Results 1 to 10 of about 1,556,528 (263)

Neural network connectivity by optical broadcasting between III-V nanowires [PDF]

open access: yesNanophotonics
Biological neural network functionality depends on the vast number of connections between nodes, which can be challenging to implement artificially. One radical solution is to replace physical wiring with broadcasting of signals between the artificial ...
Draguns Kristians   +6 more
doaj   +2 more sources

Troy III-V

open access: yesDocumenta Praehistorica, 2023
To investigate the dating of Troy III-V, and in particular to test whether in Blegen's Troy sequence a gap exists between Troy III and Troy IV, 26 bone samples covering Troy III to VIa from the University of Cincinnati excavations were submitted for 14C-
Donald Easton, Bernhard Weninger
doaj   +3 more sources

Recent Advances in the Growth and Compositional Modelling of III–V Nanowire Heterostructures [PDF]

open access: yesNanomaterials
Nanowire heterostructures offer almost unlimited possibilities for the bandgap engineering and monolithic integration of III–V photonics with Si electronics.
Egor D. Leshchenko, Nickolay V. Sibirev
doaj   +2 more sources

Different III-V semiconductor nanowires with quantum dots on silicon: growth by molecular-beam epitaxy and properties [PDF]

open access: yesНаучно-технический вестник информационных технологий, механики и оптики, 2021
Recently, III-V semiconductor nanostructures of reduced dimension attract more and more interest of researchers for the new generation devices creation.
Rodion R. Reznik   +5 more
doaj   +1 more source

Low-Threshold, High-Power On-Chip Tunable III-V/Si Lasers with Integrated Semiconductor Optical Amplifiers

open access: yesApplied Sciences, 2021
Heterogeneously integrated III-V/Si lasers and semiconductor optical amplifiers (SOAs) are key devices for integrated photonics applications requiring miniaturized on-chip light sources, such as in optical communications, sensing, or spectroscopy.
Joan Manel Ramírez   +10 more
doaj   +1 more source

Synthetic strategy and structures of [Cr(CN)6]3−, [Mo(CN)8]3− and [W(CN)8]3− bridged di- and poly-nuclear transition metal-salen complexes: A review

open access: yesResults in Chemistry, 2022
The cyanide groups of [Cr(CN)6]3−, [Mo(CN)8]3− and [W(CN)8]3− may be used to bridge several mono-nuclear transition metal-salen complexes to form different di-, tri-, tetra- hexa- and poly-nuclear complexes of different molecular architectures.
Sk. Jiyaur Rahaman   +1 more
doaj   +1 more source

Epitaxy and characterization of InP/InGaAs tandem solar cells grown by MOVPE on InP and Si substrates

open access: yesEPJ Photovoltaics, 2023
The integration of III-V multi-junction solar cells on Si substrates is currently one of the most promising possibilities to combine high photovoltaic performance with a reduction of the manufacturing costs.
Soresi Stefano   +12 more
doaj   +1 more source

Revealing of InP multi-layer stacks from KPFM measurements in the dark and under illumination

open access: yesEPJ Photovoltaics, 2022
Solar cells are complex devices, being constituted of many layers and interfaces. The study and the comprehension of the mechanisms that take place at the interfaces is crucial for efficiency improvement. This paper applies Kelvin probe force microscopy (
da Lisca Mattia   +6 more
doaj   +1 more source

AlGaInAs Multi-Quantum Well Lasers on Silicon-on-Insulator Photonic Integrated Circuits Based on InP-Seed-Bonding and Epitaxial Regrowth

open access: yesApplied Sciences, 2021
The tremendous demand for low-cost, low-consumption and high-capacity optical transmitters in data centers challenges the current InP-photonics platform.
Claire Besancon   +12 more
doaj   +1 more source

0.7- $\mu$ m InP DHBT Technology With 400-GHz ${f}_{{T}}$ and ${f}_{\text{MAX}}$ and 4.5-V BVCE0 for High Speed and High Frequency Integrated Circuits

open access: yesIEEE Journal of the Electron Devices Society, 2019
We report the performances of a 0.7-μm InP/GaInAs DHBT developed in III-V Lab demonstrating both fT and f MAX of 400 GHz as well as a high fabrication yield and homogeneity on a 3-inch wafer.
V. Nodjiadjim   +6 more
doaj   +1 more source

Home - About - Disclaimer - Privacy