Results 11 to 20 of about 1,610 (129)

Mechanical lapping and polishing process of polycrystalline diamond wafers

open access: yesJin'gangshi yu moliao moju gongcheng
ObjectivesDiamond is a critical material potentially or already applied in infrared windows, electronic components and acoustic devices for its excellent optical transmittance, high eletron mobility and high breakdown voltage.
Jiao LI   +4 more
doaj   +3 more sources

Investigation of Machine Tool Developed Settings Influence on Productivity and Quality of Simultaneous Double-Sided Lens Processing

open access: yesНаука и техника, 2018
The paper presents methodology for determining rational modes of abrasive processing for high-precision lenses while using a method of free lapping at finishing operations.
A. S. Kozeruk   +4 more
doaj   +1 more source

Orthogonal experimental study on the influence of machining parameters on flat lapping of sapphire substrate

open access: yesAIP Advances
Sapphire is extensively utilized in the optical, aerospace, and civil electronic industries due to its favorable optical, physical, and chemical characteristics.
Sheng Wang   +4 more
doaj   +1 more source

Effect of Lapping Parameters on Material Removal Rate and Surface Roughness of GaN (0001) Plane

open access: yesCrystals
As a critical pretreatment process for chemical and mechanical polishing (CMP), the lapping roughness of gallium nitride (GaN) crystals directly influences the outcome of subsequent polishing and the reliability of final devices.
Hao Zhou   +5 more
doaj   +1 more source

Predicting laser penetration welding states of high-speed railway Al butt-lap joint based on EEMD-SVM

open access: yesJournal of Materials Research and Technology, 2022
The Al butt-lap joints are widely applied in China Railway High-speed (CRH) trains body joints. However, the gaps caused by the thermal deformation in Al butt-lap joints lead to the lack penetration or over penetration. To predict the penetration state of laser welds in Al butt-lap joints with different gaps, this work investigated the correlation ...
Yuhang Liu   +7 more
openaire   +2 more sources

Material removal mode of lapping Si3N4balls

open access: yesJin'gangshi yu moliao moju gongcheng, 2019
To explore the effect of grinding parameters on surface quality and the mechanism of material removal mode in lapping process, lapping experiment on Si3N4 bearing balls was carried out by vertical grinder.
ZHANG Ke   +4 more
doaj  

High speed and high resolution chemical imaging based on a new type of OLED-LAPS set-up

open access: yesProcedia Engineering, 2011
AbstractA light-addressable potentiometric sensor (LAPS) is a field-effect based sensor. With a modulated light source, spatially resolved measurements of chemical species can be performed and chemical images can be generated. The modulated light source is used to define the particular measurement spot and to achieve spatially resolved signals. In this
Werner, Frederik (Dipl.-Ing.)   +4 more
openaire   +2 more sources

7.2.5 High-speed Chemical Imaging System Based on Front-side-illuminated LAPS

open access: yesProceedings IMCS 2012, 2012
The chemical imaging sensor is a Si-based chemical sensor that visualizes the spatial distribution of a specific ion in the solution contacted with the sensing surface. It is based on the principle of the lightaddressable potentiometric sensor (LAPS), in which a modulated light beam is used to read out the ion concentration in the form of photocurrent.
Akinori Itabashi   +4 more
openaire   +2 more sources

High precision and consistent machining of cylindrical rollers using ceramic lapping plates with both-sides machining method

open access: yesJournal of Materials Research and Technology
To address the issue of rapid wear and loss of shape accuracy in traditional both-sides lapping plates, which limits the further application of both-sides machining for high-precision cylindrical rollers, an extremely high precision and consistent ...
Tianchen Zhao   +6 more
doaj   +1 more source

Machining characteristics of single crystal SiC wafer with copper lapping pad

open access: yesJin'gangshi yu moliao moju gongcheng, 2016
The Siface and C face of 6H-SiC single crystal wafer were lapped by using the copper based lapping pad with spiral grooves and the effects of lapping pressure,pad speed and abrasive size on the material removal rate and the surface roughness of SiC were ...
LIANG Huazhuo, LU Jiabin, YAN Qiusheng
doaj  

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