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SAE Technical Paper Series, 1999
<div class="section abstract"><div class="htmlview paragraph">A silicon micromachined heat sink is presented. The device uses liquid cooling in microchannels to remove high heat fluxes. Deep reactive ion etching and multiple wafer bonding is employed to fabricate high aspect ratio, enhanced heat transfer surfaces and a flow channel network ...
Christopher A. Bang +2 more
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<div class="section abstract"><div class="htmlview paragraph">A silicon micromachined heat sink is presented. The device uses liquid cooling in microchannels to remove high heat fluxes. Deep reactive ion etching and multiple wafer bonding is employed to fabricate high aspect ratio, enhanced heat transfer surfaces and a flow channel network ...
Christopher A. Bang +2 more
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International Symposium on Microelectronics, 2010
Conventional heat sinks for processors achieve improved heat transfer efficiency by impinging ambient air over stationary fins. Further improvement in the air film heat transfer coefficient through increased air speed becomes asymptotic and invariably results in undesirable acoustic noise.
Vijay Khanna +2 more
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Conventional heat sinks for processors achieve improved heat transfer efficiency by impinging ambient air over stationary fins. Further improvement in the air film heat transfer coefficient through increased air speed becomes asymptotic and invariably results in undesirable acoustic noise.
Vijay Khanna +2 more
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Thin vapor chamber heat sink and embedded heat pipe heat sink performance evaluations
2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2009Vapor chamber and heat pipe technologies are not new concepts, but their fabrication and manufacturing processes have been improving. Both vapor chambers and heat pipes have been getting thinner allowing the integrated heat sink design with increased fin surfaces. For example, for vapor chambers, the minimum achievable thickness has been reduced from 5
Garrett Glover +3 more
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Characterization of Heat Sink Flow Bypass in Plate Fin Heat Sinks
Heat Transfer, Volume 5, 2002Experimental testing has been performed on two plate fin heat sinks in order to examine flow bypass phenomenon. The present study examines pressure drop and thermal resistance as well as flow velocities within the heat sinks. Tests are performed for bypass channel/fin height ratios of 0.25, 0.5, 0.75 and 1 with approach velocities from 2 to 8 m/s.
W. Leonard +3 more
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Magnesium Heat Sink Evaluations
SAE Technical Paper Series, 1993<div class="htmlview paragraph">A system has been constructed to estimate heat dissipated from geometrically identical heat sinks and pinfins extruded from magnesium (M1A) and aluminum (6063-T5)alloys. Two longitudinal fins of circular cross sectional area, machined from aluminum and magnesium, are used to calibrate the equipment.
James F. Brown +2 more
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Thermal comparison of plate, extrusion heat sink, and skive heat sink
Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189), 2002Due to the high power dissipation values of power amplifiers, large temperature gradients exist, resulting in localized hot spots around the devices. These hot spots cause high device junction temperatures. Generally speaking, the higher junction temperature increases, the lower reliability will be. Thus, improving the heat spreading is very important.
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Advanced Energy Materials, 2013
The limitation of hot spot cooling in microchips represents an important hurdle for the electronics industry to overcome with coolers yet to exceed the efficiencies required. Nanotechnology‐enabled heat sinks that can be magnetophoretically formed onto the hot spots within a microfluidic environment are presented.
Yi, P. +7 more
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The limitation of hot spot cooling in microchips represents an important hurdle for the electronics industry to overcome with coolers yet to exceed the efficiencies required. Nanotechnology‐enabled heat sinks that can be magnetophoretically formed onto the hot spots within a microfluidic environment are presented.
Yi, P. +7 more
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Micro-Heat-Sinks for Space Applications
ASME 2nd International Conference on Microchannels and Minichannels, 2004During the space missions, the problems related to the thermal conditioning of devices, to the personnel comfort and to the thermo-mechanical stresses are known and important. Furthermore for a space mission certain priorities are stressed, such as the small dimension and the lightness of thermal equipments.
MARENGO, Marco +3 more
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Heat Transfer in Spiral Channel Heat Sinks
ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, Volume 1, 2011Heat transfer in a spiral heat sink is examined experimentally and analytically. The spiral channel was fabricated on a base plate of copper. The cross section of the channel is square with 1 mm sides. A copper cap plate was bolted tight to seal the channel.
M. Ghobadi, Y. S. Muzychka
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