Results 81 to 90 of about 33,811 (262)

Numerical Investigation of the Heat Transfer Rate and Fluid Flow Characteristics of Conventional and Triply Periodic Minimal Surface (TPMS)-Based Heat Sinks

Engineering Proceedings
Heat sinks have been widely used in cooling systems due to their high heat transfer efficiency. In this study, the thermal performance and fluid flow characteristics of conventional and triply periodic minimal surfaces (TPMS)-based heat sinks were ...
Muhammad Usman Shahid, Muhammad Mahabat Khan, Muhammad Noman Shahid   +2 more
doaj   +1 more source

Thermal Conductivity Analysis and Investigation of an Aluminum-Graphene Composite Heat Sink [PDF]

Hangkong bingqi
To address the thermal dissipation challenges caused by high heat flux density in power modules under the high-performance and miniaturization trend of missile-borne electronic devices, this study proposes an innovative solution by optimizing the thermal
Li Hang, Shi Lanfang, Cai Ming
doaj   +1 more source

Fully Printed Electrocaloric Heat Pump

Advanced Materials Technologies, EarlyView.
A system based on a flexible printed PEDOT:PSS/P(VDF‐TrFE‐CFE) electrocaloric membrane. The membrane periodically alternates between the cold and hot sides following its electrocaloric cycle and successfully generates a temperature difference. The entire fabrication process is industrially scalable, cost‐effective, and based on widely accessible ...
Adrian Agreda, Florian Le Goupil, Guillaume Payrot, Sokha Khiev, Jean‐David Isasa, Wiljan Smaal, Guillaume Fleury, Georges Hadziioannou   +7 more
wiley   +1 more source

The Evolution of Aerosol Jet Printing, A Review: Enhancing Material Versatility and Improvements for Next‐Generation Applications

Advanced Materials Technologies, EarlyView.
Aerosol Jet Printing (AJP) has emerged as a versatile additive manufacturing technique for high‐resolution, conformal, and multi‐material printing. This review highlights advances in printable materials, substrate compatibility, post‐processing, characterization, and process innovations, while critically discussing current challenges and future ...
Chandrachur Chatterjee, Rocco Lupoi, Michael J. Gibbons   +2 more
wiley   +1 more source

GeSn Quantum Wells for Room‐Temperature Mid‐Infrared Lasing on Si and on Insulator Platforms

Advanced Optical Materials, EarlyView.
This work demonstrates a high‐performance GeSn‐on‐Insulator (GeSnOI) platform achieving laser emission up to room temperature. By utilizing Group IV GeSn quantum well heterostructures, we successfully reached a target wavelength of 3.3 µm. This advancement paves the way for fully integrated Mid‐IR photonic CMOS‐compatible sources, overcoming the ...
Antoine Meyer, Hector‐Mauricio Reynoso‐de la Cruz, Omar Concepción, Prateek Kaul, Konstantinos Pantzas, Etienne Herth, Z. Ikonic, Giovanni Capellini, Detlev Grützmacher, Moustapha El Kurdi, Dan Buca   +10 more
wiley   +1 more source

Heat Transfer Enhancement using Combined Microchannel with Vertical Rectangular Micro Fins

Nigerian Journal of Technological Development, 2023
This paper focuses on the numerical optimisation of a combined hybrid microchannel heat sink with rectangular solid fins. The axial length and volume are fixed, and external structure is allowed to vary. The simulation was performed on an elemental unit
N. Y. Godi
doaj  

Soft Robotic Snake with Tunable Undulatory Gait for Efficient Underwater Locomotion

Advanced Robotics Research, EarlyView.
This study designs an underwater soft snake robot using 3D‐printed soft actuators, controlled by specific signals to generate sinusoidal undulation. Results show a positive correlation between speed and swing amplitude, with optimal performance at 2/3π phase offset, PLA tail, 1.2 voltage growth rate, and 6s undulation period achieving a maximum speed ...
Huichen Ma, Junjie Zhou, Raye Yeow
wiley   +1 more source

Microchannel Heat Sink-A Comprehensive Review

Electronic Materials
An efficient cooling system is necessary for the reliability and safety of the modern microchips for longer life. As microchips become smaller and more powerful, the heat flux generated by these chips per unit area also rises sharply. Traditional cooling techniques are inadequate to meet the recent cooling requirements of microchips.
Usman Ghani, Muhammad Anas Wazir, Kareem Akhtar, Mohsin Wajib, Shahmir Shaukat   +4 more
openaire   +2 more sources

3D Printing of Soft Robotic Systems: Advances in Fabrication Strategies and Future Trends

Advanced Robotics Research, EarlyView.
Collectively, this review systematically examines 3D‐printed soft robotics, encompassing material selections, function integration, and manufacturing methodologies. Meanwhile, fabrication strategies are analyzed in order of increasing complexity, highlighting persistent challenges with proposed solutions.
Changjiang Liu, Bin Cui, Xumin Huang, Xiaoyu (Rayne) Zheng, T. Thang Vo‐Doan, Ruirui Qiao   +5 more
wiley   +1 more source

Experimental Analysis of Heat and Flow Characteristics on Inclined and Multiple Impingement Jet Heat Transfer Using Optimized Heat Sink

Applied Sciences
Thermal management at a high heat flux is crucial for electronic devices, and jet impingement cooling is a promising solution. The heat transfer properties of a rectangular-finned heat sink are investigated under angled and multi-impingement jet ...
Altug Karabey, Dogan Yorulmaz
doaj   +1 more source