Results 311 to 320 of about 2,576,432 (406)
Effect of fin geometry on the thermal performance of heat sink under natural convection
Cheng See Yuan +2 more
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Energy Balancing of Electrochemical Alternatives to the Solvay Process
To overcome the CaCl2 and CO2 emissions custom to the conventional Solvay process in soda ash production, electrochemically based alternatives were investigated. In particular, the mass‐ and energy balances for chlor‐alkali electrolysis and bipolar electrodialysis‐based processes are discussed comprehensively in the presented work.
Tom Wenzel +3 more
wiley +1 more source
Planetary Heat Sink Uncouples Temperature Increase from Rising CO2: Climate Change Hiatus Explained
Monica Houweling, Megan Gavitt, Jean Kim
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Numerical Heat Transfer, Part A Applications, 2023
The investigation of waste discharge concentration with microchannel plays a significant impact on environmental applications. Microchannels are utilized in treatment facilities for wastewater to manage the concentration of pollutants and impurities ...
J. Madhukesh +4 more
semanticscholar +1 more source
The investigation of waste discharge concentration with microchannel plays a significant impact on environmental applications. Microchannels are utilized in treatment facilities for wastewater to manage the concentration of pollutants and impurities ...
J. Madhukesh +4 more
semanticscholar +1 more source
Experimental heat transfer, 2022
This study reports the results of experimental and numerical investigations on the thermal performance of a miniaturized phase change material (PCM) heat sink coupled with heat pipe.
Girish Kumar Marri, C. Balaji
semanticscholar +1 more source
This study reports the results of experimental and numerical investigations on the thermal performance of a miniaturized phase change material (PCM) heat sink coupled with heat pipe.
Girish Kumar Marri, C. Balaji
semanticscholar +1 more source
SAE Technical Paper Series, 1999
<div class="section abstract"><div class="htmlview paragraph">A silicon micromachined heat sink is presented. The device uses liquid cooling in microchannels to remove high heat fluxes. Deep reactive ion etching and multiple wafer bonding is employed to fabricate high aspect ratio, enhanced heat transfer surfaces and a flow channel network ...
Christopher A. Bang +2 more
openaire +1 more source
<div class="section abstract"><div class="htmlview paragraph">A silicon micromachined heat sink is presented. The device uses liquid cooling in microchannels to remove high heat fluxes. Deep reactive ion etching and multiple wafer bonding is employed to fabricate high aspect ratio, enhanced heat transfer surfaces and a flow channel network ...
Christopher A. Bang +2 more
openaire +1 more source

