Results 191 to 200 of about 134,317 (310)

Effects of Porosity on the Fatigue Behaviour of AlZn10Si8Mg Casting Alloys in a High Cycle Region

open access: diamond, 2017
Denisa Závodská   +4 more
openalex   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

Very High Cycle Fatigue Behavior of Additively Manufactured 316L Stainless Steel. [PDF]

open access: yesMaterials (Basel), 2020
Voloskov B   +5 more
europepmc   +1 more source

A comparative study of low cycle fatigue behavior and microstructure of Cr-based steel at room and high temperatures

open access: gold, 2020
Quanyi Wang   +9 more
openalex   +1 more source

Photothermomechanically Efficient, Low‐Cost, High‐Cycle‐Life, Hybrid MXene‐Polymer Actuators

open access: yesAdvanced Materials Technologies, EarlyView.
The addition of MXenes to elastomer‐plastic‐paper films enables the creation of easily prepared actuators that are scalable for small robotic applications. Known as MXene‐polymer Trilayer Actuators (MPTAs), they bend from UV light. Their usefulness is demonstrated through kirigami‐inspired flower‐shaped art design, parallel manipulator for waveguiding,
Ken Iiyoshi   +6 more
wiley   +1 more source

Laser Micromachining of Liquid Metal Patterns for Stretchable Electronic Circuits

open access: yesAdvanced Materials Technologies, EarlyView.
A cleanroom‐free fabrication strategy combines UV‐laser micromachining with a copper foil wetting layer to rapidly produce high resolution, liquid metal based stretchable electronic circuits on diverse substrates. The scalable, maskless process enables complex circuit designs (<$<$3 h, ∼$\sim$15/device) with excellent electrical stability under strain,
Merjen Palvanova   +3 more
wiley   +1 more source

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