Results 151 to 160 of about 889,157 (202)

Recovery and Expansion of Patient-Derived Glioblastoma Cells After Long-term Cryopreservation. [PDF]

open access: yesBio Protoc
Khotchawan W   +4 more
europepmc   +1 more source

High Speed Copper Plating Process for IC Substrate

IMAPSource Proceedings, 2023
The integrated circuit (IC) substrate occupies an interesting place in electronic devices. They serve as the bridge between the integrated circuits and the PCB. In this connecting point, they must meet the requirements of both worlds. They must provide the high density of connections to match the IC chip, while at the same time be a stable and robust ...
Sean Fleuriel   +7 more
openaire   +1 more source

Backscattering peak of hexagonal ice columns and plates

Optics Letters, 2000
The backward cross section of hexagonal ice crystals of arbitrary orientation is calculated for visible light by means of a ray-tracing code. It is shown that backscattering of the tilted crystals is caused by a corner-reflector-like effect. A very large peak of backscattering is found for a tilt of 32.5 degrees between the principal particle axis and ...
A, Borovoi   +3 more
openaire   +2 more sources

Structure and Properties of Ice Plates

1996
In order to make any problem tractable, the applied mathematician must make some assumptions about nature. It is an aim of this chapter to introduce the reader to the physical and mechanical properties of ice sheets, so that they may judge for themselves the validity of the assumptions made throughout the remainder of the book.
Vernon A. Squire   +3 more
openaire   +1 more source

Time Deflection Behaviour of Ice Plates

1986
In analyzing ice plates it has been customary to use rather simple material models. In this paper a theory for viscoelastic plates is presented which uses a more realistic nonlinear constitutive law for ice, incorporating the most recent experimental data and including all three stages of creep and hereditary effects.
W. Szyszkowski, P. G. Glockner
openaire   +1 more source

Advanced plating photoresist development for advanced IC packages

2015 16th International Conference on Electronic Packaging Technology (ICEPT), 2015
The advanced IC packaging technologies such as 3D-TSV, 2.5D interposer, PoP and Flip-Chip wafer micro-bumping are being implemented for consumer electronic products like as mobile phones, tablets, and so on. The form factor of consumer product trends toward small and thin which driving IC packaging toward smaller, thinner and more complicated.
Hirokazu Sakakibara   +7 more
openaire   +1 more source

Home - About - Disclaimer - Privacy