Results 251 to 260 of about 227,176 (341)

Strain Amplification via Helically Braided Fiber Reinforced Sleeve for Soft Material Energy Harvesting

Advanced Materials Technologies, EarlyView.
This study presents a braided fiber‐reinforced sleeve that amplifies strain in soft materials, enhancing their performance in stretchable devices like sensors and energy harvesters. By reinforcing and elongating encased materials, the sleeve increases the “effective” strain.
Emily Duan, Syed Ahmed Jaseem, Jeong Yong Kim, Michael D. Dickey, Matthew Bryant   +4 more
wiley   +1 more source

Simple Nuclear Reactions of Indium with 30- and 2.9-GeV Protons

, 1962
N. T. Porile
openalex   +2 more sources

Computational and experimental approach for investigating the microstructural parameters of a cadmium indium selenide (α-CdIn₂Se₄) ternary semiconducting compound. [PDF]

RSC Adv
Dhruv SD, Sharko SA, Serokurova AI, Novitskii NN, Goroshko DL, Rayani P, Jangale J, Agrawal N, Solanki V, Markna JH, Kataria B, Dhruv DK.   +11 more
europepmc   +1 more source

Enhanced Sensitivity in Low‐Energy Inverse Photoemission Spectroscopy with an Off‐Axis Parabolic Mirror for Efficient Light Collection

Advanced Materials Technologies, EarlyView.
This study presents an enhancement in the sensitivity of inverse photoemission spectroscopy (IPES) by more than 20 times by utilizing a custom‐made off‐axis parabolic mirror for improved light collection. Combined with ultraviolet photoemission spectroscopy (UPS), the enhanced sensitivity of our IPES setup allows for comprehensive mapping of interface ...
Jong‐Am Hong, Kyu‐Myung Lee, Min‐Jae Maeng, Yongsup Park   +3 more
wiley   +1 more source

Effect of Indium Addition on the Aging Properties of Cu-Be Alloys

, 1964
Masataka Sugiyama, Takashi Furukawa
openalex   +2 more sources

High-Performance Vacuum-Free Processed Organic Solar Cells with Gallium-Based Liquid Metal Top Electrodes. [PDF]

Materials (Basel)
Hu R, Xie D, Jin Y, Ren X, Huang X, Ji Y, Liu X, Yang X, Huang W.   +8 more
europepmc   +1 more source

Magnetic Force‐Induced Self‐Assembly and Flip‐Chip Alignment on Electroplated Multilayer Solder with Tailored Melting Points

Advanced Materials Technologies, EarlyView.
This work demonstrates fluidic self‐assembly and self‐alignment of flip‐chips using a magnetic field for agitation and orientation. Pb‐free solder bumps with tailored transformation imprinted melting points enable selective capturing on low‐melting solder in water. After capturing, final alignment is achieved through magnetic forces.
Mahsa Kaltwasser, Johannes Reiprich, Thomas Stauden, Heiko O. Jacobs   +3 more
wiley   +1 more source

Polarographic and photometric determination of lead, cadmium and zinc in highly pure indium

, 1964
Koichi Nishimura, Teruo Imai
openalex   +2 more sources

The phase stability of InP(001) surfaces upon oxygen exposure from first principles. [PDF]

RSC Adv
Yadav V, Euchner H, May MM.
europepmc   +1 more source