Results 51 to 60 of about 1,598,382 (292)
<p style='text-indent:20px;'>In this paper we examine the identification problem of the heat sink for a one dimensional heat equation through observations of the solution at the boundary or through a desired temperature profile to be attained at a certain given time.
Audu, J. D. +3 more
openaire +3 more sources
A Novel Approach to Estimate the Transition Temperature via Dynamic Nanoindentation
A new dynamic nanoindentation‐based method was developed that uses the stiffness ratio as an indicator of the elastic–plastic deformation contributions at different temperatures. The approach successfully identified transition temperatures in ferritic steel and distinguished them from continuously ductile austenitic steel.
Stefan Zeiler +4 more
wiley +1 more source
Herein, we numerically investigated methods to improve heat dissipation from the base of a phase-change material (PCM) heat sink exposed to high heat flux (15 W/cm2).
Salah Addin Burhan Al-Omari +3 more
doaj +1 more source
Near‐surface deuterium enrichment profiles for different microstructural types of TiAl after exposure at 700 °C in a heavy water‐containing environment. The deuterium levels are significantly higher than expected from natural occurrence, indicating that the heavy water dissociated during the exposure treatment and entered the specimens.
Jonathan D. H. Paul +5 more
wiley +1 more source
The effect of blowing direction on heat sink performance by thermal imaging
Heat sinks (HSs) are designed for the mechanical, electrical and electronic components that generate heat in considerable amount. For this purpose, an aluminum conical pin fin heat sink is designed.
Mesut ABUŞKA
doaj +1 more source
Shellac, a centuries‐old natural resin, is reimagined as a green material for flexible electronics. When combined with silver nanowires, shellac films deliver transparency, conductivity, and stability against humidity. These results position shellac as a sustainable alternative to synthetic polymers for transparent conductors in next‐generation ...
Rahaf Nafez Hussein +4 more
wiley +1 more source
Optimal heat dissipation in power modules can significantly increase their power density. Removing the generated heat is critical for capturing the benefits of advanced semiconductor materials and improving the reliability of the device operation.
Emre Gurpinar, Raj Sahu, Burak Ozpineci
doaj +1 more source
Cell therapies typically rely on cold‐chain logistics and cryopreservation, limiting access and compromising cell quality. Here, a dual‐chamber device separates an oxygen‐supplying chamber from a hyaluronic acid cargo chamber, sustaining oxygen delivery for over 70 h and enabling ambient‐temperature shipment.
Daniel A. Domingo‐Lopez +9 more
wiley +1 more source
This article explores various innovative ways that technology companies are working upon to deal with the large amount of heat of their big data centers. Microsoft’s research and development team is working on designing and building of an underwater data center.
openaire +1 more source
The effects of solid‐state electrolyte architecture and electrolyte/electrode interfacial polarization resistance on Critical Current Density and the risks for “interfacial” and “internal” Li‐metal dendrite formation were investigated in simulations of FIB‐reconstructed porous‐dense Li7La3Zr2O12 (LLZO) “bilayers”, providing insight for full cells ...
Tanner R. Hamann +2 more
wiley +1 more source

