Results 331 to 340 of about 2,576,432 (406)

Experimental Study on the Thermal Performance of a Finned Metal Foam Heat Sink with Phase Change Material

Heat Transfer Engineering, 2020
The present research conducts an experimental study on the thermal performance of the finned metal foam (FMF) heat sinks with phase change material. The dynamic temperature response of an FMF heat sink is analyzed and compared with the corresponding ...
Yongping Huang, Qing Sun, Feng Yao, Chengbin Zhang   +3 more
semanticscholar   +1 more source

Multi-objective optimal design of microchannel cooling heat sink using topology optimization method

Numerical Heat Transfer, Part A Applications, 2020
This article presents a density-based topology optimization (TO) method for a coupled thermal-fluid problem, in which the Navier-Stokes and heat transport equations are coupled.
Xin Dong, Xiaomin Liu
semanticscholar   +1 more source

Experimental investigation on additive manufactured single and curved double layered microchannel heat sink with nanofluids

Heat and Mass Transfer, 2023
G. Narendran, B. Mallikarjuna, B. Nagesha, N. Gnanasekaran   +3 more
semanticscholar   +1 more source

On the assessment of the thermal performance of microchannel heat sink with nanofluid

International Journal of Heat and Mass Transfer, 2023
C. Ho, Jianqiang Peng, Tien-Fu Yang, S. Rashidi, Wei‐Mon Yan   +4 more
semanticscholar   +1 more source

Simulation and optimization of thermal performance in diverging/converging manifold microchannel heat sink

International Journal of Heat and Mass Transfer, 2023
K. Tang, G. Lin, Yuandong Guo, Jinyin Huang, Hongxing Zhang, Jianyin Miao   +5 more
semanticscholar   +1 more source

Thermal comparison of plate, extrusion heat sink, and skive heat sink

Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189), 2002
Due to the high power dissipation values of power amplifiers, large temperature gradients exist, resulting in localized hot spots around the devices. These hot spots cause high device junction temperatures. Generally speaking, the higher junction temperature increases, the lower reliability will be. Thus, improving the heat spreading is very important.
openaire   +1 more source

Dynamic Nanofin Heat Sinks

Advanced Energy Materials, 2013
The limitation of hot spot cooling in microchips represents an important hurdle for the electronics industry to overcome with coolers yet to exceed the efficiencies required. Nanotechnology‐enabled heat sinks that can be magnetophoretically formed onto the hot spots within a microfluidic environment are presented.
Yi, P., Khoshmanesh, K., Chrimes, A. F., Campbell, J. L., Ghorbani, K., Nahavandi, S., Rosengarten, G., Kalantar-Zadeh, K.   +7 more
openaire   +2 more sources

Heat transfer performance study of microchannel heat sink with composite secondary channels

International Communications in Heat and Mass Transfer, 2023
H. Wen, Zhixuan Liang, Qingyi Luo, Chili Wu, Changhong Wang   +4 more
semanticscholar   +1 more source

Micro-Heat-Sinks for Space Applications

ASME 2nd International Conference on Microchannels and Minichannels, 2004
During the space missions, the problems related to the thermal conditioning of devices, to the personnel comfort and to the thermo-mechanical stresses are known and important. Furthermore for a space mission certain priorities are stressed, such as the small dimension and the lightness of thermal equipments.
MARENGO, Marco, COSSALI, Gianpietro, CHIGNOLI, Luca, ZHDANOV, SERGEY   +3 more
openaire   +2 more sources

Machine learning regression-CFD models for the nanofluid heat transfer of a microchannel heat sink with double synthetic jets

International Communications in Heat and Mass Transfer, 2022
J. Mohammadpour, S. Husain, F. Salehi, Ann Lee   +3 more
semanticscholar   +1 more source