This article presents a novel strategy for creating highly stretchable wireless circuits using electrical metamaterial‐based interconnects (EMIs). Embedded in soft polymers and filled with liquid metal, EMIs uniquely reduce resistance under strain. A fully integrated ECG circuit demonstrates reliable performance under 100% stretch, offering a highly ...
Anan Zhang+2 more
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Anion exchange separation of zinc, cadmium, lead, and indium with thiosulfate eluate
Ryuitiro Sugisita, Katsumi KIMATA
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Computational insights into the physico-chemical properties of pure and single-atom copper-indium sub-nanometre clusters: a DFT-genetic algorithm approach. [PDF]
Alotaibi NO+4 more
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Visible and Infrared Dual‐Band Camouflage Device Using Reflective Display Technology
Integrating electrochromic devices and electrophoretic display technologies has led to developing a flexible dual‐band camouflage device. The system enables adaptive modulation across visible and near‐infrared spectra through pixel‐level control, rapid switching, and bistable operation.
Ju Hyun Park+7 more
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Minimal vertical transport of microplastics in soil over two years with little impact of plastics on soil macropore networks. [PDF]
Schefer RB, Koestel J, Mitrano DM.
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The functionality of flexible polymeric electrochromic devices (ECDs) in high‐temperature environments is crucial for long‐term durability. The thermal stability of ECDs based on a poly(3,4‐ethylenedioxythiophene) derivate and Prussian blue is improved by analyzing the temperature‐dependent electrochemical behavior of the electrodes and the ECDs.
Lisa Brändler+4 more
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Evaluation of Physical Properties of Ti-Doped BiFeO<sub>3</sub> Thin Films Deposited on Fluorine Tin Oxide and Indium Tin Oxide Substrates. [PDF]
Carrasco-Hernández AR+4 more
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How to Manufacture Photonic Metamaterials
Metamaterials boast applications such as invisibility and “hyperlenses” with resolution beyond the diffraction limit, but these applications haven’t been exploited in earnest and the market for them hasn’t grown much likely because facile and economical methods for fabricating them without defect has not emerged.
Apurba Paul, Gregory Timp
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Improvement of Electrical Transport Performance of BiSbTeSe<sub>2</sub> by Elemental Doping. [PDF]
Zhu P+7 more
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Silicon‐Integrated Next‐Generation Plasmonic Devices for Energy‐Efficient Semiconductor Applications
Silicon (Si)‐integrated plasmonics offer a pathway to next‐generation, energy‐efficient semiconductor applications. This review highlights advances using complementary metal–oxide–semiconductor (CMOS)‐compatible materials like transparent conductive oxides and novel architectures, particularly coupled hybrid plasmonic waveguides (CHPWs).
Nasir Alfaraj, Amr S. Helmy
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