Results 51 to 60 of about 5,054,271 (238)

Entropy‐Driven Design of Low‐Melting‐Point Alloys via Compositionally Complex Strategy

Advanced Engineering Materials, EarlyView.
Conventional low‐melting‐point alloys (LMPAs) are limited by a narrow compositional space and inherent property trade‐offs. This review presents an entropy‐driven design strategy that overcomes these limitations, ushering in a new class of low‐melting‐point compositionally complex alloys (LMCCAs).
Yinghui Shang, Jianxiang Zhao, Zhaoqi Chen, Hao Gong, Yinsen Yan, Junlei Tao, Yong Yang   +6 more
wiley   +1 more source

Design and analysis of a novel thermal management system for serving next-generation aircraft with megawatt-level heat loads

Case Studies in Thermal Engineering
Due to the development of electronics and high-energy pulse devices, in conjunction with the increasing flight speeds, the instantaneous heat load of next-generation aircraft will reach the megawatt level, which poses severe challenges for thermal ...
Xiaochuan Liu, Guiping Lin, Jinghui Guo, Xingzhuang Liang, Zhenghong Li, Haichuan Jin   +5 more
doaj   +1 more source

Fabrication Routes for Ionic Conducting Fiber Strain Sensors

Advanced Engineering Materials, EarlyView.
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw, Zhanhong Yang, Anne Ladegaard Skov, Magdalena Skowyra   +3 more
wiley   +1 more source

Materials‐Driven Additive Manufacturing for Electrical Machines: Qualification‐Oriented Design Beyond Geometric Freedom

Advanced Engineering Materials, EarlyView.
This perspective reframes additive manufacturing for electrical machines as a qualification‐limited materials and architecture design problem. It links process–structure–property–performance relationships to magnetic, conducting, dielectric, and thermal property windows, highlighting where AM can enable segmented magnetic circuits, permanent magnet ...
Dénes Fodor, Loránd Szabó
wiley   +1 more source

Topology-optimised near-chip microfluidic cooling for high power electronics

Case Studies in Thermal Engineering
As front-end transistor scaling slows, advanced packaging approaches such as 2.5D/3D integration and co-packaged architectures are making thermal management an increasingly important package-level design challenge.
Zihan Zhang, Henry A. Martin, Edsger C.P. Smits, René Poelma, Jiajie Fan, Willem D. van Driel, GuoQi Zhang   +6 more
doaj   +1 more source

Analysis of The Effect of Heat Treatment on Changes in Mechanical Properties and Electronic Performance of Thin Foil for Electronic Components [PDF]

E3S Web of Conferences
The rapid development of the electronics industry creates a need for small-sized materials with good mechanical properties and electronic performance to improve efficiency during production. However, in thin materials deformation is prone to occur during
Aziz Abdul, Fitrullah Muhammad, Suryana, Senja Aulia Kemuning, Sulaiman Fatah, Santoso Muhammad Iman   +5 more
doaj   +1 more source

Supporting AI Readiness Through Digital Workflows in Materials Science

Advanced Engineering Materials, EarlyView.
Digitalization drives innovation in materials science by connecting data silos and turning heterogeneous processes into reusable research pipelines. Across 13 MaterialDigital projects, digital workflows reveal complementary pathways toward AI‐ready materials research, founded on structured data, persistent artifacts, executable orchestration, and ...
Marian Bruns, Lateef Abdul, Stephan Barth, Martin Glauer, Manuel Günther, Fabian Neuhaus, Jan‐Ole Perschewski, Thomas Bjarsch, Henrik Abel, Johannes Bosch, Niklas Meyer, Peter Hofmann, Marc Drechsler, Alexander Dyck, Dhanunjaya Kumar Nerella, Marvin Tegeler, Oleg Shchyglo, Ingo Steinbach, Timo Klecker, Henk Birkholz, Ehsan Borzabadi Farahani, Bernard Fedelich, Cetin Haftaoglu, Tarakeshwar Lakshmipathy, Elena Garcia Trelles, Christoph Schweizer, Reza Darvishi Kamachali, Lukas Koschmieder, Janin Eiken, Markus Apel, Sung‐Min Wi, Jiangdong Zhao, Andreas Fezer, Nicolas Christ, Patrick Schneider, Eldor Urinov, Veit Königer, Volker Knoblauch, Janik Harter, Thomas Seifert, Thitichai Janpheng, Florian Fuchs, Fabian Teichert, Jörg Schuster, Anke Bardehle, Andreas Limper, Ulrich Giese, Carlos Lucke, Mario Beiner, Christoph Gögelein, Lisa Leuchtenberger‐Engel, Christian Hopmann, Felix Wentzien, Heike Wittek, Benjamin Klie, Alexander Röhrs, Ludger Overmeyer, Achraf Atila, Marcel Sadowski, Leopold Talirz, Jan Janssen, Jesper R. Pedersen, Peter Beck, Tejs Vegge, Ivano E. Castelli, Wolfgang Wenzel, Tilmann Hickel, Jörg Schaarschmidt   +67 more
wiley   +1 more source

Simulation and Experimental Study of Ventilated Active Cooling for the Logging Tool Electronics Section

Cejing jishu
Passive thermal management systems are effective in slowing the rate of temperature rise of the logging tool electronics section. However, its excellent thermal insulation performance simultaneously leads to the slow cooling rate of the logging tool ...
YANG Gengjia, DENG Chao, PENG Jiale, TIAN Zhibin, WEI Zanqing, LUO Xiaobing   +5 more
doaj   +1 more source

Composites of Shellac and Silver Nanowires as Flexible, Biobased, and Corrosion‐Resistant Transparent Conductive Electrodes

Advanced Functional Materials, EarlyView.
Shellac, a centuries‐old natural resin, is reimagined as a green material for flexible electronics. When combined with silver nanowires, shellac films deliver transparency, conductivity, and stability against humidity. These results position shellac as a sustainable alternative to synthetic polymers for transparent conductors in next‐generation ...
Rahaf Nafez Hussein, Tiago Carneiro Gomes, Eliza Ng, Simon Rondeau‐Gagné, Tricia Breen Carmichael   +4 more
wiley   +1 more source

Experimental investigation of non-uniform heating effect on flow boiling instabilities in a microchannel-based heat sink [PDF]

, 2011
Copyright @ 2011 ElsevierTwo-phase flow boiling in microchannels is one of the most promising cooling technologies for coping with high heat fluxes produced by the next generation of central processor units (CPUs).
Bogojevic, D, Cummins, G, Karayiannis, T. G., T.G. Karayiannis, Lin, H., H. Lin, D. Bogojevic, K. Sefiane, D.B.R. Kenning, A.J. Walton, G. Cummins, Lin, H, Sefiane, K, Sefiane, K., Walton, AJ, Walton, A. J., Cummins, G.; id_orcid, Bogojevic, D., Karayiannis, TG, Kenning, DBR, Kenning, D. B. R.   +20 more
core   +1 more source