Results 41 to 50 of about 198,611 (304)

Thermal characterization methodologies for experimental minichannel heat sink designs in printed circuit board assemblies

Case Studies in Thermal Engineering
There has been a growing demand for novel, highly efficient, power-saving cooling solutions in recent years. In many cases, standard cooling techniques offer only limited opportunities to prevent the overheating of circuits.
Gy. Bognár, P.G. Szabó, G. Takács
doaj   +1 more source

Prolonged silicon carbide integrated circuit operation in Venus surface atmospheric conditions

AIP Advances, 2016
The prolonged operation of semiconductor integrated circuits (ICs) needed for long-duration exploration of the surface of Venus has proven insurmountably challenging to date due to the ∼ 460 °C, ∼ 9.4 MPa caustic environment.
Philip G. Neudeck, Roger D. Meredith, Liangyu Chen, David J. Spry, Leah M. Nakley, Gary W. Hunter   +5 more
doaj   +1 more source

Evolutionarily divergent DUF4465 domains have a common vitamin B12‐binding function

FEBS Open Bio, EarlyView.
We show that DUF4465 family proteins, widespread across bacteria from gut microbiomes, hydrothermal vents, and soil, share a common vitamin B12‐binding function. These augmented β‐jellyroll proteins bind vitamin B12 via extended loops. Our findings establish sequence‐diverse DUF4465 proteins as a widespread class of B12‐binding proteins, highlighting ...
Charlea Clarke, Michal Banasik, Rokas Juodeikis, Martin J. Warren, Richard W. Pickersgill   +4 more
wiley   +1 more source

Radiative cooling drives the integration and application of thermal management in flexible electronic devices

npj Flexible Electronics
Flexible electronics advancement intensifies thermal management needs. Radiative cooling shows promise but faces implementation challenges. Integration into diverse flexible electronics demands application-specific materials and processes.
Maoquan Zhang, Xuwang Tian, Jiajia Shen, Jianhua Yan   +3 more
doaj   +1 more source

Cooling rate for microbunched electron cooling without amplification [PDF]

Physical Review Accelerators and Beams, 2018
The Microbunched Electron Cooling (MBEC) proposed by D. Ratner is a promising cooling technique that can find applications in future hadron and electron-ion colliders. In this paper, we develop a new framework for the study of MBEC which is based on the analysis of the dynamics of microscopic 1D fluctuations in the electron and hadron beams during ...
openaire   +3 more sources

The Layer 0 Inner Silicon Detector of the D0 Experiment

, 2009
This paper describes the design, fabrication, installation and performance of the new inner layer called Layer 0 (L0) that was inserted in the existing Run IIa Silicon Micro-Strip Tracker (SMT) of the D0 experiment at the Fermilab Tevatron collider.
A. Bean, A. Nomerotski, A. Zieminski, C.E. Gerber, C.H. Daly, Cooper, D. Buchholz, D. Butler, D. Markley, D. Olis, D. Strom, D. Tsybychev, E. Shabalina, F. Lehner, G.J. Otero y Garzón, Garcia-Sciveres, H. Gonzalez, H. Guldenman, H.J. Lubatti, J. Foglesong, J. Green, J. Howell, J. Wang, K. Hanagaki, K. Herner, K. Krempetz, K. Schultz, Krieger, L. Bagby, L. Christofek, Lutz, M. Demarteau, M. Hrycyk, M. Johnson, M. Kirby, M. Matulik, M. Roman, M. Tuttle, M. Utes, M. Weber, R. Angstadt, R. Lipton, R. Rucinski, R.D. Taylor, R.L. McCarthy, R.P. Smith, S.W. Youn, T. Bolton, T. Wesson, T. Zhou, W. Kuykendall, W.E. Cooper, Y. Orlov, Zimmerman, Zimmerman   +54 more
core   +1 more source

Harnessing Fungal Biowelding for Constructing Mycelium‐Engineered Materials

Advanced Engineering Materials, EarlyView.
Mycelium‐bound composites (MBCs) offer low‐carbon alternatives for construction, yet interfacial bonding remains a critical challenge. This review examines fungal biowelding as a biocompatible adhesive, elucidating mycelium‐mediated interfacial mechanisms and their role in material assembly. Strategies to optimize biowelding are discussed, highlighting
Xue Brenda Bai, Xinrui Sarah Niu, Zhao Qin   +2 more
wiley   +1 more source

Experimental investigation of non-uniform heating effect on flow boiling instabilities in a microchannel-based heat sink [PDF]

, 2011
Copyright @ 2011 ElsevierTwo-phase flow boiling in microchannels is one of the most promising cooling technologies for coping with high heat fluxes produced by the next generation of central processor units (CPUs).
A.J. Walton, Bergles, Bogojevic, D. Bogojevic, D.B.R. Kenning, G. Cummins, H. Lin, Hetsroni, K. Sefiane, Kandlikar, Kenning, Kosar, Lin, Qu, Revellin, T.G. Karayiannis, Wang, Zhang   +17 more
core   +1 more source

Interactions between Molten High‐Silicon Electrical Steels and Carbon‐Bonded MgO Refractories Based on Recyclates

Advanced Engineering Materials, EarlyView.
This study examines how several molten high‐silicon electrical steels interact with both conventional and recycled MgO–C refractories. For this, various immersion experiments are conducted. In addition to infiltration, a number of mechanisms are identified and explained that control the corrosion of the refractory material.
Lukas Neubert, Matheus Roberto Bellé, Anton Yehorov, Anhelina Mospan, Till M. J. Stadtmüller, Seetharaman Sridhar, Christos G. Aneziris, Olena Volkova   +7 more
wiley   +1 more source

Review of Cryogenic Power Electronics for All-Electric Aircraft

IEEE Access
To tackle emissions from the aviation industry and make it sustainable, research has been targeting electrifying aircraft. For this aim, articles have been focusing on how to replace regular jet engines with liquid hydrogen as fuel.
Abdelrahman Elwakeel, Yuchuan Liao, Yudi Xiao, Rafael Pena Alzola, Min Zhang, Weijia Yuan   +5 more
doaj   +1 more source