Results 41 to 50 of about 33,811 (262)
Influence of an Electrically Non-Conducting Heat Sink for Power Semiconductors on Radiated Interferences [PDF]
Power semiconductors are used in a growing number of applications. Furthermore, faster switching transients and therefore higher switching frequencies can be realised. This leads to higher radiated interferences at higher frequencies.
S. Chromy +4 more
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Heat sinks are widely used in electronic devices with high heat flux. The design and build of microstructures on heat sinks has shown effectiveness in improving heat dissipation efficiency. In this paper, four kinds of treatment methods were used to make
Yuxin You +6 more
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Geometry‐driven thermal behavior in wire‐arc additive manufacturing (WAAM) influences microstructural evolution during nonequilibrium solidification of a chemically complex Fe–Cr–Nb–W–Mo–C nanocomposite system. By comparing different deposits configurations, distinct entropy–cooling rate correlations, segregation, and carbide evolution are revealed ...
Blanca Palacios +5 more
wiley +1 more source
A simplified thermoplastic pultrusion model is developed to predict thermal fields in glass fiber/polyethylene terephthalate (GF/PET) composites with reduced computational cost. By combining effective material homogenization, validation against literature data, and Gaussian‐process‐based optimization, the study reveals how heating limits, pulling speed,
Elder Soares +3 more
wiley +1 more source
A phase change materials (PCM)-based heat sink is an effective way to cool intermittent high-power electronic devices in aerospace applications such as airborne electronics and aircraft external carry. Optimizing the heat sink is significant in designing
Jianjun Zhang +4 more
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Composite Heat Sink LED Cooling [PDF]
Metal coating of 3D printed polymers is an attractive proposition for thermal dissipation of light emitting diodes, due to its high efficiency and markedly lower material costs than conventional aluminum heat sinks. Efficient thermal cooling of light emitting diodes is essential in maintaining electronic and optical performance. The thermal performance
Gibbons, Michael +2 more
openaire +3 more sources
Do not let thermal drift and instrument artifacts deceive high‐temperature nanoindentation results. We compare classical Oliver–Pharr and automatic image recognition analyses across steels and a Ni alloy to quantify these effects. Accounting for artifacts reveals systematic softening with temperature, while Cr and Ni additions boost resistance ...
Velislava Yonkova +2 more
wiley +1 more source
This review highlights advances in lightweight, lead‐free polymer nanocomposites for diagnostic X‐ray shielding. By linking filler chemistry, dispersion, architecture, and photon interaction mechanisms, it establishes structure–performance relationships guiding material design.
Aklilu G. Messele +2 more
wiley +1 more source
Thermal Performance of Hollow Fluid-Filled Heat Sinks
The increasing power density of electronic devices drives the need for lighter, more compact heat dissipation devices. This research determines whether a hollow heat sink filled with fluid outperforms solid heat sinks for heat dissipation.
John Nuszkowski +3 more
doaj +1 more source
Optimal heat dissipation in power modules can significantly increase their power density. Removing the generated heat is critical for capturing the benefits of advanced semiconductor materials and improving the reliability of the device operation.
Emre Gurpinar, Raj Sahu, Burak Ozpineci
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