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Heat sink design: heat sink design for a company.
Throughout the project, I utilized SolidWorks Software to design, assemble, and simulate a heat sink for a heat sink company with a computer science background that needs it to be used on a silicon computer chip. The primary objective was to design a heat sink that could lower the temperature of the silicon chip to less than 43.5ºC.
Unamuno Cabrera, Haritz
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SAE Technical Paper Series, 1999
<div class="section abstract"><div class="htmlview paragraph">A silicon micromachined heat sink is presented. The device uses liquid cooling in microchannels to remove high heat fluxes. Deep reactive ion etching and multiple wafer bonding is employed to fabricate high aspect ratio, enhanced heat transfer surfaces and a flow channel network ...
Christopher A. Bang +2 more
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<div class="section abstract"><div class="htmlview paragraph">A silicon micromachined heat sink is presented. The device uses liquid cooling in microchannels to remove high heat fluxes. Deep reactive ion etching and multiple wafer bonding is employed to fabricate high aspect ratio, enhanced heat transfer surfaces and a flow channel network ...
Christopher A. Bang +2 more
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Characterization of Heat Sink Flow Bypass in Plate Fin Heat Sinks
Heat Transfer, Volume 5, 2002Experimental testing has been performed on two plate fin heat sinks in order to examine flow bypass phenomenon. The present study examines pressure drop and thermal resistance as well as flow velocities within the heat sinks. Tests are performed for bypass channel/fin height ratios of 0.25, 0.5, 0.75 and 1 with approach velocities from 2 to 8 m/s.
W. Leonard +3 more
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A method to rank heat sinks in practice: the heat sink performance tester
Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005., 2005One way of cooling electronic devices is through enlarging the surface that is in contact with a fluid (usually air) by attaching a heat sink. Since literally thousands of heat sinks are available many designers are confronted with the question: which one? Very often the designer's choice is based on cost and manufacturer's data.
C.J.M. Lasance, H.J. Eggink
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International Symposium on Microelectronics, 2010
Conventional heat sinks for processors achieve improved heat transfer efficiency by impinging ambient air over stationary fins. Further improvement in the air film heat transfer coefficient through increased air speed becomes asymptotic and invariably results in undesirable acoustic noise.
Vijay Khanna +2 more
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Conventional heat sinks for processors achieve improved heat transfer efficiency by impinging ambient air over stationary fins. Further improvement in the air film heat transfer coefficient through increased air speed becomes asymptotic and invariably results in undesirable acoustic noise.
Vijay Khanna +2 more
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Optimization of heat sink fin geometries for heat sinks in natural convection
[1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems, 2003An approach for determining the optimum fin configurations for a given heat sink in natural convection is developed. Incorporation of minimization routines into the analysis eliminates the manual, iterative design analysis and identifies the optimum design. Optimization of fin geometry for heat sinks in natural convection with rectangular cross section
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Thermal comparison of plate, extrusion heat sink, and skive heat sink
Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189), 2002Due to the high power dissipation values of power amplifiers, large temperature gradients exist, resulting in localized hot spots around the devices. These hot spots cause high device junction temperatures. Generally speaking, the higher junction temperature increases, the lower reliability will be. Thus, improving the heat spreading is very important.
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1965
This paper explains the bases for the design of a heat-sink module, a module desirable because of its great flexibility in component arrangement and adaptability to new usages. The methods by which the module would meet major design problems, such as heat management, standardization and internal flexibility, and component interconnection, are outlined,
R. E. Klein, J. Gammon
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This paper explains the bases for the design of a heat-sink module, a module desirable because of its great flexibility in component arrangement and adaptability to new usages. The methods by which the module would meet major design problems, such as heat management, standardization and internal flexibility, and component interconnection, are outlined,
R. E. Klein, J. Gammon
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