Results 181 to 190 of about 258,982 (205)
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Ultrasonic Spectroscopy for Simulated Plastic IC Packages
ASME 1997 Turbo Asia Conference, 1997Failure analysis of integrated circuit (IC) packages is a critical element for in house quality control and for problems encountered in service. Plastic IC packages are routinely inspected for delaminations, voids, cracks, and corrosion using the C-mode acoustic microscopy (C-AM). Plastic IC packages are hygroscopic and can absorb moisture subjected to
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Antarctic Landfast Sea Ice: A Review of Its Physics, Biogeochemistry and Ecology
Reviews of Geophysics, 2023Alexander D Fraser +2 more
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Ice‐Nucleating Particles That Impact Clouds and Climate: Observational and Modeling Research Needs
Reviews of Geophysics, 2022Susannah Burrows +2 more
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Stability of the Antarctic Ice Sheet during the pre-industrial Holocene
Nature Reviews Earth & Environment, 2022Richard Jones +2 more
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Microbial ecology of the cryosphere: sea ice and glacial habitats
Nature Reviews Microbiology, 2015Antje Boetius +2 more
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Interactions of Atmospheric Trace Gases with Ice Surfaces: Adsorption and Reaction
Chemical Reviews, 2003Jonathan Abbatt
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