Results 41 to 50 of about 5,054,271 (238)

Breathable cooling solutions strengthened by ionic liquids for passive thermal management toward sustainable intelligentization

Nexus
The rapid development of electronics calls for sustainable thermal management solutions to tackle the rising energy and water demands for cooling. Passive thermal management technologies have emerged as a promising solution to reduce energy and water ...
Yunren Sui, Zengguang Sui, Tiantian Liu, Wei Wu   +3 more
doaj   +1 more source

OntOMat: Toward Ontology‐Based Product and Process Design Engineering and Optimization Solutions Fueling Circular Value Chains

Advanced Engineering Materials, EarlyView.
The OntOMat ontology establishes a structured framework for polymer matrix fiber reinforced composite materials, integrating manufacturing processes, characterization methods, and multiscale design through the VDI/VDE 3682 formalized process description standard.
Nicolas Christ, Jörg Hohe, Martin Kördel, Michael Giese, Niklas Toffert, Christian Seidel, Olaf Rehme, Patrik Schneider, Oliver Focke, Elie Abi Aoun, Claas Falldorf, Beñat Gutierrez, Alexandra Kühn, Sven Torstrick-von der Lieth, Christoph Herden, Erik Johannsen, Jan‐Uwe R. Schmidt, Felix Winkelmann, Andreas Schott, Daniel Schott   +19 more
wiley   +1 more source

High-performance integrated thermoelectric coolers for electronics cooling

Communications Materials
Thermoelectric coolers (TECs), which can directly convert energy between electricity and heat, have emerged as a promising solution for electronics cooling.
Wusheng Fan, Zan Wu, Sihui Hong, Kuang Sheng   +3 more
doaj   +1 more source

Uniform Amorphization of Crystalline Silicon Surfaces Enabled by Deep Ultraviolet Femtosecond Laser Pulses

Advanced Engineering Materials, EarlyView.
Deep‐UV (258 nm) femtosecond pulses enable uniform amorphous silicon writing on Si(100)/(111) with a six‐fold larger fluence amorphization window than NIR methods. Optimized fluence and overlap yield 20–45 nm uniform and continuous amorphous layers. Microscopy shows sharp interfaces, and real‐time reflectivity reveals nanosecond melt–resolidification ...
Wissal Benali, Magali Gregoire, Matys Guyard, Tatiana Itina, David Grojo, Pol Sopeña   +5 more
wiley   +1 more source

Superlubricity and Corrosion Inhibition Properties of Solvate Ionic Liquids in Hybrid Carbon Fiber Reinforced Plastic–Steel Interfaces

Advanced Engineering Materials, EarlyView.
Solvate ionic liquids lubrication reduced the coefficient of friction by ∼60% compared to dry sliding, reaching steady‐state values as low as 0.04–0.05. Corrosion weight‐loss measurements in 1 M HCl further demonstrated significant inhibition behavior, with only 100 ppm of [Li(G3)][TFSI] (∼68.5 μL/L) reducing corrosion‐product weight loss by 63 ...
Sameh Dabees, Timothy Harte, Bhagya Dharmasiri, Y. Athulya Wickramasingha, David J. Hayne, Daniel J. Eyckens, Luke C. Henderson   +6 more
wiley   +1 more source

Experimental Study on a Miniature Refrigeration System for Electronics Cooling

Zhileng xuebao, 2014
With the improvement of electronics performance, the problem of heat dissipation in circuit and chip is becoming more serious, development of high-efficiency electronics cooling systems is urgently needed, and vapor compression refrigeration is believed ...
Liu Gang, Wu Yuting, Lei Biao, Ma Rui, Ma Chongfang   +4 more
doaj  

Numerical Investigation of Miniature Ejector Refrigeration System Embedded with a Capillary Pump Loop

Micromachines, 2017
A miniature steam ejector refrigeration system embedded with a capillary pump loop can result in a compact design which can be used for electronics cooling.
Jing-Ming Dong, He Song, Meng-Qi Yu, Wei-Ning Wang, Xin-Xiang Pan   +4 more
doaj   +1 more source

Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration

Nature Communications, 2022
Efficient thermal structure and precise heat management become a substantial challenge for electronics. Here, authors utilize the synergistic effect of classic heat transfer and electrocaloric cooling for fixed-point thermal management of chips.
Ming-Ding Li, Xiao-Quan Shen, Xin Chen, Jia-Ming Gan, Fang Wang, Jian Li, Xiao-Liang Wang, Qun-Dong Shen   +7 more
doaj   +1 more source

Adaptive Foam 3D Printing of Ultralight and Multifunctional Materials

Advanced Engineering Materials, EarlyView.
Adaptive foam 3D printing, enabled by expandable microspheres, imparts cellular structures to thermoplastic and thermosetting polymers, manufactured through a variety of processes including fused filament fabrication, direct ink writing, digital light processing, and inkjet printing.
Nariman Rajabifar, Amir Ameli
wiley   +1 more source

Development and Prospects of Manifold Microchannel Heat Sink Research

Zhileng xuebao, 2023
With rapid development of electronic devices, modern electronic devices require higher power and exhibit more heat flow density. Consequently, their thermal management requirements have increased drastically.
Zhu Xunyi, Chen Chaowei, Zhang Jingzhi, Xin Gongming   +3 more
doaj