Results 11 to 20 of about 1,610 (129)
Mechanical lapping and polishing process of polycrystalline diamond wafers
ObjectivesDiamond is a critical material potentially or already applied in infrared windows, electronic components and acoustic devices for its excellent optical transmittance, high eletron mobility and high breakdown voltage.
Jiao LI +4 more
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The paper presents methodology for determining rational modes of abrasive processing for high-precision lenses while using a method of free lapping at finishing operations.
A. S. Kozeruk +4 more
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Sapphire is extensively utilized in the optical, aerospace, and civil electronic industries due to its favorable optical, physical, and chemical characteristics.
Sheng Wang +4 more
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Effect of Lapping Parameters on Material Removal Rate and Surface Roughness of GaN (0001) Plane
As a critical pretreatment process for chemical and mechanical polishing (CMP), the lapping roughness of gallium nitride (GaN) crystals directly influences the outcome of subsequent polishing and the reliability of final devices.
Hao Zhou +5 more
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The Al butt-lap joints are widely applied in China Railway High-speed (CRH) trains body joints. However, the gaps caused by the thermal deformation in Al butt-lap joints lead to the lack penetration or over penetration. To predict the penetration state of laser welds in Al butt-lap joints with different gaps, this work investigated the correlation ...
Yuhang Liu +7 more
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Material removal mode of lapping Si3N4balls
To explore the effect of grinding parameters on surface quality and the mechanism of material removal mode in lapping process, lapping experiment on Si3N4 bearing balls was carried out by vertical grinder.
ZHANG Ke +4 more
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High speed and high resolution chemical imaging based on a new type of OLED-LAPS set-up
AbstractA light-addressable potentiometric sensor (LAPS) is a field-effect based sensor. With a modulated light source, spatially resolved measurements of chemical species can be performed and chemical images can be generated. The modulated light source is used to define the particular measurement spot and to achieve spatially resolved signals. In this
Werner, Frederik (Dipl.-Ing.) +4 more
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7.2.5 High-speed Chemical Imaging System Based on Front-side-illuminated LAPS
The chemical imaging sensor is a Si-based chemical sensor that visualizes the spatial distribution of a specific ion in the solution contacted with the sensing surface. It is based on the principle of the lightaddressable potentiometric sensor (LAPS), in which a modulated light beam is used to read out the ion concentration in the form of photocurrent.
Akinori Itabashi +4 more
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To address the issue of rapid wear and loss of shape accuracy in traditional both-sides lapping plates, which limits the further application of both-sides machining for high-precision cylindrical rollers, an extremely high precision and consistent ...
Tianchen Zhao +6 more
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Machining characteristics of single crystal SiC wafer with copper lapping pad
The Siface and C face of 6H-SiC single crystal wafer were lapped by using the copper based lapping pad with spiral grooves and the effects of lapping pressure,pad speed and abrasive size on the material removal rate and the surface roughness of SiC were ...
LIANG Huazhuo, LU Jiabin, YAN Qiusheng
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