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Green Hydrogen for Public Transportation: Insights From an ABM and From Palma de Mallorca Case Study
Business Strategy and the Environment, EarlyView.ABSTRACT The development of green hydrogen (GH2) value chains is crucial for decarbonizing sectors such as transport and industry. Their emergence, however, requires coordination among diverse actors, technologies, and regulations, which traditional analytical approaches struggle to capture.
Roberta De Cristofaro +2 more
wiley +1 more source
Business Strategy and the Environment, EarlyView.ABSTRACT Global net‐zero ambitions require transformative strategies to decarbonise carbon‐intensive global value chains (GVCs). This study examines how multinational enterprises (MNEs) in sunset industries integrate carbon capture technologies (CCT) with operational and supply chain dynamics (OSCD) to advance decarbonisation.
Muhammad Mustafa Kamal +6 more
wiley +1 more source
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A method to rank heat sinks in practice: the heat sink performance tester
Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005., 2005One way of cooling electronic devices is through enlarging the surface that is in contact with a fluid (usually air) by attaching a heat sink. Since literally thousands of heat sinks are available many designers are confronted with the question: which one? Very often the designer's choice is based on cost and manufacturer's data.
C.J.M. Lasance, H.J. Eggink
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Characterization of Heat Sink Flow Bypass in Plate Fin Heat Sinks
Heat Transfer, Volume 5, 2002Experimental testing has been performed on two plate fin heat sinks in order to examine flow bypass phenomenon. The present study examines pressure drop and thermal resistance as well as flow velocities within the heat sinks. Tests are performed for bypass channel/fin height ratios of 0.25, 0.5, 0.75 and 1 with approach velocities from 2 to 8 m/s.
W. Leonard +3 more
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International Symposium on Microelectronics, 2010
Conventional heat sinks for processors achieve improved heat transfer efficiency by impinging ambient air over stationary fins. Further improvement in the air film heat transfer coefficient through increased air speed becomes asymptotic and invariably results in undesirable acoustic noise.
Vijay Khanna +2 more
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Conventional heat sinks for processors achieve improved heat transfer efficiency by impinging ambient air over stationary fins. Further improvement in the air film heat transfer coefficient through increased air speed becomes asymptotic and invariably results in undesirable acoustic noise.
Vijay Khanna +2 more
openaire +1 more source
SAE Technical Paper Series, 1999
<div class="section abstract"><div class="htmlview paragraph">A silicon micromachined heat sink is presented. The device uses liquid cooling in microchannels to remove high heat fluxes. Deep reactive ion etching and multiple wafer bonding is employed to fabricate high aspect ratio, enhanced heat transfer surfaces and a flow channel network ...
Christopher A. Bang +2 more
openaire +1 more source
<div class="section abstract"><div class="htmlview paragraph">A silicon micromachined heat sink is presented. The device uses liquid cooling in microchannels to remove high heat fluxes. Deep reactive ion etching and multiple wafer bonding is employed to fabricate high aspect ratio, enhanced heat transfer surfaces and a flow channel network ...
Christopher A. Bang +2 more
openaire +1 more source
Optimization of heat sink fin geometries for heat sinks in natural convection
[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems, 2003An approach for determining the optimum fin configurations for a given heat sink in natural convection is developed. Incorporation of minimization routines into the analysis eliminates the manual, iterative design analysis and identifies the optimum design. Optimization of fin geometry for heat sinks in natural convection with rectangular cross section
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Thermal comparison of plate, extrusion heat sink, and skive heat sink
Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189), 2002Due to the high power dissipation values of power amplifiers, large temperature gradients exist, resulting in localized hot spots around the devices. These hot spots cause high device junction temperatures. Generally speaking, the higher junction temperature increases, the lower reliability will be. Thus, improving the heat spreading is very important.
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1965
This paper explains the bases for the design of a heat-sink module, a module desirable because of its great flexibility in component arrangement and adaptability to new usages. The methods by which the module would meet major design problems, such as heat management, standardization and internal flexibility, and component interconnection, are outlined,
R. E. Klein, J. Gammon
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This paper explains the bases for the design of a heat-sink module, a module desirable because of its great flexibility in component arrangement and adaptability to new usages. The methods by which the module would meet major design problems, such as heat management, standardization and internal flexibility, and component interconnection, are outlined,
R. E. Klein, J. Gammon
openaire +1 more source