254 (306)

Radiative cooling drives the integration and application of thermal management in flexible electronic devices

open access: yesnpj Flexible Electronics
Flexible electronics advancement intensifies thermal management needs. Radiative cooling shows promise but faces implementation challenges. Integration into diverse flexible electronics demands application-specific materials and processes.
Maoquan Zhang   +3 more
doaj   +1 more source

Prolonged silicon carbide integrated circuit operation in Venus surface atmospheric conditions

open access: yesAIP Advances, 2016
The prolonged operation of semiconductor integrated circuits (ICs) needed for long-duration exploration of the surface of Venus has proven insurmountably challenging to date due to the ∼ 460 °C, ∼ 9.4 MPa caustic environment.
Philip G. Neudeck   +5 more
doaj   +1 more source

Cooling high power electronics using dynamic phase change material

open access: hybridInternational Journal of Heat and Mass Transfer
Soonwook Kim   +2 more
exaly   +2 more sources

Carboxylic‐Acid Functionalized Multiwalled Carbon Nanotube‐Alkane‐Based Resistive Temperature Sensor for Cold Chain Applications

open access: yesAdvanced Engineering Materials, EarlyView.
This study presents a reversible temperature sensor with high switching ratio, ∼103. The device is fabricated using PET‐ITO and carbon nanotube dispersions in alkane. Considering its application in cold chain logistics, a proof‐of‐concept with LED is showcased. Thus, a temperature drop below the threshold temperature (crystallization temperature of the
Sunil Kumar Behera   +8 more
wiley   +1 more source

Power Electronics High Performance Air-Cooled Heat Sinks IntegratingGraphite Based Materials

open access: yes, 2021
The thermal management of the power electronics cooling in the aircraft is getting more attention in the recent years due to the progressive implementation of electrical systems, especially in the framework of the more electrical aircraft, one of Clean ...
Oliet Casasayas, Carles   +18 more
core   +1 more source

Variable Stiffness Flexure Structures Enabled by Phase‐Change Gallium and Adhesive Interfacial Locking for Soft Robotic Applications

open access: yesAdvanced Engineering Materials, EarlyView.
A flexure‐based variable stiffness structure is developed by integrating phase‐change modulation and adhesive interfacial locking of gallium. The design enables a wide stiffness variability, transitioning from soft, flexible behavior to rigid, load‐supporting performance.
Sungjin Kim   +2 more
wiley   +1 more source

Review of Cryogenic Power Electronics for All-Electric Aircraft

open access: yesIEEE Access
To tackle emissions from the aviation industry and make it sustainable, research has been targeting electrifying aircraft. For this aim, articles have been focusing on how to replace regular jet engines with liquid hydrogen as fuel.
Abdelrahman Elwakeel   +5 more
doaj   +1 more source

Fostering Innovation: Streamlining Magnetocaloric Materials Research by Digitalization

open access: yesAdvanced Engineering Materials, EarlyView.
Magnetocaloric cooling (MCE) is an environmentally friendly refrigeration method with great potential. Optimizing MCE materials involves the preparation and screening of large quantities of samples, which in turn generates a large amount of data. A digitalization approach is presented that uses ontologies, knowledge graphs, and digital workflows to ...
Simon Bekemeier   +17 more
wiley   +1 more source

Modelagem da transferência de calor com e sem mudança de fase no resfriamento por spray (Spray Cooling) [PDF]

open access: yes, 2012
Dissertação (mestrado) - Universidade Federal de Santa Catarina, Centro Tecnológico, Programa de Pós-Graduação em Engenharia Mecânica, Florianópolis, 2010Nos últimos vinte anos, com a progressiva miniaturização de quipamentos e sistemas de engenharia e ...
Lückmann, Antônio José
core  

Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration

open access: yesNature Communications, 2022
Efficient thermal structure and precise heat management become a substantial challenge for electronics. Here, authors utilize the synergistic effect of classic heat transfer and electrocaloric cooling for fixed-point thermal management of chips.
Ming-Ding Li   +7 more
doaj   +1 more source

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