Results 41 to 50 of about 34,254 (306)
The present study investigates recycling of NiTi shape memory alloys via vacuum induction melting. An ingot was synthesized from elemental Ni and Ti and subjected to three subsequent remelting cycles. Remelting increases process durations and impurity levels and adversely affects microstructures and functional properties.
Sakia Sophia Noorzayee +7 more
wiley +1 more source
including thermal, electrical and energy management challenges, based on discussions at the 2nd Workshop on Thermal Management in Telecommunication Systems and Data Centers in Santa Clara, California, on April 25–26, 2012.
Yeh, L.-T. +3 more
core +1 more source
The rapid development of electronics calls for sustainable thermal management solutions to tackle the rising energy and water demands for cooling. Passive thermal management technologies have emerged as a promising solution to reduce energy and water ...
Yunren Sui +3 more
doaj +1 more source
A miniature steam ejector refrigeration system embedded with a capillary pump loop can result in a compact design which can be used for electronics cooling.
Jing-Ming Dong +4 more
doaj +1 more source
Experimental Study on Thermal Performance of a Loop Heat Pipe with Different Working Wick Materials
In loop heat pipes (LHPs), wick materials and their structures are important in achieving continuous heat transfer with a favorable distribution of the working fluid. This article introduces the characteristics of loop heat pipes with different wicks: (i)
Kyaw Zin Htoo +3 more
doaj +1 more source
Cathodic Cage Plasma Deposition of Nanostructured Cu–Fe–Se Coatings on Poly(methyl Methacrylate)
Nanostructured Cu–Fe–Se coatings are deposited on PMMA by a modified cathodic cage plasma process, enabling low‐temperature deposition on polymer substrates. A transition from discontinuous to compact morphology is observed with temperature, with optimal properties at 200°C, where improved CuFeSe2‐type bonding, lowest sheet resistance, and favorable ...
V. S. S. Sobrinho +8 more
wiley +1 more source
High-performance integrated thermoelectric coolers for electronics cooling
Thermoelectric coolers (TECs), which can directly convert energy between electricity and heat, have emerged as a promising solution for electronics cooling.
Wusheng Fan +3 more
doaj +1 more source
Development and Prospects of Manifold Microchannel Heat Sink Research
With rapid development of electronic devices, modern electronic devices require higher power and exhibit more heat flow density. Consequently, their thermal management requirements have increased drastically.
Zhu Xunyi +3 more
doaj
Two new integrated models with heat source–heat sink are established, in which isothermal liquid cooling channels with triangle or square sections are, respectively, embedded in a cylindrical heating body with uniform heat production.
Yunfeng Li +4 more
doaj +1 more source
An Experimental High‐Throughput Approach for the Screening of Hard Magnet Materials
An entire workflow for the high‐throughput characterization and analysis of compositionally graded magnetic films is presented. Characterization protocols, data management tools and data analysis approaches are illustrated with test case Sm(Fe, V)12 based films.
William Rigaut +16 more
wiley +1 more source

