The Influence of Geometry, Surface Texture, and Cooling Method on the Efficiency of Heat Dissipation through the Heat Sink-A Review. [PDF]
Grochalski K +6 more
europepmc +1 more source
Membrane-based Two Phase Heat Sinks for High Heat Flux Electronics and Lasers
Suhas Tamvada +2 more
openalex +1 more source
MGM as a Large‐Scale Pretrained Foundation Model for Microbiome Analyses in Diverse Contexts
We present the Microbial General Model (MGM), a transformer‐based foundation model pretrained on over 260,000 microbiome samples. MGM learns contextualized microbial representations via self‐supervised language modeling, enabling robust transfer learning, cross‐regional generalization, keystone taxa discovery, and prompt‐guided generation of realistic,
Haohong Zhang +5 more
wiley +1 more source
Research study on instrument unit thermal conditioning heat sink concepts First quarterly progress report, 11 Mar. - 31 May 1966 [PDF]
Water boiler and water sublimator heat sink concepts, visualization test module, and sublimation ...
Graumann, D. W., Stone, R. A.
core +1 more source
Chip packaging technique [PDF]
A hermetically sealed package for at least one semiconductor chip is provided which is formed of a substrate having electrical interconnects thereon to which the semiconductor chips are selectively bonded, and a lid which preferably functions as a heat ...
Jayaraj, Kumaraswamy +2 more
core +1 more source
This study presents a novel in situ laser‐induced breakdown spectroscopy system for monitoring metal vapors produced by the intense laser‐metal interactions in laser powder bed fusion additive manufacturing and laser welding. The insights from this new technique reveal changes in alloy compositions and provide the first in situ validation of multi ...
Anna C. M. Getley +8 more
wiley +1 more source
Thermo-hydraulic performance optimization of a disk-shaped microchannel heat sink applying computational fluid dynamics, artificial neural network, and response surface methodology. [PDF]
Vaferi K +6 more
europepmc +1 more source
Reparable, high-density microelectronic module provides effective heat sink [PDF]
Reparable modular system is used for packaging microelectronic flat packs and miniature discrete components. This three-dimensional compartmented structure incorporates etched phosphor bronze sheets and frames with etched wire conductors.
Carlson, K. J., Maytone, F. F.
core +1 more source
Comparison of pin-fin and finned shape heat sink for power electronics in future aircraft
Assel Sakanova, King Jet Tseng
openalex +2 more sources

