Results 41 to 50 of about 22,733 (264)

High-performance integrated thermoelectric coolers for electronics cooling

Communications Materials
Thermoelectric coolers (TECs), which can directly convert energy between electricity and heat, have emerged as a promising solution for electronics cooling.
Wusheng Fan, Zan Wu, Sihui Hong, Kuang Sheng   +3 more
doaj   +1 more source

Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration

Nature Communications, 2022
Efficient thermal structure and precise heat management become a substantial challenge for electronics. Here, authors utilize the synergistic effect of classic heat transfer and electrocaloric cooling for fixed-point thermal management of chips.
Ming-Ding Li, Xiao-Quan Shen, Xin Chen, Jia-Ming Gan, Fang Wang, Jian Li, Xiao-Liang Wang, Qun-Dong Shen   +7 more
doaj   +1 more source

Thermionic Sources for Electron Cooling at IOTA

, 2022
We are designing and fabricating two new thermionic sources of magnetized electrons for use in the electron lens project in the Integrable Optics Test Accelerator (IOTA) at Fermilab. These electron sources will be used for cooling 2.5 MeV protons. One source will be used to compensate for emittance growth due to Intra Beam Scattering in experiments ...
Bossard, M. K., Brandt, J., Kim, Y. -K., Kladov, S., Banerjee, N., Cathey, B., Stancari, G., Nagaitsev, S.   +7 more
openaire   +3 more sources

Superlubricity and Corrosion Inhibition Properties of Solvate Ionic Liquids in Hybrid Carbon Fiber Reinforced Plastic–Steel Interfaces

Advanced Engineering Materials, EarlyView.
Solvate ionic liquids lubrication reduced the coefficient of friction by ∼60% compared to dry sliding, reaching steady‐state values as low as 0.04–0.05. Corrosion weight‐loss measurements in 1 M HCl further demonstrated significant inhibition behavior, with only 100 ppm of [Li(G3)][TFSI] (∼68.5 μL/L) reducing corrosion‐product weight loss by 63 ...
Sameh Dabees, Timothy Harte, Bhagya Dharmasiri, Y. Athulya Wickramasingha, David J. Hayne, Daniel J. Eyckens, Luke C. Henderson   +6 more
wiley   +1 more source

Modeling Simulation and Temperature Control on Thermal Characteristics of Airborne Liquid Cooling System

IEEE Access, 2020
Aiming at the temperature control of the liquid cooling system of aircraft electronic equipment, the thermal characteristics of the system under different temperature conditions are analyzed through model simulation, and a calculation method is given for
Zhangzhi Dong, Xiaogang Li, Zhe Li, Yanyan Hou   +3 more
doaj   +1 more source

Experimental Study on Thermal Performance of a Loop Heat Pipe with Different Working Wick Materials

Energies, 2021
In loop heat pipes (LHPs), wick materials and their structures are important in achieving continuous heat transfer with a favorable distribution of the working fluid. This article introduces the characteristics of loop heat pipes with different wicks: (i)
Kyaw Zin Htoo, Phuoc Hien Huynh, Keishi Kariya, Akio Miyara   +3 more
doaj   +1 more source

Composites of Shellac and Silver Nanowires as Flexible, Biobased, and Corrosion‐Resistant Transparent Conductive Electrodes

Advanced Functional Materials, EarlyView.
Shellac, a centuries‐old natural resin, is reimagined as a green material for flexible electronics. When combined with silver nanowires, shellac films deliver transparency, conductivity, and stability against humidity. These results position shellac as a sustainable alternative to synthetic polymers for transparent conductors in next‐generation ...
Rahaf Nafez Hussein, Tiago Carneiro Gomes, Eliza Ng, Simon Rondeau‐Gagné, Tricia Breen Carmichael   +4 more
wiley   +1 more source

Experimental Study on a Miniature Refrigeration System for Electronics Cooling

Zhileng xuebao, 2014
With the improvement of electronics performance, the problem of heat dissipation in circuit and chip is becoming more serious, development of high-efficiency electronics cooling systems is urgently needed, and vapor compression refrigeration is believed ...
Liu Gang, Wu Yuting, Lei Biao, Ma Rui, Ma Chongfang   +4 more
doaj  

Flow and Heat Transfer Characteristics in Manifold Microchannel with Porous Fins

Zhileng xuebao, 2022
Microchannel technology is one of the most promising technologies for chip cooling. In this study, the flow and heat transfer characteristics in manifold microchannels with different porosities (e=0.2-0.8, e-rise, and e-drop) of porous fins and solid ...
Chen Chaowei, Wang Xinyu, Xin Gongming
doaj  

Water-cooled electronics [PDF]

Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, 2000
Abstract LHC experiments demand on cooling of electronic instrumentation will be extremely high. A large number of racks will be located in underground caverns and counting rooms, where cooling by conventional climatisation would be prohibitively expensive.
G. Dumont, Ph. Fontaine Vive Roux, B. Righini   +2 more
openaire   +1 more source