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Ultrasonic Spectroscopy for Simulated Plastic IC Packages

ASME 1997 Turbo Asia Conference, 1997
Failure analysis of integrated circuit (IC) packages is a critical element for in house quality control and for problems encountered in service. Plastic IC packages are routinely inspected for delaminations, voids, cracks, and corrosion using the C-mode acoustic microscopy (C-AM). Plastic IC packages are hygroscopic and can absorb moisture subjected to
openaire   +1 more source

Antarctic Landfast Sea Ice: A Review of Its Physics, Biogeochemistry and Ecology

Reviews of Geophysics, 2023
Alexander D Fraser   +2 more
exaly  

Ice‐Nucleating Particles That Impact Clouds and Climate: Observational and Modeling Research Needs

Reviews of Geophysics, 2022
Susannah Burrows   +2 more
exaly  

Stability of the Antarctic Ice Sheet during the pre-industrial Holocene

Nature Reviews Earth & Environment, 2022
Richard Jones   +2 more
exaly  

Microbial ecology of the cryosphere: sea ice and glacial habitats

Nature Reviews Microbiology, 2015
Antje Boetius   +2 more
exaly  

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