Results 51 to 60 of about 2,576,432 (406)
Thermal Performance of Hollow Fluid-Filled Heat Sinks
The increasing power density of electronic devices drives the need for lighter, more compact heat dissipation devices. This research determines whether a hollow heat sink filled with fluid outperforms solid heat sinks for heat dissipation.
John Nuszkowski +3 more
doaj +1 more source
Optimal heat dissipation in power modules can significantly increase their power density. Removing the generated heat is critical for capturing the benefits of advanced semiconductor materials and improving the reliability of the device operation.
Emre Gurpinar, Raj Sahu, Burak Ozpineci
doaj +1 more source
Heat-load simulator for heat sink design [PDF]
Heat-load simulator is fabricated from 1/4-inch aluminum plate with a contact surface equal in dimensions and configuration to those of the electronic installation.
Dunleavy, A. M., Vaughn, T. J.
core +1 more source
Shellac, a centuries‐old natural resin, is reimagined as a green material for flexible electronics. When combined with silver nanowires, shellac films deliver transparency, conductivity, and stability against humidity. These results position shellac as a sustainable alternative to synthetic polymers for transparent conductors in next‐generation ...
Rahaf Nafez Hussein +4 more
wiley +1 more source
Herein, we numerically investigated methods to improve heat dissipation from the base of a phase-change material (PCM) heat sink exposed to high heat flux (15 W/cm2).
Salah Addin Burhan Al-Omari +3 more
doaj +1 more source
Multiple Phase Change Material (PCM) Configuration for PCM-Based Heat Sinks—An Experimental Study
A small-scale phase change material (PCM)-based heat sink can regulate the temperature of electronics due to high latent-heat capacity. Three different heat sinks are examined to study the effects of PCM combination, arrangement of PCMs in multiple-PCM ...
Idris Al Siyabi +3 more
doaj +1 more source
To investigate the effect of the target weight coefficient on the structure design of the micro-channel heat sink, an innovative method for the topology optimization design of micro-channel structures with different bifurcation angles is adopted. In this
Yue Wang, Jiahao Wang, Xiaomin Liu
doaj +1 more source
Water-filled heat pipe useful at moderate temperatures [PDF]
Heat pipe is used in the primary heat exchanger for nuclear power plants, as a heat sink for high-power electronic devices, and in a closed-cycle heat rejection mechanism for cryogenic storage tanks. It serves simultaneously as a heat transfer device and
Mc Kinney, B. G.
core +1 more source
Saturated Critical Heat Flux in a Multi-Microchannel Heat Sink Fed by a Split Flow System [PDF]
An extensive experimental campaign has been carried out for the measurement of saturated critical heat flux in a multi-microchannel copper heat sink. The heat sink was formed by 29 parallel channels that were 199 μm wide and 756 μm deep.
D. Toto +3 more
core +1 more source
Present paper reports the thermal performance of various phase change material (PCM)‐based heat sinks during melting process for cooling of portable electronic devices through experimental investigations.
R. Kothari +3 more
semanticscholar +1 more source

