Results 51 to 60 of about 2,576,432 (406)

Thermal Performance of Hollow Fluid-Filled Heat Sinks

open access: yesEnergies
The increasing power density of electronic devices drives the need for lighter, more compact heat dissipation devices. This research determines whether a hollow heat sink filled with fluid outperforms solid heat sinks for heat dissipation.
John Nuszkowski   +3 more
doaj   +1 more source

Heat Sink Design for WBG Power Modules Based on Fourier Series and Evolutionary Multi-Objective Multi-Physics Optimization

open access: yesIEEE Open Journal of Power Electronics, 2021
Optimal heat dissipation in power modules can significantly increase their power density. Removing the generated heat is critical for capturing the benefits of advanced semiconductor materials and improving the reliability of the device operation.
Emre Gurpinar, Raj Sahu, Burak Ozpineci
doaj   +1 more source

Heat-load simulator for heat sink design [PDF]

open access: yes, 1968
Heat-load simulator is fabricated from 1/4-inch aluminum plate with a contact surface equal in dimensions and configuration to those of the electronic installation.
Dunleavy, A. M., Vaughn, T. J.
core   +1 more source

Composites of Shellac and Silver Nanowires as Flexible, Biobased, and Corrosion‐Resistant Transparent Conductive Electrodes

open access: yesAdvanced Functional Materials, EarlyView.
Shellac, a centuries‐old natural resin, is reimagined as a green material for flexible electronics. When combined with silver nanowires, shellac films deliver transparency, conductivity, and stability against humidity. These results position shellac as a sustainable alternative to synthetic polymers for transparent conductors in next‐generation ...
Rahaf Nafez Hussein   +4 more
wiley   +1 more source

Effect of source-sink misalignment and sink cavity aspect ratio on the thermal performance of gallium heat sinks

open access: yesInternational Journal of Thermofluids
Herein, we numerically investigated methods to improve heat dissipation from the base of a phase-change material (PCM) heat sink exposed to high heat flux (15 W/cm2).
Salah Addin Burhan Al-Omari   +3 more
doaj   +1 more source

Multiple Phase Change Material (PCM) Configuration for PCM-Based Heat Sinks—An Experimental Study

open access: yesEnergies, 2018
A small-scale phase change material (PCM)-based heat sink can regulate the temperature of electronics due to high latent-heat capacity. Three different heat sinks are examined to study the effects of PCM combination, arrangement of PCMs in multiple-PCM ...
Idris Al Siyabi   +3 more
doaj   +1 more source

Topology Optimization Design of Micro-Channel Heat Sink by Considering the Coupling of Fluid-Solid and Heat Transfer

open access: yesEnergies, 2022
To investigate the effect of the target weight coefficient on the structure design of the micro-channel heat sink, an innovative method for the topology optimization design of micro-channel structures with different bifurcation angles is adopted. In this
Yue Wang, Jiahao Wang, Xiaomin Liu
doaj   +1 more source

Water-filled heat pipe useful at moderate temperatures [PDF]

open access: yes, 1970
Heat pipe is used in the primary heat exchanger for nuclear power plants, as a heat sink for high-power electronic devices, and in a closed-cycle heat rejection mechanism for cryogenic storage tanks. It serves simultaneously as a heat transfer device and
Mc Kinney, B. G.
core   +1 more source

Saturated Critical Heat Flux in a Multi-Microchannel Heat Sink Fed by a Split Flow System [PDF]

open access: yes, 2010
An extensive experimental campaign has been carried out for the measurement of saturated critical heat flux in a multi-microchannel copper heat sink. The heat sink was formed by 29 parallel channels that were 199 μm wide and 756 μm deep.
D. Toto   +3 more
core   +1 more source

Thermal performance of phase change material–based heat sink for passive cooling of electronic components: An experimental study

open access: yesInternational Journal of Energy Research, 2020
Present paper reports the thermal performance of various phase change material (PCM)‐based heat sinks during melting process for cooling of portable electronic devices through experimental investigations.
R. Kothari   +3 more
semanticscholar   +1 more source

Home - About - Disclaimer - Privacy