Results 161 to 170 of about 2,576,432 (406)

The Influence of Geometry, Surface Texture, and Cooling Method on the Efficiency of Heat Dissipation through the Heat Sink-A Review. [PDF]

open access: yesMaterials (Basel), 2023
Grochalski K   +6 more
europepmc   +1 more source

MGM as a Large‐Scale Pretrained Foundation Model for Microbiome Analyses in Diverse Contexts

open access: yesAdvanced Science, EarlyView.
We present the Microbial General Model (MGM), a transformer‐based foundation model pretrained on over 260,000 microbiome samples. MGM learns contextualized microbial representations via self‐supervised language modeling, enabling robust transfer learning, cross‐regional generalization, keystone taxa discovery, and prompt‐guided generation of realistic,
Haohong Zhang   +5 more
wiley   +1 more source

Research study on instrument unit thermal conditioning heat sink concepts First quarterly progress report, 11 Mar. - 31 May 1966 [PDF]

open access: yes
Water boiler and water sublimator heat sink concepts, visualization test module, and sublimation ...
Graumann, D. W., Stone, R. A.
core   +1 more source

Chip packaging technique [PDF]

open access: yes, 2001
A hermetically sealed package for at least one semiconductor chip is provided which is formed of a substrate having electrical interconnects thereon to which the semiconductor chips are selectively bonded, and a lid which preferably functions as a heat ...
Jayaraj, Kumaraswamy   +2 more
core   +1 more source

Quantifying Additive Manufacturing Vapor Plumes Using Laser‐Induced Breakdown Spectroscopy, Synchrotron X‐Ray Radiography and Simulations

open access: yesAdvanced Science, EarlyView.
This study presents a novel in situ laser‐induced breakdown spectroscopy system for monitoring metal vapors produced by the intense laser‐metal interactions in laser powder bed fusion additive manufacturing and laser welding. The insights from this new technique reveal changes in alloy compositions and provide the first in situ validation of multi ...
Anna C. M. Getley   +8 more
wiley   +1 more source

Reparable, high-density microelectronic module provides effective heat sink [PDF]

open access: yes, 1967
Reparable modular system is used for packaging microelectronic flat packs and miniature discrete components. This three-dimensional compartmented structure incorporates etched phosphor bronze sheets and frames with etched wire conductors.
Carlson, K. J., Maytone, F. F.
core   +1 more source

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