Results 51 to 60 of about 198,611 (304)

Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration

Nature Communications, 2022
Efficient thermal structure and precise heat management become a substantial challenge for electronics. Here, authors utilize the synergistic effect of classic heat transfer and electrocaloric cooling for fixed-point thermal management of chips.
Ming-Ding Li, Xiao-Quan Shen, Xin Chen, Jia-Ming Gan, Fang Wang, Jian Li, Xiao-Liang Wang, Qun-Dong Shen   +7 more
doaj   +1 more source

Cooling and Diffusion Rates in Coherent Electron Cooling Concepts

, 2021
Proceedings of the 12th International Particle Accelerator Conference, IPAC2021, Campinas, SP ...
Nagaitsev, Sergei, Lebedev, Valeri, Stupakov, Gennady, Wang, Erdong, Bergan, William   +4 more
openaire   +2 more sources

Interaction between Molten Al‐Killed Mn–B Steel and Carbon‐Bonded MgO Refractories Based on Recyclates

Advanced Engineering Materials, EarlyView.
High‐temperature interactions between low‐sulfur Al‐killed Mn–B steel and MgO–C refractories (0 and 50 wt% recyclates) are studied via finger immersion tests (1600 °C). Surface‐active elements influence infiltration. MgO/CaS layer forms, along with spinel and calcium silicate.
Matheus Roberto Bellé, Lukas Neubert, Anton Yehorov, Till M. J. Stadtmüller, Christos G. Aneziris, Olena Volkova   +5 more
wiley   +1 more source

Breathable cooling solutions strengthened by ionic liquids for passive thermal management toward sustainable intelligentization

Nexus
The rapid development of electronics calls for sustainable thermal management solutions to tackle the rising energy and water demands for cooling. Passive thermal management technologies have emerged as a promising solution to reduce energy and water ...
Yunren Sui, Zengguang Sui, Tiantian Liu, Wei Wu   +3 more
doaj   +1 more source

Experimental Study on Thermal Performance of a Loop Heat Pipe with Different Working Wick Materials

Energies, 2021
In loop heat pipes (LHPs), wick materials and their structures are important in achieving continuous heat transfer with a favorable distribution of the working fluid. This article introduces the characteristics of loop heat pipes with different wicks: (i)
Kyaw Zin Htoo, Phuoc Hien Huynh, Keishi Kariya, Akio Miyara   +3 more
doaj   +1 more source

Comment on “Coherent Electron Cooling”

Physical Review Letters, 2013
A Comment on the Letter by V. N. Litvinenko and Y. S. Derbenev, Phys. Rev. Lett. 102, 114801 (2009). The authors of the Letter offer a Reply.
G, Stupakov, M S, Zolotorev
openaire   +3 more sources

Reduction of Oxide Inclusions During the High‐Frequency Welding of Steel via a Nonthermal Ar/H2 Plasma Jet

Advanced Engineering Materials, EarlyView.
High‐frequency (HF) welding of steel is limited by oxide inclusions that degrade weld quality. This study demonstrates, for the first time, the integration of a nonthermal Ar/H2 dielectric barrier discharge (DBD) plasma jet into HF welding. Local plasma treatment provides effective shielding and in‐situ oxide reduction, resulting in markedly fewer and ...
Viktor Udachin, Lienhard Wegewitz, René Gustus, Henning Wiche, Wolfgang Maus‐Friedrichs   +4 more
wiley   +1 more source

Numerical Investigation of Miniature Ejector Refrigeration System Embedded with a Capillary Pump Loop

Micromachines, 2017
A miniature steam ejector refrigeration system embedded with a capillary pump loop can result in a compact design which can be used for electronics cooling.
Jing-Ming Dong, He Song, Meng-Qi Yu, Wei-Ning Wang, Xin-Xiang Pan   +4 more
doaj   +1 more source

Constructal Optimizations of Liquid-Cooled Channels with Triangle or Square Sections in a Cylindrical Heating Body

Mathematics, 2023
Two new integrated models with heat source–heat sink are established, in which isothermal liquid cooling channels with triangle or square sections are, respectively, embedded in a cylindrical heating body with uniform heat production.
Yunfeng Li, Zhihui Xie, Daoguang Lin, Zhuoqun Lu, Yanlin Ge   +4 more
doaj   +1 more source

Cooling the Electronic Brain [PDF]

Mechanical Engineering, 2011
This article discusses findings of some immersion cooling studies carried out to define the potential of direct liquid cooling of three-dimensional chip stacks. Four possible immersion cooling strategies were assessed. These included two active cooling strategies and two passive cooling strategies.
Avram Bar-Cohen, Karl J. L. Geisler
openaire   +1 more source