Results 171 to 180 of about 47,417 (214)

Thin vapor chamber heat sink and embedded heat pipe heat sink performance evaluations

2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2009
Vapor chamber and heat pipe technologies are not new concepts, but their fabrication and manufacturing processes have been improving. Both vapor chambers and heat pipes have been getting thinner allowing the integrated heat sink design with increased fin surfaces. For example, for vapor chambers, the minimum achievable thickness has been reduced from 5
Garrett Glover, null Yongguo Chen, Annie Luo, Herman Chu   +3 more
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Optimization of convectively cooled heat sinks

Microelectronics Reliability, 2017
Abstract Many factors of heat sink, such as its size and mass, component locations, number of fins, and fan power affect heat transfer. Owing to the opposite effects of these factors on heat sink maximum temperature, we have now a multi-objective optimization problem.
Kaj Lampio, Reijo Karvinen
openaire   +1 more source

Micro-Heat-Sinks for Space Applications

ASME 2nd International Conference on Microchannels and Minichannels, 2004
During the space missions, the problems related to the thermal conditioning of devices, to the personnel comfort and to the thermo-mechanical stresses are known and important. Furthermore for a space mission certain priorities are stressed, such as the small dimension and the lightness of thermal equipments.
MARENGO, Marco, COSSALI, Gianpietro, CHIGNOLI, Luca, ZHDANOV, SERGEY   +3 more
openaire   +2 more sources

Fabrication and characterization of microscale heat sinks

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2016
In the field of thermal management, engineers are well aware of the challenges posed by the increasing level of dissipation. Among the many possible solutions to counter the threat of overheating, one is dealing with the usage of microscale heat exchangers, where the forced air or liquid cooling solution is integrated into the electronic package itself.
Gábor Takács, György Bognár, Eniko Bándy, Gábor Rózsás, Péter G. Szabó   +4 more
openaire   +1 more source

Heat transfer performance investigation of the spherical dimple heat sink and inclined teardrop dimple heat sink

Numerical Heat Transfer, Part A: Applications, 2019
The convective heat transfer is significant in the cooling channel, but the heat transfer enhancement in a cooling passage will be more useful or increases if a dimple is employed on their surfaces...
Ashif Perwez, Rakesh Kumar
openaire   +1 more source

A Study of Heat Transfer Characteristics of LED Heat Sink and Graphite Heat Sink Process Technology Development

Applied Mechanics and Materials, 2013
This study investigated the heat transfer characteristics of LED heat sink and the development process technology of graphite heat sink with micro-sized metal powders. Employing the reverse engineering technology, the three-dimension LED heat sink entity was rebuilt and the heat transfer characteristics of LED heat sink were analyzed by CFD numerical ...
Shie Chen Yang, Tsuo Fei Mao, Tzer Ming Jeng, Sheng Chung Tzeng, Tzung Ying Shie, Chih Liang Chen, Po Tsun Chen   +6 more
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Heat Sinks in Computers

2014
Finned heat sinks are used in computers to promote heat transfer from the Integrated Circuit (IC) chips to cooling air. This chapter provides the background information and the tutorial materials about heat sinks. First, the mechanism of heat generation by electronic circuits is explained.
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Heat Transfer in Spiral Channel Heat Sinks

ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, Volume 1, 2011
Heat transfer in a spiral heat sink is examined experimentally and analytically. The spiral channel was fabricated on a base plate of copper. The cross section of the channel is square with 1 mm sides. A copper cap plate was bolted tight to seal the channel.
M. Ghobadi, Y. S. Muzychka
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Partially heated heat sinks in a zero-bypass

International Communications in Heat and Mass Transfer, 2012
Abstract The need to improve the thermal performance of heat sinks remains a design priority for thermal engineers. Most of the considerations so far have involved various shapes and sizes of the fin designs. This numerical study evaluates the influence of the heating position on the thermal performance of a plate-fin heat sink in a zero-bypass ...
N.G. Emekwuru, F.R. Hall, P.J. Spence
openaire   +1 more source

Measurements of heat transfer in microchannel heat sinks

International Communications in Heat and Mass Transfer, 2000
Abstract The paper presents new experimental measurements for pressure drop and heat transfer coefficient in microchannel heat sinks. Tests were performed with devices fabricated using standard Silicon 100 wafers. Two different channel patterns were studied.
openaire   +1 more source