Results 31 to 40 of about 32,763 (264)
<p style='text-indent:20px;'>In this paper we examine the identification problem of the heat sink for a one dimensional heat equation through observations of the solution at the boundary or through a desired temperature profile to be attained at a certain given time.
Audu, J. D. +3 more
openaire +3 more sources
Harnessing Fungal Biowelding for Constructing Mycelium‐Engineered Materials
Mycelium‐bound composites (MBCs) offer low‐carbon alternatives for construction, yet interfacial bonding remains a critical challenge. This review examines fungal biowelding as a biocompatible adhesive, elucidating mycelium‐mediated interfacial mechanisms and their role in material assembly. Strategies to optimize biowelding are discussed, highlighting
Xue Brenda Bai +2 more
wiley +1 more source
To investigate the effect of the target weight coefficient on the structure design of the micro-channel heat sink, an innovative method for the topology optimization design of micro-channel structures with different bifurcation angles is adopted. In this
Yue Wang, Jiahao Wang, Xiaomin Liu
doaj +1 more source
This article demonstrates the successful qualification of a copper–tungsten composite for laser powder bed fusion. The resulting components exhibited high density, high thermal conductivity, and reduced thermal expansion. Heat sinks with complex geometries were successfully manufactured, clearly showcasing the material's potential for additive ...
Simon Rauh +6 more
wiley +1 more source
A phase change materials (PCM)-based heat sink is an effective way to cool intermittent high-power electronic devices in aerospace applications such as airborne electronics and aircraft external carry. Optimizing the heat sink is significant in designing
Jianjun Zhang +4 more
doaj +1 more source
Low‐cycle fatigue damage in Mn–Mo–Ni reactor pressure vessel steel is examined using a combined electron backscatter diffraction and positron annihilation lifetime spectroscopy approach. The study correlates texture evolution, dislocation substructure development, and vacancy‐type defect formation across uniform, necked, and fracture regions, providing
Apu Sarkar +2 more
wiley +1 more source
Zinc(II) coordination complexes with tunable aryloxy‐imine ligands exhibit controllable supramolecular self‐assembly into hierarchical fibrous structures. Coordination‐driven stacking, not π–π interactions, enables gelation, dynamic assembly/disassembly, and enhanced nanomechanical properties.
Merlin R. Stühler +10 more
wiley +1 more source
Thermal Performance of Hollow Fluid-Filled Heat Sinks
The increasing power density of electronic devices drives the need for lighter, more compact heat dissipation devices. This research determines whether a hollow heat sink filled with fluid outperforms solid heat sinks for heat dissipation.
John Nuszkowski +3 more
doaj +1 more source
Optimal heat dissipation in power modules can significantly increase their power density. Removing the generated heat is critical for capturing the benefits of advanced semiconductor materials and improving the reliability of the device operation.
Emre Gurpinar, Raj Sahu, Burak Ozpineci
doaj +1 more source
Shellac, a centuries‐old natural resin, is reimagined as a green material for flexible electronics. When combined with silver nanowires, shellac films deliver transparency, conductivity, and stability against humidity. These results position shellac as a sustainable alternative to synthetic polymers for transparent conductors in next‐generation ...
Rahaf Nafez Hussein +4 more
wiley +1 more source

