Results 131 to 140 of about 264,049 (257)

One Flow to Correct Them all: Improving Simulations in High-Energy Physics with a Single Normalising Flow and a Switch. [PDF]

Comput Softw Big Sci
Daumann C, Donega M, Erdmann J, Galli M, Späh JL, Valsecchi D.   +5 more
europepmc   +1 more source

Recycling of NiTi Shape Memory Alloys: Fundamental and Technological Aspects of a Vacuum Induction Melting Processing Route

Advanced Engineering Materials, EarlyView.
The present study investigates recycling of NiTi shape memory alloys via vacuum induction melting. An ingot was synthesized from elemental Ni and Ti and subjected to three subsequent remelting cycles. Remelting increases process durations and impurity levels and adversely affects microstructures and functional properties.
Sakia Sophia Noorzayee, Son Tung Mai, Sarath Menon, Braulio Gadiel Sánchez Ortega, Ralf Drautz, Alexander Kauffmann, Gunther Eggeler, Jan Frenzel   +7 more
wiley   +1 more source

Current Status and Challenges in Data Collection for Aerospace Coatings Deposited by Plasma Spraying

Advanced Engineering Materials, EarlyView.
An innovative approach has been integrated into the GRENAT project to optimize plasma spraying and coating performance. Raw materials are accelerated and melted in the plasma generated by torches, creating coatings. Monitoring sensors collect process data which are combined with ex situ characterization data.
Lila Randriamananjara, Vincent Rat, Quentin Dubreuil, Patrice Valorge, Simon Goutier, Alain Denoirjean, Olivier Messe, Céline Ruelle, Jean‐Philippe Poli   +8 more
wiley   +1 more source

Workflow for Design of Experiments‐Based Modeling of Species Transport and Growth Kinetics in GaN Hydride Vapor Phase Epitaxy

Advanced Engineering Materials, EarlyView.
A novel workflow for investigating hydride vapor phase epitaxy for GaN bulk crystal growth is proposed. It combines Design of experiments (DoE) with physical simulations of mass transport and crystal growth kinetics, serving as an intermediate step between DoE and experiments.
J. Tomkovič, G. Lukin, H. Torkashvand, A. Kerschbaum, M. Müller, S. Besendörfer, J. Heitmann, J. Friedrich   +7 more
wiley   +1 more source

Ontology‐Aligned Structuring and Reuse of Multimodal Materials Data and Workflows Toward Automatic Reproduction

Advanced Engineering Materials, EarlyView.
Reproduction of stacking fault energy calculations from literature with a semi‐automated large language model‐assisted extraction procedure: extraction of simulation protocol, atomistic structures, computational parameters, and reported results, ontology alignment, knowledge graph construction and, finally, recomputation forvalidation.
Sepideh Baghaee Ravari, Abril Azocar Guzman, Sarath Menon, Stefan Sandfeld, Tilmann Hickel, Markus Stricker   +5 more
wiley   +1 more source

Erratum to: Measurement of e + e − → ωπ + π − cross section at s $$ \sqrt{s} $$ = 2.000 to 3.080 GeV

Journal of High Energy Physics, 2023
The BESIII collaboration, M. Ablikim, M. N. Achasov, P. Adlarson, S. Ahmed, M. Albrecht, R. Aliberti, A. Amoroso, M. R. An, Q. An, X. H. Bai, Y. Bai, O. Bakina, R. Baldini Ferroli, I. Balossino, Y. Ban, V. Batozskaya, D. Becker, K. Begzsuren, N. Berger, M. Bertani, D. Bettoni, F. Bianchi, J. Bloms, A. Bortone, I. Boyko, R. A. Briere, A. Brueggemann, H. Cai, X. Cai, A. Calcaterra, G. F. Cao, N. Cao, S. A. Cetin, J. F. Chang, W. L. Chang, G. Chelkov, C. Chen, G. Chen, H. S. Chen, M. L. Chen, S. J. Chen, T. Chen, X. R. Chen, X. T. Chen, Y. B. Chen, Z. J. Chen, W. S. Cheng, G. Cibinetto, F. Cossio, J. J. Cui, H. L. Dai, J. P. Dai, X. C. Dai, A. Dbeyssi, R. E. de Boer, D. Dedovich, Z. Y. Deng, A. Denig, I. Denysenko, M. Destefanis, F. De Mori, Y. Ding, J. Dong, L. Y. Dong, M. Y. Dong, X. Dong, S. X. Du, P. Egorov, Y. L. Fan, J. Fang, S. S. Fang, Y. Fang, R. Farinelli, L. Fava, F. Feldbauer, G. Felici, C. Q. Feng, J. H. Feng, K. Fischer, M. Fritsch, C. D. Fu, Y. N. Gao, Yang Gao, I. Garzia, P. T. Ge, C. Geng, E. M. Gersabeck, A. Gilman, K. Goetzen, L. Gong, W. X. Gong, W. Gradl, M. Greco, M. H. Gu, C. Y. Guan, A. Q. Guo, A. Q. Guo, L. B. Guo, R. P. Guo, Y. P. Guo, A. Guskov, T. T. Han, W. Y. Han, X. Q. Hao, F. A. Harris, K. K. He, K. L. He, F. H. Heinsius, C. H. Heinz, Y. K. Heng, C. Herold, M. Himmelreich, T. Holtmann, G. Y. Hou, Y. R. Hou, Z. L. Hou, H. M. Hu, J. F. Hu, T. Hu, Y. Hu, G. S. Huang, K. X. Huang, L. Q. Huang, X. T. Huang, Y. P. Huang, Z. Huang, T. Hussain, N. Hüsken, W. Imoehl, M. Irshad, S. Jaeger, S. Janchiv, Q. Ji, Q. P. Ji, X. B. Ji, X. L. Ji, Y. Y. Ji, H. B. Jiang, S. S. Jiang, X. S. Jiang, J. B. Jiao, Z. Jiao, S. Jin, Y. Jin, M. Q. Jing, T. Johansson, N. Kalantar-Nayestanaki, X. S. Kang, R. Kappert, M. Kavatsyuk, B. C. Ke, I. K. Keshk, A. Khoukaz, P. Kiese, R. Kiuchi, R. Kliemt, L. Koch, O. B. Kolcu, B. Kopf, M. Kuemmel, M. Kuessner, A. Kupsc, M. G. Kurth, W. Kühn, J. J. Lane, J. S. Lange, P. Larin, A. Lavania, L. Lavezzi, Z. H. Lei, H. Leithoff, M. Lellmann, T. Lenz, C. Li, C. Li, C. H. Li, Cheng Li, D. M. Li, F. Li, G. Li, H. Li, H. Li, H. B. Li, H. J. Li, H. N. Li, J. L. Li, J. Q. Li, J. S. Li, Ke Li, L. J. Li, L. K. Li, Lei Li, M. H. Li, P. R. Li, S. X. Li, S. Y. Li, T. Li, W. D. Li, W. G. Li, X. H. Li, X. L. Li, Xiaoyu Li, Z. Y. Li, H. Liang, H. Liang, H. Liang, Y. F. Liang, Y. T. Liang, G. R. Liao, L. Z. Liao, J. Libby, A. Limphirat, C. X. Lin, D. X. Lin, T. Lin, B. J. Liu, C. X. Liu, D. Liu, F. H. Liu, Fang Liu, Feng Liu, G. M. Liu, H. M. Liu, Huanhuan Liu, Huihui Liu, J. B. Liu, J. L. Liu, J. Y. Liu, K. Liu, K. Y. Liu, Ke Liu, L. Liu, M. H. Liu, P. L. Liu, Q. Liu, S. B. Liu, T. Liu, T. Liu, W. M. Liu, X. Liu, Y. Liu, Y. B. Liu, Z. A. Liu, Z. Q. Liu, X. C. Lou, F. X. Lu, H. J. Lu, J. D. Lu, J. G. Lu, X. L. Lu, Y. Lu, Y. P. Lu, Z. H. Lu, C. L. Luo, M. X. Luo, T. Luo, X. L. Luo, X. R. Lyu, Y. F. Lyu, F. C. Ma, H. L. Ma, L. L. Ma, M. M. Ma, Q. M. Ma, R. Q. Ma, R. T. Ma, X. X. Ma, X. Y. Ma, Y. Ma, F. E. Maas, M. Maggiora, S. Maldaner, S. Malde, Q. A. Malik, A. Mangoni, Y. J. Mao, Z. P. Mao, S. Marcello, Z. X. Meng, J. G. Messchendorp, G. Mezzadri, H. Miao, T. J. Min, R. E. Mitchell, X. H. Mo, N. Yu. Muchnoi, H. Muramatsu, S. Nakhoul, Y. Nefedov, F. Nerling, I. B. Nikolaev, Z. Ning, S. Nisar, S. L. Olsen, Q. Ouyang, S. Pacetti, X. Pan, Y. Pan, A. Pathak, A. Pathak, M. Pelizaeus, H. P. Peng, K. Peters, J. Pettersson, J. L. Ping, R. G. Ping, S. Plura, S. Pogodin, R. Poling, V. Prasad, H. Qi, H. R. Qi, M. Qi, T. Y. Qi, S. Qian, W. B. Qian, Z. Qian, C. F. Qiao, J. J. Qin, L. Q. Qin, X. P. Qin, X. S. Qin, Z. H. Qin, J. F. Qiu, S. Q. Qu, S. Q. Qu, K. H. Rashid, K. Ravindran, C. F. Redmer, K. J. Ren, A. Rivetti, V. Rodin, M. Rolo, G. Rong, Ch. Rosner, M. Rump, H. S. Sang, A. Sarantsev, Y. Schelhaas, C. Schnier, K. Schoenning, M. Scodeggio, K. Y. Shan, W. Shan, X. Y. Shan, J. F. Shangguan, L. G. Shao, M. Shao, C. P. Shen, H. F. Shen, X. Y. Shen, B.-A. Shi, H. C. Shi, R. S. Shi, X. Shi, X. D. Shi, J. J. Song, W. M. Song, Y. X. Song, S. Sosio, S. Spataro, F. Stieler, K. X. Su, P. P. Su, Y.-J. Su, G. X. Sun, H. K. Sun, J. F. Sun, L. Sun, S. S. Sun, T. Sun, W. Y. Sun, X. Sun, Y. J. Sun, Y. Z. Sun, Z. T. Sun, Y. H. Tan, Y. X. Tan, C. J. Tang, G. Y. Tang, J. Tang, L. Y. Tao, Q. T. Tao, J. X. Teng, V. Thoren, W. H. Tian, Y. T. Tian, I. Uman, B. Wang, D. Y. Wang, F. Wang, H. J. Wang, H. P. Wang, K. Wang, L. L. Wang, M. Wang, M. Z. Wang, Meng Wang, S. Wang, T. J. Wang, W. Wang, W. H. Wang, W. P. Wang, X. Wang, X. F. Wang, X. L. Wang, Y. D. Wang, Y. F. Wang, Y. Q. Wang, Y. Y. Wang, Ying Wang, Z. Wang, Z. Y. Wang, Ziyi Wang, Zongyuan Wang, D. H. Wei, F. Weidner, S. P. Wen, D. J. White, U. Wiedner, G. Wilkinson, M. Wolke, L. Wollenberg, J. F. Wu, L. H. Wu, L. J. Wu, X. Wu, X. H. Wu, Y. Wu, Z. Wu, L. Xia, T. Xiang, H. Xiao, S. Y. Xiao, Y. L. Xiao, Z. J. Xiao, X. H. Xie, Y. G. Xie, Y. H. Xie, Z. P. Xie, T. Y. Xing, C. F. Xu, C. J. Xu, G. F. Xu, Q. J. Xu, S. Y. Xu, W. Xu, X. P. Xu, Y. C. Xu, F. Yan, L. Yan, W. B. Yan, W. C. Yan, H. J. Yang, H. X. Yang, L. Yang, S. L. Yang, Y. X. Yang, Yifan Yang, Zhi Yang, M. Ye, M. H. Ye, J. H. Yin, Z. Y. You, B. X. Yu, C. X. Yu, G. Yu, J. S. Yu, T. Yu, C. Z. Yuan, L. Yuan, S. C. Yuan, X. Q. Yuan, Y. Yuan, Z. Y. Yuan, C. X. Yue, A. A. Zafar, X. Zeng, Y. Zeng, Y. H. Zhan, A. Q. Zhang, B. L. Zhang, B. X. Zhang, G. Y. Zhang, H. Zhang, H. H. Zhang, H. H. Zhang, H. Y. Zhang, J. L. Zhang, J. Q. Zhang, J. W. Zhang, J. Y. Zhang, J. Z. Zhang, Jianyu Zhang, Jiawei Zhang, L. M. Zhang, L. Q. Zhang, Lei Zhang, P. Zhang, Shulei Zhang, X. D. Zhang, X. M. Zhang, X. Y. Zhang, X. Y. Zhang, Y. Zhang, Y. T. Zhang, Y. H. Zhang, Yan Zhang, Yao Zhang, Z. H. Zhang, Z. Y. Zhang, Z. Y. Zhang, G. Zhao, J. Zhao, J. Y. Zhao, J. Z. Zhao, Lei Zhao, Ling Zhao, M. G. Zhao, Q. Zhao, S. J. Zhao, Y. B. Zhao, Y. X. Zhao, Z. G. Zhao, A. Zhemchugov, B. Zheng, J. P. Zheng, Y. H. Zheng, B. Zhong, C. Zhong, X. Zhong, L. P. Zhou, Q. Zhou, X. Zhou, X. K. Zhou, X. R. Zhou, X. Y. Zhou, Y. Z. Zhou, A. N. Zhu, J. Zhu, K. Zhu, K. J. Zhu, S. H. Zhu, T. J. Zhu, W. J. Zhu, W. J. Zhu, Y. C. Zhu, Z. A. Zhu, B. S. Zou, J. H. Zou   +550 more
doaj   +1 more source

Soft Mechanical‐Electrical Logic Using Liquid Metal‐Filled 3D‐Printed Architectures

Advanced Engineering Materials, EarlyView.
We present 3D‐printed soft mechanical–electrical logic elements that use liquid metal–filled silicone tubes actuated by thermoplastic polyurethane/polylactic acid (TPU/PLA) architectures to produce Boolean operations. Complementary normally open and normally closed unit cells perform repeatable binary transitions and can be combined into more complex ...
Christoph Lehmann, Ryan Kalgreen, Laura M. Comella   +2 more
wiley   +1 more source

Toward Knowledge‐Based Workflows: A Semantic Approach to Atomistic Simulations for Mechanical and Thermodynamic Properties

Advanced Engineering Materials, EarlyView.
Knowledge‐based atomistic workflows are presented for mechanical and thermodynamic properties. By coupling modular simulations with ontology‐aligned metadata and provenance, Fe case studies on elastic behavior, defects, thermal properties, and Hall–Petch strengthening reveal how FAIR, queryable, and reusable simulation data can be generated. Mechanical
Abril Azócar Guzmán, Hoang‐Thien Luu, Sarath Menon, Tilmann Hickel, Nina Merkert, Stefan Sandfeld   +5 more
wiley   +1 more source

Electrochemical Behavior of Flame‐Sprayed Sc‐Doped AlCoCrFeMo High‐Entropy Alloy Coatings in 3.5% Sodium Chloride Solution

Advanced Engineering Materials, EarlyView.
Scandium (Sc)‐doped AlCoCrFeMo HEA coatings are fabricated via flame spraying with 0.1, 0.3, and 0.5 wt% Sc additions. Among these, the HEA‐Sc0.3 coating exhibits the highest corrosion resistance, indicated by a more positive corrosion potential and lower current density.
Pankaj Kumar, Akash Vyas, Mohammad Aatif Qazi, Nashit Jalal, Maria Ophelia Jarligo, Mostafa Yakout, Jing Liu, André McDonald   +7 more
wiley   +1 more source

Cathodic Cage Plasma Deposition of Nanostructured Cu–Fe–Se Coatings on Poly(methyl Methacrylate)

Advanced Engineering Materials, EarlyView.
Nanostructured Cu–Fe–Se coatings are deposited on PMMA by a modified cathodic cage plasma process, enabling low‐temperature deposition on polymer substrates. A transition from discontinuous to compact morphology is observed with temperature, with optimal properties at 200°C, where improved CuFeSe2‐type bonding, lowest sheet resistance, and favorable ...
V. S. S. Sobrinho, M. Naeem, T. H. C. Costa, M. S. Libório, J. C. A. Queiroz, C. B. B. Luna, R. R. M. Sousa, P. S. Vieira, E. M. Araújo   +8 more
wiley   +1 more source