Results 11 to 20 of about 32,763 (264)
Study of heat transfer performance of miniature heat sink for integrated circuit packaging field
The miniature heat sink is an essential component in integrated circuit packaging, playing a vital role in ensuring the stable and reliable performance of integrated circuits.
Zhaolong Li +4 more
doaj +1 more source
The flow and heat performance of tree-like network heat sink with diverging–converging channel [PDF]
A tree-like network heat sink with diverging–converging channel is designed, and effect of flow rate, channel diverging-converging angles on the flow and heat dissipation performance of the tree-like network heat sink is analysed and compared by ...
Zhu Xiugen +4 more
doaj +1 more source
MEMS heat sink having wavy microchannels integrating circular pin-fins for cooling of microelectronic chips is proposed and analyzed in this work; the pin-fins are placed at the valleys and peaks of the wavy structure.
Anas Alkhazaleh +2 more
doaj +1 more source
This work builds on our recent research on finned phase change material (PCM) heat sinks, where we proposed a novel Gallium based PCM heat sink concept that counter-intuitively incorporated fins detached from the hot sink base instead of being fully ...
Salah Addin Burhan Al-Omari +3 more
doaj +1 more source
Experimental determination of cooling performance on heat sinks with cone-jet electrospray mode
In this study, electrospray cooling characteristics for smooth surface heat sink and finned surface heat sink were investigated. An experimental study was carried out using ethanol for 7 different heat fluxes in the cone-jet mode, in which a stable and ...
Abdüssamed Kabakuş +3 more
doaj +1 more source
Topology optimization of heat sink based on variable density method
A topology optimization method based on the variable density method is used to optimize the design of the forced convection air heat sink structure, with minimum pressure drop as the optimization objective and heat transfer performance as the constraint,
Liyao Xie +3 more
doaj +1 more source
Phase change material (PCM) based heat sink has the potential to be applied for the thermal management of electronic devices. Whereas, PCM suffers from a low thermal conductivity, which results in local overheating at the base of heat sink.
Xusheng Hu, Xiaolu Gong
doaj +1 more source
Transient temperature control performance evaluation of a novel hybrid PCM-based active heat sink
In this study, a novel hybrid PCM-based active heat sink is proposed for temperature control management of transient high heat flux shock electronic devices.
De-Xin Zhang +6 more
doaj +1 more source
Composite Heat Sink LED Cooling [PDF]
Metal coating of 3D printed polymers is an attractive proposition for thermal dissipation of light emitting diodes, due to its high efficiency and markedly lower material costs than conventional aluminum heat sinks. Efficient thermal cooling of light emitting diodes is essential in maintaining electronic and optical performance.
Gibbons, Michael +2 more
openaire +3 more sources
Operating temperature is an important parameter of thyristors to ensure the stable operation of power electronic devices. Thermal management technology is of great significance for improving the reliability of thyristors.
Jiefeng Liu +5 more
doaj +1 more source

