Results 21 to 30 of about 136,273 (298)

Transient thermal behavior of a passive heat sink integrated with phase change material: A numerical simulation

International Journal of Thermofluids, 2023
This paper presents a numerical investigation of the thermal performance of a heat sink augmented with phase change material (PCM) for passive electronic cooling applications.
Vahid Safari, Babak Kamkari, Masoud Zandimagham, Neil Hewitt   +3 more
doaj   +1 more source

Analysis of Fin Interruptions on the Natural Convection of Heat Sinks [PDF]

E3S Web of Conferences, 2023
For heat sinks with high fins used in outdoor high-power electronic equipment, this paper proposes a natural convection heat transfer calculation method based on the chimney effect and uses this method and numerical simulation to analyze the heat ...
Lin Wei, Qin Yang, Su Lei
doaj   +1 more source

Three-dimensional transient CFD modeling of multiple finned aluminum foam heat sinks in a horizontal channel

Alexandria Engineering Journal, 2023
Finned metal foam heat sinks are well-known because of their excellent performance in cooling of powered electronics. In this study, three-dimensional transient numerical simulations of finned aluminum foam heat sinks in a forced convection of air were ...
Boulahrouz Salim, Saoudi Abdenour, Chahaoui Oualid, Hadi M. Marwani, Rokkaya Sami, N.I. Aljuraide, Raed H. Althomali, Mohammed M. Rahman, Meser M. Ali, M.A. El Bouz   +9 more
doaj   +1 more source

A critical review of the straight and wavy microchannel heat sink and the application in lithium-ion battery thermal management

International Journal of Thermofluids, 2022
As demand for high-performance heat transfer increases, interest in microchannel heat sinks as a viable solution for heat flux removal in thermal devices has grown significantly.
M. Hajialibabaei, M.Z. Saghir
doaj   +1 more source

Design and Optimization of Heat Sinks for the Liquid Cooling of Electronics with Multiple Heat Sources: A Literature Review

Energies, 2023
This paper presents a detailed literature review on the thermal management issue faced by electronic devices, particularly concerning uneven heating and overheating problems.
Yijun Li, Stéphane Roux, Cathy Castelain, Yilin Fan, Lingai Luo   +4 more
doaj   +1 more source

Experimental Investigation of Free Convection from Foam Heat Sinks in an Inclined Rectangular Channel

Cumhuriyet Science Journal, 2018
Inthis present study, free convection from an in-line 5x1 array of aluminum foamheat sinks which were placed on the bottom wall of the inclined rectangularchannel was investigated.
Ayla Doğan, Oğuzhan Özbalcı
doaj   +1 more source

Thermal-hydraulic modeling of heat sink under force convection: Investigating the effect of wings on new designs

Alexandria Engineering Journal, 2023
This study aims to investigate the heat transfer performance and fluid flow characteristics of different geometrical configurations of new heat sinks.
Ahmad Naufal bin Samsudin, Alhassan Salami Tijani, Sajith Thottathil Abdulrahman, Jeeventh Kubenthiran, Ibrahim Kolawole Muritala   +4 more
doaj   +1 more source

3D Metal printed heat sinks with longitudinally varying lattice structure sizes using direct metal laser sintering

Virtual and Physical Prototyping, 2018
This research relates to the design, modelling and fabrication of 3D metal printed heat sinks. The heat sinks presented in the research are the commonly used longitudinal fin solid heat sink (LFSHS) and three LFSHS lattice structure designs, differing ...
Deepak Shamvedi, Oliver J. McCarthy, Eoghan O’Donoghue, Cyril Danilenkoff, Paul O’Leary, Ramesh Raghavendra   +5 more
doaj   +1 more source

Fluid Flow and Entropy Generation Analysis of Al₂O₃-Water Nanofluid in Microchannel Plate Fin Heat Sinks. [PDF]

Entropy (Basel), 2019
The flow in channels of microdevices is usually in the developing regime. Three-dimensional laminar flow characteristics of a nanofluid in microchannel plate fin heat sinks are investigated numerically in this paper. Deionized water and Al2O3−water
Ma H, Duan Z, Su L, Ning X, Bai J, Lv X.
europepmc   +2 more sources

Finite element analysis of the effect of fin geometry on thermal performance of heat sinks in microelectronics

Journal of Applied Sciences and Environmental Management, 2020
Heat sinks are commonly used for the dissipation of heat in microelectronics  packages. The choice of optimal heat sinks configuration largely depends on the market demand and thermal performance.
M Ekpu
doaj   +1 more source